JPS6138948U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS6138948U JPS6138948U JP1984123004U JP12300484U JPS6138948U JP S6138948 U JPS6138948 U JP S6138948U JP 1984123004 U JP1984123004 U JP 1984123004U JP 12300484 U JP12300484 U JP 12300484U JP S6138948 U JPS6138948 U JP S6138948U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- header
- semiconductor chip
- semiconductor equipment
- wire connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は本考案装置の平面図、第２図は第１図中のＡ−
Ａ’断面図、第３図は従来装置の平面図、第４図は第３
図中の３３−Ｂ’断面図である。 ２０・・・・・・ヘッダ本体、３０・・・・・・半導体
チップ、４０．４１・・・・・・リード、５０．５１・
・・・・・ワイヤ、６０・・・・・・絶縁体。
Ａ’断面図、第３図は従来装置の平面図、第４図は第３
図中の３３−Ｂ’断面図である。 ２０・・・・・・ヘッダ本体、３０・・・・・・半導体
チップ、４０．４１・・・・・・リード、５０．５１・
・・・・・ワイヤ、６０・・・・・・絶縁体。
Claims (1)
- 半導体チップと、該半導体チップを載置するヘッダと、
該ヘッダの貫通孔に絶縁体を介在させて植立されている
リードと、前記半導体チップの電極と前記リードとの間
に接続されているワイヤとを備え、前記ヘツダ内面側の
前記リードと前記ヘツダとの間に熱伝導率の大きい絶縁
体を装着してなることを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984123004U JPS6138948U (ja) | 1984-08-10 | 1984-08-10 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984123004U JPS6138948U (ja) | 1984-08-10 | 1984-08-10 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6138948U true JPS6138948U (ja) | 1986-03-11 |
Family
ID=30681759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984123004U Pending JPS6138948U (ja) | 1984-08-10 | 1984-08-10 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6138948U (ja) |
-
1984
- 1984-08-10 JP JP1984123004U patent/JPS6138948U/ja active Pending
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