JPH0374035B2 - - Google Patents

Info

Publication number
JPH0374035B2
JPH0374035B2 JP58181286A JP18128683A JPH0374035B2 JP H0374035 B2 JPH0374035 B2 JP H0374035B2 JP 58181286 A JP58181286 A JP 58181286A JP 18128683 A JP18128683 A JP 18128683A JP H0374035 B2 JPH0374035 B2 JP H0374035B2
Authority
JP
Japan
Prior art keywords
electrodes
semiconductor element
electrode
connection terminal
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58181286A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6074462A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58181286A priority Critical patent/JPS6074462A/ja
Priority to DE84110766T priority patent/DE3486256T2/de
Priority to EP19840110766 priority patent/EP0138048B1/en
Priority to US06/650,107 priority patent/US4694322A/en
Publication of JPS6074462A publication Critical patent/JPS6074462A/ja
Publication of JPH0374035B2 publication Critical patent/JPH0374035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W40/611—
    • H10W40/625—

Landscapes

  • Die Bonding (AREA)
JP58181286A 1983-09-29 1983-09-29 半導体装置 Granted JPS6074462A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP58181286A JPS6074462A (ja) 1983-09-29 1983-09-29 半導体装置
DE84110766T DE3486256T2 (de) 1983-09-29 1984-09-10 Halbleiteranordnung in Druckpackung.
EP19840110766 EP0138048B1 (en) 1983-09-29 1984-09-10 Press-packed semiconductor device
US06/650,107 US4694322A (en) 1983-09-29 1984-09-13 Press-packed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58181286A JPS6074462A (ja) 1983-09-29 1983-09-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS6074462A JPS6074462A (ja) 1985-04-26
JPH0374035B2 true JPH0374035B2 (cg-RX-API-DMAC10.html) 1991-11-25

Family

ID=16098031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58181286A Granted JPS6074462A (ja) 1983-09-29 1983-09-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS6074462A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006014582B4 (de) * 2006-03-29 2011-09-15 Infineon Technologies Ag Halbleitermodul
CN208093538U (zh) * 2015-08-25 2018-11-13 英飞凌科技有限两合公司 具有构成盆体的压力板的功率半导体组件模块

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52110342A (en) * 1976-03-11 1977-09-16 Nissan Motor Co Ltd Fuel-air ratio control device for internal-combustion engine
DE2617335A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Halbleiterbauelement
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
DE2942409A1 (de) * 1979-10-19 1981-04-23 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren halbleiterkoerpern
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
JPS5724749U (cg-RX-API-DMAC10.html) * 1980-07-15 1982-02-08
DE3142576A1 (de) * 1981-10-27 1983-05-05 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit durch druck kontaktierbaren halbleiterkoerpern

Also Published As

Publication number Publication date
JPS6074462A (ja) 1985-04-26

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