JPS6131611B2 - - Google Patents
Info
- Publication number
- JPS6131611B2 JPS6131611B2 JP657280A JP657280A JPS6131611B2 JP S6131611 B2 JPS6131611 B2 JP S6131611B2 JP 657280 A JP657280 A JP 657280A JP 657280 A JP657280 A JP 657280A JP S6131611 B2 JPS6131611 B2 JP S6131611B2
- Authority
- JP
- Japan
- Prior art keywords
- storage container
- semiconductor substrate
- semiconductor substrates
- opening
- push
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 52
- 239000004065 semiconductor Substances 0.000 claims description 51
- 238000003860 storage Methods 0.000 claims description 40
- 238000001035 drying Methods 0.000 claims description 15
- 238000007664 blowing Methods 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 5
- 230000032258 transport Effects 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 239000007921 spray Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chutes (AREA)
- Feeding Of Articles To Conveyors (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP657280A JPS56103440A (en) | 1980-01-21 | 1980-01-21 | Apparatus for treating semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP657280A JPS56103440A (en) | 1980-01-21 | 1980-01-21 | Apparatus for treating semiconductor substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56103440A JPS56103440A (en) | 1981-08-18 |
JPS6131611B2 true JPS6131611B2 (enrdf_load_stackoverflow) | 1986-07-21 |
Family
ID=11642042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP657280A Granted JPS56103440A (en) | 1980-01-21 | 1980-01-21 | Apparatus for treating semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56103440A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5850740A (ja) * | 1981-09-21 | 1983-03-25 | Hitachi Ltd | 半導体処理装置 |
JPS6014244A (ja) * | 1983-07-06 | 1985-01-24 | Fujitsu Ltd | マスク洗浄装置 |
CN105157388A (zh) * | 2015-10-12 | 2015-12-16 | 苏州达恩克精密机械有限公司 | 芯片组装机的芯片传送烘干装置 |
-
1980
- 1980-01-21 JP JP657280A patent/JPS56103440A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56103440A (en) | 1981-08-18 |
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