JPS6131074B2 - - Google Patents
Info
- Publication number
- JPS6131074B2 JPS6131074B2 JP2448779A JP2448779A JPS6131074B2 JP S6131074 B2 JPS6131074 B2 JP S6131074B2 JP 2448779 A JP2448779 A JP 2448779A JP 2448779 A JP2448779 A JP 2448779A JP S6131074 B2 JPS6131074 B2 JP S6131074B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- soldering
- solder
- ceramics
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 230000004907 flux Effects 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2448779A JPS55116682A (en) | 1979-03-05 | 1979-03-05 | Soldering material for ceranic conjunction |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2448779A JPS55116682A (en) | 1979-03-05 | 1979-03-05 | Soldering material for ceranic conjunction |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55116682A JPS55116682A (en) | 1980-09-08 |
JPS6131074B2 true JPS6131074B2 (ru) | 1986-07-17 |
Family
ID=12139537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2448779A Granted JPS55116682A (en) | 1979-03-05 | 1979-03-05 | Soldering material for ceranic conjunction |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55116682A (ru) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0119649B1 (de) * | 1983-03-04 | 1988-06-01 | Philips Patentverwaltung GmbH | Verfahren zum Verbinden von keramischen Bauteilen miteinander oder mit metallischen Bauteilen |
JPS59164679A (ja) * | 1983-03-10 | 1984-09-17 | 日本特殊陶業株式会社 | セラミツクと金属との接合体 |
JPS6071579A (ja) * | 1983-09-28 | 1985-04-23 | 株式会社日立製作所 | アルミナと金属との接合方法 |
JPS6428284A (en) * | 1987-07-21 | 1989-01-30 | Toshiba Corp | Oxide superconducting joint |
JP2651847B2 (ja) * | 1988-08-08 | 1997-09-10 | スカイアルミニウム株式会社 | セラミックス接合用アルミニウム合金 |
JPH0333074A (ja) * | 1989-06-28 | 1991-02-13 | Ngk Insulators Ltd | セラミックスとAlの鑞着構体及びその製造方法 |
JPH0649618B2 (ja) * | 1990-06-14 | 1994-06-29 | 科学技術庁金属材料技術研究所長 | アルミニウムまたはアルミナセラミックスの拡散接合法 |
JP5910166B2 (ja) * | 2012-02-29 | 2016-04-27 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
JP2015188119A (ja) * | 2015-07-31 | 2015-10-29 | コメット アクチェンゲゼルシャフト | 真空可変コンデンサ |
-
1979
- 1979-03-05 JP JP2448779A patent/JPS55116682A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS55116682A (en) | 1980-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3220635B2 (ja) | はんだ合金及びクリームはんだ | |
CA2332587A1 (en) | Leadless solder | |
KR101986557B1 (ko) | Sn-Cu계 납프리 땜납 합금 | |
JP3832151B2 (ja) | 鉛フリーはんだ接続構造体 | |
JPS6131074B2 (ru) | ||
JPH02179390A (ja) | クラスト防止元素を含有する銀‐銅‐チタンろう接用合金 | |
JP2722917B2 (ja) | 高温はんだ | |
JPH05508113A (ja) | 酸化物層形成金属および合金用のハンダ | |
JP3643008B2 (ja) | はんだ付け方法 | |
JPH09295182A (ja) | クリームはんだ | |
KR20140030175A (ko) | 알루미늄계 재료의 경납땜 플럭스 | |
JP3398203B2 (ja) | アルミニウム合金と銅の接合用ろう材およびこのろう材によって接合された複合材 | |
JPH0219760B2 (ru) | ||
US4647308A (en) | Soldering compositions, fluxes and methods of use | |
TWI760470B (zh) | 無鉛焊料合金及軟焊接合 | |
JP2004358539A (ja) | 高温ろう材 | |
JPS5844635B2 (ja) | 金属と超硬質人造材料とをろう接する方法およびそのためのろう接剤 | |
JPS6350119B2 (ru) | ||
JPH0679494A (ja) | 金属接合用Zn基合金 | |
JPH0574552B2 (ru) | ||
JPH06226489A (ja) | 金属接合用材料とそれを用いた接合部品の接合方法 | |
JPH0796387A (ja) | Al接合用材料とそれを用いた接合部品の接合方法 | |
JPS6362319B2 (ru) | ||
JPH10130069A (ja) | アルミナセラミックスとアルミニウムとの接合方法 | |
JPS5818419B2 (ja) | ガラスヨウハンダ |