JPS6133353U - 高圧カツトアウト用限流ヒユ−ズ - Google Patents

高圧カツトアウト用限流ヒユ−ズ

Info

Publication number
JPS6133353U
JPS6133353U JP8545685U JP8545685U JPS6133353U JP S6133353 U JPS6133353 U JP S6133353U JP 8545685 U JP8545685 U JP 8545685U JP 8545685 U JP8545685 U JP 8545685U JP S6133353 U JPS6133353 U JP S6133353U
Authority
JP
Japan
Prior art keywords
display body
tube
insulating
auxiliary electrode
small hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8545685U
Other languages
English (en)
Other versions
JPS6328512Y2 (ja
Inventor
紀男 染野
俊和 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kouatsu Electric Co
Original Assignee
Nippon Kouatsu Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kouatsu Electric Co filed Critical Nippon Kouatsu Electric Co
Priority to JP8545685U priority Critical patent/JPS6133353U/ja
Publication of JPS6133353U publication Critical patent/JPS6133353U/ja
Application granted granted Critical
Publication of JPS6328512Y2 publication Critical patent/JPS6328512Y2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】 図面は本考案の実施例を示すもので、第１図は本考案の
実施例を示す高圧カットアウト用限流ヒューズの縦断面
図、第２図は組立途中のヒューズの状態を示す一部を破
断した縦断面図、第３図は第２図の右側面図、第４図は
収納筒の組立状態を示す縦断面図、第５図はガイド金具
の左側面図、第６図は第５図のＡ−Ａ断面図、第７図は
補強力バーの縦断面図を示す。 １・・・絶森筒、１ａ・・・下端外面、１ｂ・・・下端
開口部、１ｃ・・・上端開口部、１ｄ・・・絶縁空間、
２・・・巻芯、２ｃ・・・下端、２ｅ・・・上端、３・
・・収納筒、３ｈ・・・係合突出部、６・・・ヒューズ
エレメント、１１・・・表示体、１１Ｃ・・・下端部、
１４・・・下部補助電極、１４ａ・・・係合凹部、１４
ｄ・・・取付部、１４ｄ１・・・内部底面、１４ｄ２・
・・側周面、１４ｄ３・・・外部底面、１５・・・接着
材、１６・・・補強カバー、１６ａ・・・表示体用小穴
、１６ｃ・・・後端、１６ｄ・・・前端、１６ｃ・・・
係合凹部、１７・・・下部電極、１９・・・接着材、２
２・・・上部電極、２２ａ・・・突出部、２２ｃ・・・
内壁面、２４・・・ガイド金具、２２ｂ・・・取付部、
２４ｃ・・・係止部、２５・・・上部補助電極、２７・
・・消弧材。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁筒１内に巻芯２と同巻芯２に捲回したヒューズエレ
    メント■とを密閉収納しその収納したヒューズエレメン
    ト６の両端を絶縁筒１の上下両端外周に固着した上下部
    両電極２２．１７にそれぞれ接続しさらに上記絶縁筒１
    の絶縁空間１ｄには消弧材２７を充填すると共に上記巻
    芯２の下端２Ｃには表示体１１を内装した収納筒３を直
    結しさらに同収納筒３に対し一体に止着した下部補助電
    極１４を絶縁筒１の下端外面１ａに取り付けると共にさ
    らに上記ヒューズエレメント長と下部補助電極１４間を
    絶縁筒１の下端外面１ａに沿って延出してなる同補助電
    極１４と一体の接続導板１８でもって接続するようにし
    た高圧カットアウト用限流ヒューズにおいて、上記絶縁
    筒１の下端外面１ａを覆うように下部電極１７の直近ま
    で袋状の補強カバー１６で被着し、同カバー１６の後端
    １６ｃの中央には表示体用小穴１６ａを設けると共にさ
    らに上記収納筒３に内装し而も同筒３の下端の係合突出
    部３ｈより下方に突出する表示体１１の下端部１１ｃを
    上記表示体用小穴１６ａに対し同下端部１１ｃが同小穴
    ’１６ａより突出しない程度に嵌入させたことを特徴と
    する高圧力ットアウト用限流ヒューズ。
JP8545685U 1985-06-06 1985-06-06 高圧カツトアウト用限流ヒユ−ズ Granted JPS6133353U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8545685U JPS6133353U (ja) 1985-06-06 1985-06-06 高圧カツトアウト用限流ヒユ−ズ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8545685U JPS6133353U (ja) 1985-06-06 1985-06-06 高圧カツトアウト用限流ヒユ−ズ

Publications (2)

Publication Number Publication Date
JPS6133353U true JPS6133353U (ja) 1986-02-28
JPS6328512Y2 JPS6328512Y2 (ja) 1988-08-01

Family

ID=30635869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8545685U Granted JPS6133353U (ja) 1985-06-06 1985-06-06 高圧カツトアウト用限流ヒユ−ズ

Country Status (1)

Country Link
JP (1) JPS6133353U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0181846U (ja) * 1987-11-19 1989-05-31

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1052062A1 (en) 1999-05-03 2000-11-15 Applied Materials, Inc. Pré-conditioning fixed abrasive articles
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49123529U (ja) * 1973-02-17 1974-10-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49123529U (ja) * 1973-02-17 1974-10-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0181846U (ja) * 1987-11-19 1989-05-31

Also Published As

Publication number Publication date
JPS6328512Y2 (ja) 1988-08-01

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