JPH0574552B2 - - Google Patents
Info
- Publication number
- JPH0574552B2 JPH0574552B2 JP63165816A JP16581688A JPH0574552B2 JP H0574552 B2 JPH0574552 B2 JP H0574552B2 JP 63165816 A JP63165816 A JP 63165816A JP 16581688 A JP16581688 A JP 16581688A JP H0574552 B2 JPH0574552 B2 JP H0574552B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic
- titanium
- weight
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 155
- 239000002184 metal Substances 0.000 claims description 155
- 238000005219 brazing Methods 0.000 claims description 110
- 239000000919 ceramic Substances 0.000 claims description 91
- 239000000945 filler Substances 0.000 claims description 71
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 64
- 239000010936 titanium Substances 0.000 claims description 64
- 229910052719 titanium Inorganic materials 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 43
- 238000005304 joining Methods 0.000 claims description 28
- -1 titanium hydride Chemical compound 0.000 claims description 25
- 229910000048 titanium hydride Inorganic materials 0.000 claims description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 24
- 229910052709 silver Inorganic materials 0.000 claims description 24
- 239000004332 silver Substances 0.000 claims description 24
- 230000004907 flux Effects 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 23
- 230000008018 melting Effects 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 19
- 229910052797 bismuth Inorganic materials 0.000 claims description 14
- 229910052718 tin Inorganic materials 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 239000000843 powder Substances 0.000 description 31
- 229910045601 alloy Inorganic materials 0.000 description 30
- 239000000956 alloy Substances 0.000 description 30
- 150000002739 metals Chemical class 0.000 description 11
- 230000003647 oxidation Effects 0.000 description 10
- 238000007254 oxidation reaction Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000004898 kneading Methods 0.000 description 7
- 239000000155 melt Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 5
- 229910017944 Ag—Cu Inorganic materials 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000004678 hydrides Chemical class 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910017945 Cu—Ti Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007712 rapid solidification Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910004353 Ti-Cu Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16581688A JPH0215874A (ja) | 1988-07-05 | 1988-07-05 | 金属とセラミックの接合方法及び接合材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16581688A JPH0215874A (ja) | 1988-07-05 | 1988-07-05 | 金属とセラミックの接合方法及び接合材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0215874A JPH0215874A (ja) | 1990-01-19 |
| JPH0574552B2 true JPH0574552B2 (ru) | 1993-10-18 |
Family
ID=15819541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16581688A Granted JPH0215874A (ja) | 1988-07-05 | 1988-07-05 | 金属とセラミックの接合方法及び接合材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215874A (ru) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5364010A (en) * | 1990-07-05 | 1994-11-15 | The Morgan Crucible Company, Plc | Joining of metal to ceramic bodies by brazing |
| US5695861A (en) * | 1995-10-18 | 1997-12-09 | Cts Corporation | Solder active braze |
| JP4812985B2 (ja) * | 2001-08-23 | 2011-11-09 | 電気化学工業株式会社 | セラミック体と銅板の接合方法 |
| CH708666A1 (de) * | 2013-10-08 | 2015-04-15 | Kistler Holding Ag | Verfahren zur Herstellung einer Metall-Keramiklötverbindung. |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6471592A (en) * | 1987-09-11 | 1989-03-16 | Nikon Corp | Ceramics-metal joining material |
-
1988
- 1988-07-05 JP JP16581688A patent/JPH0215874A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0215874A (ja) | 1990-01-19 |
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