JPS6129547B2 - - Google Patents

Info

Publication number
JPS6129547B2
JPS6129547B2 JP55074483A JP7448380A JPS6129547B2 JP S6129547 B2 JPS6129547 B2 JP S6129547B2 JP 55074483 A JP55074483 A JP 55074483A JP 7448380 A JP7448380 A JP 7448380A JP S6129547 B2 JPS6129547 B2 JP S6129547B2
Authority
JP
Japan
Prior art keywords
external lead
external
lead
brazing material
metallized layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55074483A
Other languages
English (en)
Japanese (ja)
Other versions
JPS571250A (en
Inventor
Shinzo Anazawa
Hideaki Kozu
Akyoshi Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
NEC Corp
Original Assignee
Kyocera Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp, Nippon Electric Co Ltd filed Critical Kyocera Corp
Priority to JP7448380A priority Critical patent/JPS571250A/ja
Publication of JPS571250A publication Critical patent/JPS571250A/ja
Publication of JPS6129547B2 publication Critical patent/JPS6129547B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP7448380A 1980-06-03 1980-06-03 Equipping structure of outside lead Granted JPS571250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7448380A JPS571250A (en) 1980-06-03 1980-06-03 Equipping structure of outside lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7448380A JPS571250A (en) 1980-06-03 1980-06-03 Equipping structure of outside lead

Publications (2)

Publication Number Publication Date
JPS571250A JPS571250A (en) 1982-01-06
JPS6129547B2 true JPS6129547B2 (https=) 1986-07-07

Family

ID=13548562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7448380A Granted JPS571250A (en) 1980-06-03 1980-06-03 Equipping structure of outside lead

Country Status (1)

Country Link
JP (1) JPS571250A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030550U (ja) * 1983-08-09 1985-03-01 富士電機株式会社 半導体装置
US5025348A (en) * 1987-11-20 1991-06-18 Casio Computer Co., Ltd. Bonding structure of an electronic device and a method for manufacturing the same
JPH0247058U (https=) * 1988-09-27 1990-03-30
JP6375584B2 (ja) * 2014-03-31 2018-08-22 住友電工デバイス・イノベーション株式会社 電子部品搭載用パッケージ

Also Published As

Publication number Publication date
JPS571250A (en) 1982-01-06

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