JPS6138855B2 - - Google Patents
Info
- Publication number
- JPS6138855B2 JPS6138855B2 JP55106583A JP10658380A JPS6138855B2 JP S6138855 B2 JPS6138855 B2 JP S6138855B2 JP 55106583 A JP55106583 A JP 55106583A JP 10658380 A JP10658380 A JP 10658380A JP S6138855 B2 JPS6138855 B2 JP S6138855B2
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- semiconductor device
- temperature fluid
- aging
- transport rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 72
- 230000032683 aging Effects 0.000 claims description 30
- 239000012530 fluid Substances 0.000 claims description 29
- 230000007246 mechanism Effects 0.000 claims description 20
- 238000005507 spraying Methods 0.000 claims description 16
- 238000003860 storage Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10658380A JPS5731147A (en) | 1980-08-01 | 1980-08-01 | Method and apparatus for aging of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10658380A JPS5731147A (en) | 1980-08-01 | 1980-08-01 | Method and apparatus for aging of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5731147A JPS5731147A (en) | 1982-02-19 |
| JPS6138855B2 true JPS6138855B2 (enrdf_load_stackoverflow) | 1986-09-01 |
Family
ID=14437222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10658380A Granted JPS5731147A (en) | 1980-08-01 | 1980-08-01 | Method and apparatus for aging of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5731147A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109834880A (zh) * | 2019-01-09 | 2019-06-04 | 南阳柯丽尔科技有限公司 | 老化架及热敏胶片老化方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01229947A (ja) * | 1988-03-10 | 1989-09-13 | Seiko Epson Corp | フレキシブル回路基板の位置決め方法 |
| CA2073899A1 (en) * | 1991-07-19 | 1993-01-20 | Tatsuya Hashinaga | Burn-in apparatus and method |
| DE102007047740B4 (de) | 2007-10-05 | 2010-11-04 | Multitest Elektronische Systeme Gmbh | Plunger zum Bewegen elektronischer Bauelemente, insbesondere IC's |
-
1980
- 1980-08-01 JP JP10658380A patent/JPS5731147A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109834880A (zh) * | 2019-01-09 | 2019-06-04 | 南阳柯丽尔科技有限公司 | 老化架及热敏胶片老化方法 |
| CN109834880B (zh) * | 2019-01-09 | 2021-10-22 | 南阳柯丽尔科技有限公司 | 老化架及热敏胶片老化方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5731147A (en) | 1982-02-19 |
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