JPS61292949A - 電力用半導体モジユ−ル - Google Patents

電力用半導体モジユ−ル

Info

Publication number
JPS61292949A
JPS61292949A JP61135113A JP13511386A JPS61292949A JP S61292949 A JPS61292949 A JP S61292949A JP 61135113 A JP61135113 A JP 61135113A JP 13511386 A JP13511386 A JP 13511386A JP S61292949 A JPS61292949 A JP S61292949A
Authority
JP
Japan
Prior art keywords
holding member
semiconductor module
power semiconductor
case
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61135113A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0571183B2 (cg-RX-API-DMAC10.html
Inventor
アルノ・ナイデイヒ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Germany
Original Assignee
Brown Boveri und Cie AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brown Boveri und Cie AG Germany filed Critical Brown Boveri und Cie AG Germany
Publication of JPS61292949A publication Critical patent/JPS61292949A/ja
Publication of JPH0571183B2 publication Critical patent/JPH0571183B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H10W76/15—
    • H10W76/40—
    • H10W76/47—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H10W72/07336—
    • H10W72/07636—
    • H10W72/07653—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/646—
    • H10W72/652—
    • H10W72/871—
    • H10W74/00—
    • H10W90/734—
    • H10W90/764—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP61135113A 1985-06-15 1986-06-12 電力用半導体モジユ−ル Granted JPS61292949A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3521572.0 1985-06-15
DE19853521572 DE3521572A1 (de) 1985-06-15 1985-06-15 Leistungshalbleitermodul mit keramiksubstrat

Publications (2)

Publication Number Publication Date
JPS61292949A true JPS61292949A (ja) 1986-12-23
JPH0571183B2 JPH0571183B2 (cg-RX-API-DMAC10.html) 1993-10-06

Family

ID=6273418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61135113A Granted JPS61292949A (ja) 1985-06-15 1986-06-12 電力用半導体モジユ−ル

Country Status (4)

Country Link
US (1) US4731644A (cg-RX-API-DMAC10.html)
EP (1) EP0205746B1 (cg-RX-API-DMAC10.html)
JP (1) JPS61292949A (cg-RX-API-DMAC10.html)
DE (2) DE3521572A1 (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223180A (ja) * 1999-02-01 2000-08-11 Semikron Elektron Gmbh プレッシャ―コンタクティングにおけるコンバ―タ
JP2009530826A (ja) * 2006-03-17 2009-08-27 インターナショナル レクティファイアー コーポレイション 改良されたチップスケールパッケージ
JP2010245137A (ja) * 2009-04-02 2010-10-28 Mitsubishi Electric Corp パワーモジュール

