JPS6130732B2 - - Google Patents

Info

Publication number
JPS6130732B2
JPS6130732B2 JP54102237A JP10223779A JPS6130732B2 JP S6130732 B2 JPS6130732 B2 JP S6130732B2 JP 54102237 A JP54102237 A JP 54102237A JP 10223779 A JP10223779 A JP 10223779A JP S6130732 B2 JPS6130732 B2 JP S6130732B2
Authority
JP
Japan
Prior art keywords
wafer
wafer support
temperature
heat block
support stand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54102237A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5626437A (en
Inventor
Seiichi Iwamatsu
Kenichi Asanami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHO ERU ESU AI GIJUTSU KENKYU KUMIAI
Original Assignee
CHO ERU ESU AI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHO ERU ESU AI GIJUTSU KENKYU KUMIAI filed Critical CHO ERU ESU AI GIJUTSU KENKYU KUMIAI
Priority to JP10223779A priority Critical patent/JPS5626437A/ja
Publication of JPS5626437A publication Critical patent/JPS5626437A/ja
Publication of JPS6130732B2 publication Critical patent/JPS6130732B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP10223779A 1979-08-13 1979-08-13 Wafer supporting base Granted JPS5626437A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10223779A JPS5626437A (en) 1979-08-13 1979-08-13 Wafer supporting base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10223779A JPS5626437A (en) 1979-08-13 1979-08-13 Wafer supporting base

Publications (2)

Publication Number Publication Date
JPS5626437A JPS5626437A (en) 1981-03-14
JPS6130732B2 true JPS6130732B2 (enrdf_load_stackoverflow) 1986-07-15

Family

ID=14322022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10223779A Granted JPS5626437A (en) 1979-08-13 1979-08-13 Wafer supporting base

Country Status (1)

Country Link
JP (1) JPS5626437A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57169244A (en) * 1981-04-13 1982-10-18 Canon Inc Temperature controller for mask and wafer
DE3306999A1 (de) * 1982-03-31 1983-10-06 Censor Patent Versuch Einrichtung zum festhalten eines werkstueckes
JPS5946030A (ja) * 1982-09-08 1984-03-15 Canon Inc ウェハの吸着固定方法
JPS60117667U (ja) * 1984-01-17 1985-08-08 松下電器産業株式会社 クラツチモ−タ
JPH05251544A (ja) * 1992-03-05 1993-09-28 Fujitsu Ltd 搬送装置
US6072157A (en) 1998-12-11 2000-06-06 Euv Llc Thermophoretic vacuum wand
KR101866719B1 (ko) 2010-12-20 2018-06-11 에베 그룹 에. 탈너 게엠베하 웨이퍼의 장착을 위한 수용 수단
CN102310262A (zh) * 2011-08-23 2012-01-11 南通富士通微电子股份有限公司 加热块装置

Also Published As

Publication number Publication date
JPS5626437A (en) 1981-03-14

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