JPS6127666A - 半導体素子用ボンデイング細線 - Google Patents

半導体素子用ボンデイング細線

Info

Publication number
JPS6127666A
JPS6127666A JP14810684A JP14810684A JPS6127666A JP S6127666 A JPS6127666 A JP S6127666A JP 14810684 A JP14810684 A JP 14810684A JP 14810684 A JP14810684 A JP 14810684A JP S6127666 A JPS6127666 A JP S6127666A
Authority
JP
Japan
Prior art keywords
copper
bonding
small
wire
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14810684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0380344B2 (en:Method
Inventor
Shinichi Miki
神酒　慎一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP14810684A priority Critical patent/JPS6127666A/ja
Publication of JPS6127666A publication Critical patent/JPS6127666A/ja
Publication of JPH0380344B2 publication Critical patent/JPH0380344B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/07141—
    • H10W72/07532—
    • H10W72/5525—

Landscapes

  • Wire Bonding (AREA)
JP14810684A 1984-07-17 1984-07-17 半導体素子用ボンデイング細線 Granted JPS6127666A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14810684A JPS6127666A (ja) 1984-07-17 1984-07-17 半導体素子用ボンデイング細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14810684A JPS6127666A (ja) 1984-07-17 1984-07-17 半導体素子用ボンデイング細線

Publications (2)

Publication Number Publication Date
JPS6127666A true JPS6127666A (ja) 1986-02-07
JPH0380344B2 JPH0380344B2 (en:Method) 1991-12-24

Family

ID=15445377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14810684A Granted JPS6127666A (ja) 1984-07-17 1984-07-17 半導体素子用ボンデイング細線

Country Status (1)

Country Link
JP (1) JPS6127666A (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102553A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 半導体装置
JPS62102551A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102553A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 半導体装置
JPS62102551A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
JPH0380344B2 (en:Method) 1991-12-24

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