JPS61292393A - セラミック多層配線基板用酸化第二銅混練物 - Google Patents
セラミック多層配線基板用酸化第二銅混練物Info
- Publication number
- JPS61292393A JPS61292393A JP60134542A JP13454285A JPS61292393A JP S61292393 A JPS61292393 A JP S61292393A JP 60134542 A JP60134542 A JP 60134542A JP 13454285 A JP13454285 A JP 13454285A JP S61292393 A JPS61292393 A JP S61292393A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- copper oxide
- cuo
- wiring board
- ceramic wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 title claims description 46
- 239000000919 ceramic Substances 0.000 title claims description 16
- 239000005751 Copper oxide Substances 0.000 title claims description 13
- 229910000431 copper oxide Inorganic materials 0.000 title claims description 13
- 239000000463 material Substances 0.000 title claims description 6
- 239000011230 binding agent Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 16
- 239000004014 plasticizer Substances 0.000 claims description 3
- 229910003480 inorganic solid Inorganic materials 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims 1
- 239000010949 copper Substances 0.000 description 30
- 238000000034 method Methods 0.000 description 18
- 238000010304 firing Methods 0.000 description 15
- 239000012298 atmosphere Substances 0.000 description 14
- 239000004020 conductor Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000001293 FEMA 3089 Substances 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60134542A JPS61292393A (ja) | 1985-06-20 | 1985-06-20 | セラミック多層配線基板用酸化第二銅混練物 |
| KR1019860004701A KR900008781B1 (ko) | 1985-06-17 | 1986-06-13 | 후막도체조성물 |
| US06/875,083 US4695403A (en) | 1985-06-17 | 1986-06-17 | Thick film conductor composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60134542A JPS61292393A (ja) | 1985-06-20 | 1985-06-20 | セラミック多層配線基板用酸化第二銅混練物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61292393A true JPS61292393A (ja) | 1986-12-23 |
| JPH0554718B2 JPH0554718B2 (enrdf_load_stackoverflow) | 1993-08-13 |
Family
ID=15130750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60134542A Granted JPS61292393A (ja) | 1985-06-17 | 1985-06-20 | セラミック多層配線基板用酸化第二銅混練物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61292393A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4894184A (en) * | 1986-08-27 | 1990-01-16 | The Furukawa Electric Co., Ltd. | Low-temperature burnt conductive paste and method of manufacturing printed circuit board |
| US5120473A (en) * | 1987-10-12 | 1992-06-09 | Ngk Spark Plug Co., Ltd. | Metallizing composition for use with ceramics |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6052096A (ja) * | 1983-08-31 | 1985-03-23 | 松下電工株式会社 | セラミックス回路基板の製法 |
| JPS6126293A (ja) * | 1984-07-17 | 1986-02-05 | 松下電器産業株式会社 | セラミック多層配線基板の製造方法 |
-
1985
- 1985-06-20 JP JP60134542A patent/JPS61292393A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6052096A (ja) * | 1983-08-31 | 1985-03-23 | 松下電工株式会社 | セラミックス回路基板の製法 |
| JPS6126293A (ja) * | 1984-07-17 | 1986-02-05 | 松下電器産業株式会社 | セラミック多層配線基板の製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4894184A (en) * | 1986-08-27 | 1990-01-16 | The Furukawa Electric Co., Ltd. | Low-temperature burnt conductive paste and method of manufacturing printed circuit board |
| US5120473A (en) * | 1987-10-12 | 1992-06-09 | Ngk Spark Plug Co., Ltd. | Metallizing composition for use with ceramics |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0554718B2 (enrdf_load_stackoverflow) | 1993-08-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |