JPS6131074B2 - - Google Patents
Info
- Publication number
- JPS6131074B2 JPS6131074B2 JP2448779A JP2448779A JPS6131074B2 JP S6131074 B2 JPS6131074 B2 JP S6131074B2 JP 2448779 A JP2448779 A JP 2448779A JP 2448779 A JP2448779 A JP 2448779A JP S6131074 B2 JPS6131074 B2 JP S6131074B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- soldering
- solder
- ceramics
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 230000004907 flux Effects 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2448779A JPS55116682A (en) | 1979-03-05 | 1979-03-05 | Soldering material for ceranic conjunction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2448779A JPS55116682A (en) | 1979-03-05 | 1979-03-05 | Soldering material for ceranic conjunction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55116682A JPS55116682A (en) | 1980-09-08 |
| JPS6131074B2 true JPS6131074B2 (https=) | 1986-07-17 |
Family
ID=12139537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2448779A Granted JPS55116682A (en) | 1979-03-05 | 1979-03-05 | Soldering material for ceranic conjunction |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55116682A (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59164679A (ja) * | 1983-03-10 | 1984-09-17 | 日本特殊陶業株式会社 | セラミツクと金属との接合体 |
| JPS6071579A (ja) * | 1983-09-28 | 1985-04-23 | 株式会社日立製作所 | アルミナと金属との接合方法 |
| JPS6428284A (en) * | 1987-07-21 | 1989-01-30 | Toshiba Corp | Oxide superconducting joint |
| JP2651847B2 (ja) * | 1988-08-08 | 1997-09-10 | スカイアルミニウム株式会社 | セラミックス接合用アルミニウム合金 |
| JPH0333074A (ja) * | 1989-06-28 | 1991-02-13 | Ngk Insulators Ltd | セラミックスとＡｌの鑞着構体及びその製造方法 |
| JPH0649618B2 (ja) * | 1990-06-14 | 1994-06-29 | 科学技術庁金属材料技術研究所長 | アルミニウムまたはアルミナセラミックスの拡散接合法 |
| JP5910166B2 (ja) * | 2012-02-29 | 2016-04-27 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
| JP2015188119A (ja) * | 2015-07-31 | 2015-10-29 | コメット アクチェンゲゼルシャフト | 真空可変コンデンサ |
-
1979
- 1979-03-05 JP JP2448779A patent/JPS55116682A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55116682A (en) | 1980-09-08 |
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