JPS61288036A - リードフレーム材用銅合金 - Google Patents

リードフレーム材用銅合金

Info

Publication number
JPS61288036A
JPS61288036A JP60130242A JP13024285A JPS61288036A JP S61288036 A JPS61288036 A JP S61288036A JP 60130242 A JP60130242 A JP 60130242A JP 13024285 A JP13024285 A JP 13024285A JP S61288036 A JPS61288036 A JP S61288036A
Authority
JP
Japan
Prior art keywords
copper alloy
rolled
lead frame
annealing
cold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60130242A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0243811B2 (enExample
Inventor
Naoyuki Kanehara
尚之 金原
Mitsuhiro Kojima
小島　光宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP60130242A priority Critical patent/JPS61288036A/ja
Publication of JPS61288036A publication Critical patent/JPS61288036A/ja
Publication of JPH0243811B2 publication Critical patent/JPH0243811B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60130242A 1985-06-15 1985-06-15 リードフレーム材用銅合金 Granted JPS61288036A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60130242A JPS61288036A (ja) 1985-06-15 1985-06-15 リードフレーム材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60130242A JPS61288036A (ja) 1985-06-15 1985-06-15 リードフレーム材用銅合金

Publications (2)

Publication Number Publication Date
JPS61288036A true JPS61288036A (ja) 1986-12-18
JPH0243811B2 JPH0243811B2 (enExample) 1990-10-01

Family

ID=15029528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60130242A Granted JPS61288036A (ja) 1985-06-15 1985-06-15 リードフレーム材用銅合金

Country Status (1)

Country Link
JP (1) JPS61288036A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010229461A (ja) * 2009-03-26 2010-10-14 Fukuda Metal Foil & Powder Co Ltd 高強度・高導電性銅合金及びその製造方法
JP2015206075A (ja) * 2014-04-21 2015-11-19 株式会社Ｓｈカッパープロダクツ 銅合金材、電気自動車用の配電部材及びハイブリッド自動車用の配電部材
CN111032892A (zh) * 2018-03-20 2020-04-17 古河电气工业株式会社 铜合金线材和铜合金线材的制造方法
JP2021531412A (ja) * 2018-09-14 2021-11-18 ケイエムイー・スペシャル・プロダクツ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング 銅合金の使用
US20240116110A1 (en) * 2022-10-04 2024-04-11 Iowa State University Research Foundation, Inc. Oxidation resistant high conductivity copper alloys

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010229461A (ja) * 2009-03-26 2010-10-14 Fukuda Metal Foil & Powder Co Ltd 高強度・高導電性銅合金及びその製造方法
JP2015206075A (ja) * 2014-04-21 2015-11-19 株式会社Ｓｈカッパープロダクツ 銅合金材、電気自動車用の配電部材及びハイブリッド自動車用の配電部材
CN111032892A (zh) * 2018-03-20 2020-04-17 古河电气工业株式会社 铜合金线材和铜合金线材的制造方法
CN111032892B (zh) * 2018-03-20 2021-12-14 古河电气工业株式会社 铜合金线材和铜合金线材的制造方法
JP2021531412A (ja) * 2018-09-14 2021-11-18 ケイエムイー・スペシャル・プロダクツ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング 銅合金の使用
JP2023055774A (ja) * 2018-09-14 2023-04-18 ケイエムイー・スペシャル・プロダクツ・アンド・ソリューションズ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング 銅合金の使用
US12129538B2 (en) 2018-09-14 2024-10-29 Cunova Gmbh Use of a copper alloy
US20240116110A1 (en) * 2022-10-04 2024-04-11 Iowa State University Research Foundation, Inc. Oxidation resistant high conductivity copper alloys

Also Published As

Publication number Publication date
JPH0243811B2 (enExample) 1990-10-01

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