JPS6135949A - 金属ベ−ス基板の製造方法 - Google Patents
金属ベ−ス基板の製造方法Info
- Publication number
- JPS6135949A JPS6135949A JP16107784A JP16107784A JPS6135949A JP S6135949 A JPS6135949 A JP S6135949A JP 16107784 A JP16107784 A JP 16107784A JP 16107784 A JP16107784 A JP 16107784A JP S6135949 A JPS6135949 A JP S6135949A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- base substrate
- insulating
- tape
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16107784A JPS6135949A (ja) | 1984-07-30 | 1984-07-30 | 金属ベ−ス基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16107784A JPS6135949A (ja) | 1984-07-30 | 1984-07-30 | 金属ベ−ス基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6135949A true JPS6135949A (ja) | 1986-02-20 |
| JPH0447612B2 JPH0447612B2 (enExample) | 1992-08-04 |
Family
ID=15728186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16107784A Granted JPS6135949A (ja) | 1984-07-30 | 1984-07-30 | 金属ベ−ス基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6135949A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021019947A1 (ja) * | 2019-07-30 | 2021-02-04 | Ｊｆｅスチール株式会社 | 高強度鋼板およびその製造方法 |
-
1984
- 1984-07-30 JP JP16107784A patent/JPS6135949A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0447612B2 (enExample) | 1992-08-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5828848A (ja) | 集積回路、半導体デバイスおよびコンポ−ネントの取付方法 | |
| JPS6135949A (ja) | 金属ベ−ス基板の製造方法 | |
| DE59814422D1 (de) | Verfahren zum Herstellen eines Metall-Keramik-Substrates | |
| JPS5843596A (ja) | 印刷配線板 | |
| JPS6019680B2 (ja) | 絶縁板に半田付けする方法 | |
| JPH03112156A (ja) | 混成集積回路装置 | |
| JPS6235692A (ja) | 印刷配線基板 | |
| JPH024143B2 (enExample) | ||
| JPS589390A (ja) | 印刷配線板の製造方法 | |
| JPS62140837A (ja) | 電気回路形成用基盤の製造方法 | |
| JPS6014521B2 (ja) | マイクロ波集積回路 | |
| JPH09165561A (ja) | 導電接着テープ | |
| JPS63173383A (ja) | プリント配線基板用鉄コア−ほうろう基板およびその製造方法 | |
| JPS61193303A (ja) | チツプ状電子部品 | |
| JPS61274396A (ja) | スル−ホ−ル接続形成用金属印刷配線板の製造方法 | |
| JPS6252989A (ja) | 金属ベース両面可撓性回路基板の製造法 | |
| JPS605592A (ja) | 金属ベ−スプリント配線板の製造方法 | |
| JPS60217618A (ja) | プリントコイルパタ−ンの接続方法 | |
| JPS61206635A (ja) | 金属ベース印刷配線板用積層板及びその製造方法 | |
| JPS60206641A (ja) | 回路用基板の製造方法 | |
| JPS63959B2 (enExample) | ||
| JPS59159587A (ja) | 金属ベ−ス印刷回路用積層板及びその製造方法 | |
| JPS6398437A (ja) | 金属ベ−ス基板 | |
| JPS61235150A (ja) | 電気回路配線用基板の製造方法 | |
| JPS61228701A (ja) | マイクロ波集積回路の製造方法 |