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3604882A1 (de) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung des moduls
DE3717489A1 (de) * 1987-05-23 1988-12-01 Asea Brown Boveri Leistungshalbleitermodul und verfahren zur herstellung des moduls
US5219795A (en) * 1989-02-07 1993-06-15 Fujitsu Limited Dual in-line packaging and method of producing the same
US4994890A (en) * 1989-11-27 1991-02-19 Snap-On Tools Corporation Rectifier structure with individual links
FR2660826A1 (fr) * 1990-04-05 1991-10-11 Mcb Sa Boitier economique pour composants electroniques de puissance, a fixer sur dissipateur thermique et son procede de fabrication.
US5243217A (en) * 1990-11-03 1993-09-07 Fuji Electric Co., Ltd. Sealed semiconductor device with protruding portion
JPH04312962A (ja) * 1991-03-18 1992-11-04 Mitsubishi Electric Corp 液体封止半導体装置及びその組立方法
DE4111247C3 (de) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Schaltungsanordnung
US5220197A (en) * 1991-07-22 1993-06-15 Silicon Power Corporation Single inline packaged solid state relay with high current density capability
US5134094A (en) * 1991-07-22 1992-07-28 Silicon Power Corporation Single inline packaged solid state relay with high current density capability
DE4131200C2 (de) * 1991-09-19 1995-05-11 Export Contor Ausenhandelsgese Schaltungsanordnung
DE4222973A1 (de) * 1992-07-13 1994-01-20 Asea Brown Boveri Bidirektionaler Halbleiterschalter
JP2956363B2 (ja) * 1992-07-24 1999-10-04 富士電機株式会社 パワー半導体装置
US5313091A (en) * 1992-09-28 1994-05-17 Sundstrand Corporation Package for a high power electrical component
DE4237632A1 (de) * 1992-11-07 1994-05-11 Export Contor Ausenhandelsgese Schaltungsanordnung
US5465481A (en) * 1993-10-04 1995-11-14 Motorola, Inc. Method for fabricating a semiconductor package
DE4446527A1 (de) * 1994-12-24 1996-06-27 Ixys Semiconductor Gmbh Leistungshalbleitermodul
US5748456A (en) * 1995-11-24 1998-05-05 Asea Brown Boveri Ag Power semiconductor module system
US5705848A (en) * 1995-11-24 1998-01-06 Asea Brown Boveri Ag Power semiconductor module having a plurality of submodules
US5805427A (en) * 1996-02-14 1998-09-08 Olin Corporation Ball grid array electronic package standoff design
DE19615481C5 (de) * 1996-04-03 2013-03-14 Curamik Electronics Gmbh Gewölbtes Metall-Keramik-Substrat
DE19722355A1 (de) * 1997-05-28 1998-12-03 Bosch Gmbh Robert Verfahren zur Herstellung elektrischer Baugruppen und elektrische Baugruppe
DE19726534A1 (de) * 1997-06-23 1998-12-24 Asea Brown Boveri Leistungshalbleitermodul mit geschlossenen Submodulen
US6060795A (en) * 1998-03-18 2000-05-09 Intersil Corporation Semiconductor power pack
DE19942770A1 (de) 1999-09-08 2001-03-15 Ixys Semiconductor Gmbh Leistungshalbleiter-Modul
DE10213648B4 (de) 2002-03-27 2011-12-15 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
US7696532B2 (en) * 2004-12-16 2010-04-13 Abb Research Ltd Power semiconductor module
DE102006005445A1 (de) * 2006-02-07 2007-08-16 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
DE102006021018B4 (de) 2006-05-05 2014-08-14 Wabco Gmbh Induktiver Sensor
EP2019424B1 (de) 2007-07-26 2016-11-23 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleitermodul mit Dichteinrichtung zum Substratträger und Herstellungsverfahren hierzu
US7768109B2 (en) * 2007-08-24 2010-08-03 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
CN101855723B (zh) * 2007-11-13 2012-04-25 西门子公司 功率半导体模块
DE102011086048A1 (de) 2011-04-07 2012-10-11 Continental Teves Ag & Co. Ohg Gehäuseseitige Trennschicht zur Stressentkopplung von vergossenen Elektroniken
US8482908B2 (en) 2011-10-14 2013-07-09 Badger Meter, Inc. Electronic meter register and method having a bottom formed by sealing material
DE102012222015B4 (de) * 2012-11-30 2019-07-18 Infineon Technologies Ag Feuchtigkeitsdichtes Halbleitermodul und ein Verfahren zu dessen Herstellung
US10399256B1 (en) * 2018-04-17 2019-09-03 Goodrich Corporation Sealed circuit card assembly

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1213726A (en) * 1968-01-26 1970-11-25 Ferranti Ltd Improvements relating to electrical circuit assemblies
JPS51292B1 (cg-RX-API-DMAC10.html) * 1968-09-11 1976-01-07
US4117508A (en) * 1977-03-21 1978-09-26 General Electric Company Pressurizable semiconductor pellet assembly
DE2944614C2 (de) * 1979-11-05 1986-10-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Vergießen eines Halbleiterbauelements
DE3028178C2 (de) * 1980-07-25 1985-05-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleiter-Modul
DE3127457C2 (de) * 1981-07-11 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul
FR2516702A1 (fr) * 1981-11-18 1983-05-20 Dassault Electronique Boitier pour circuits electroniques
DE3232154A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleitermodul
US4568962A (en) * 1982-11-08 1986-02-04 Motorola, Inc. Plastic encapsulated semiconductor power device means and method
DE3241508A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
JPS59181627A (ja) * 1983-03-31 1984-10-16 Toshiba Corp 半導体装置の製造方法
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
DE3323246A1 (de) * 1983-06-28 1985-01-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223180A (ja) * 1999-02-01 2000-08-11 Semikron Elektron Gmbh プレッシャ―コンタクティングにおけるコンバ―タ
JP2009530826A (ja) * 2006-03-17 2009-08-27 インターナショナル レクティファイアー コーポレイション 改良されたチップスケールパッケージ
JP2010245137A (ja) * 2009-04-02 2010-10-28 Mitsubishi Electric Corp パワーモジュール

Also Published As

Publication number Publication date
US4731644A (en) 1988-03-15
EP0205746B1 (de) 1990-02-07
EP0205746A2 (de) 1986-12-30
EP0205746A3 (en) 1987-07-22
DE3669017D1 (de) 1990-03-15
JPH0571183B2 (cg-RX-API-DMAC10.html) 1993-10-06
DE3521572A1 (de) 1986-12-18

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