JPS61292393A - セラミック多層配線基板用酸化第二銅混練物 - Google Patents

セラミック多層配線基板用酸化第二銅混練物

Info

Publication number
JPS61292393A
JPS61292393A JP60134542A JP13454285A JPS61292393A JP S61292393 A JPS61292393 A JP S61292393A JP 60134542 A JP60134542 A JP 60134542A JP 13454285 A JP13454285 A JP 13454285A JP S61292393 A JPS61292393 A JP S61292393A
Authority
JP
Japan
Prior art keywords
paste
copper oxide
cuo
wiring board
ceramic wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60134542A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0554718B2 (enExample
Inventor
勉 西村
誠一 中谷
徹 石田
聖 祐伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60134542A priority Critical patent/JPS61292393A/ja
Priority to KR1019860004701A priority patent/KR900008781B1/ko
Priority to US06/875,083 priority patent/US4695403A/en
Publication of JPS61292393A publication Critical patent/JPS61292393A/ja
Publication of JPH0554718B2 publication Critical patent/JPH0554718B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Conductive Materials (AREA)
JP60134542A 1985-06-17 1985-06-20 セラミック多層配線基板用酸化第二銅混練物 Granted JPS61292393A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP60134542A JPS61292393A (ja) 1985-06-20 1985-06-20 セラミック多層配線基板用酸化第二銅混練物
KR1019860004701A KR900008781B1 (ko) 1985-06-17 1986-06-13 후막도체조성물
US06/875,083 US4695403A (en) 1985-06-17 1986-06-17 Thick film conductor composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60134542A JPS61292393A (ja) 1985-06-20 1985-06-20 セラミック多層配線基板用酸化第二銅混練物

Publications (2)

Publication Number Publication Date
JPS61292393A true JPS61292393A (ja) 1986-12-23
JPH0554718B2 JPH0554718B2 (enExample) 1993-08-13

Family

ID=15130750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60134542A Granted JPS61292393A (ja) 1985-06-17 1985-06-20 セラミック多層配線基板用酸化第二銅混練物

Country Status (1)

Country Link
JP (1) JPS61292393A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894184A (en) * 1986-08-27 1990-01-16 The Furukawa Electric Co., Ltd. Low-temperature burnt conductive paste and method of manufacturing printed circuit board
US5120473A (en) * 1987-10-12 1992-06-09 Ngk Spark Plug Co., Ltd. Metallizing composition for use with ceramics

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052096A (ja) * 1983-08-31 1985-03-23 松下電工株式会社 セラミックス回路基板の製法
JPS6126293A (ja) * 1984-07-17 1986-02-05 松下電器産業株式会社 セラミック多層配線基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052096A (ja) * 1983-08-31 1985-03-23 松下電工株式会社 セラミックス回路基板の製法
JPS6126293A (ja) * 1984-07-17 1986-02-05 松下電器産業株式会社 セラミック多層配線基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894184A (en) * 1986-08-27 1990-01-16 The Furukawa Electric Co., Ltd. Low-temperature burnt conductive paste and method of manufacturing printed circuit board
US5120473A (en) * 1987-10-12 1992-06-09 Ngk Spark Plug Co., Ltd. Metallizing composition for use with ceramics

Also Published As

Publication number Publication date
JPH0554718B2 (enExample) 1993-08-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees