JPS61272943A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS61272943A
JPS61272943A JP60114918A JP11491885A JPS61272943A JP S61272943 A JPS61272943 A JP S61272943A JP 60114918 A JP60114918 A JP 60114918A JP 11491885 A JP11491885 A JP 11491885A JP S61272943 A JPS61272943 A JP S61272943A
Authority
JP
Japan
Prior art keywords
temperature
thermal expansion
electrode
bonding
coordinates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60114918A
Other languages
Japanese (ja)
Inventor
Takumi Matsukura
松倉　巧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60114918A priority Critical patent/JPS61272943A/en
Publication of JPS61272943A publication Critical patent/JPS61272943A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Abstract

PURPOSE:To prevent a short circuit between bonding wire and inner wiring by a method wherein the temperature of an element is detected to process and correct any slippage in electrode positions due to thermal expansion of the element. CONSTITUTION:A heater plate 13 is provided with a temperature sensor 9 detecting the temperature in an element 8 to input the detected temperature in a microprocessor 10. The microprocessor 10 wherein thermal expansion coefficient of element 8 is preliminarily inputted processes to correct any slippage in the coordinates of individual electrode due to thermal expansion of element 8. An XY table loaded with a bonding head 6 is shifted according to the corrected bonding coordinates to bond an electrode on an inner lead. Through these procedures, a short circuit between a bonding wire and an inner wiring can be prevented from happening.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体素子の組立装置、特に半導体素子の電極
と内部リードとを金属細線で接続するワイヤデンディン
グ装置の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for assembling semiconductor elements, and more particularly to an improvement in a wire ending apparatus for connecting electrodes of semiconductor elements and internal leads using thin metal wires.

〔従来の技術〕[Conventional technology]

従来、この種の自動ワイヤデンディング装置の構成は次
のようになっていた。すなわち、第３図のように、ＴＶ
カメラ１、画像処理装置３、ポンディングヘッド６を載
せた葺テーブル７、コントロールユニット４、ボンディ
ング座標のメモリ５とからなっている。２はＴＶモニタ
である。ＴＶカメ２１によフ得られる画像情報は画像処
理装置３により二値化処理され、それにより、コントロ
ールユニット４で素子８０基準位置からのずれ童が演算
される。メモリー５に記憶されているデンディング座標
は上記ずれ量だけ原点補正され、それに従って茸テーブ
ル７が移動し、個々の電極、内部リード間がポンディン
グされる。Conventionally, the configuration of this type of automatic wire ending device was as follows. In other words, as shown in Figure 3, the TV
It consists of a camera 1, an image processing device 3, a roof table 7 on which a bonding head 6 is placed, a control unit 4, and a memory 5 for bonding coordinates. 2 is a TV monitor. The image information obtained by the TV camera 21 is binarized by the image processing device 3, and the control unit 4 calculates the deviation of the element 80 from the reference position. The origin of the dending coordinates stored in the memory 5 is corrected by the amount of deviation described above, and the mushroom table 7 is moved accordingly, thereby bonding between the individual electrodes and internal leads.

〔発明が解決し、ようとする問題点〕[Problems that the invention attempts to solve]

しかしながら、熱圧着方式ワイヤボンディングでは素子
を２８０〜３００℃に加熱する必要がある為、素子は熱
膨張し、上述した従来のワイヤデンディング装置では、
第２図に点線で示したように？−ル１２’は電極１１か
らはなれてデンディングが行なわれることになり、ポー
ルと内部配線とのショート不良、ゾールと電極の圧着面
積の減少によるボンディング強度不足等の問題を生ずる
−という欠点がある。However, in thermocompression wire bonding, it is necessary to heat the element to 280 to 300°C, so the element expands thermally.
As shown by the dotted line in Figure 2? - The electrode 12' separates from the electrode 11 and is bent, resulting in problems such as a short circuit between the pole and internal wiring, and insufficient bonding strength due to a reduction in the crimping area between the electrode and the electrode. .

この問題は高集積化された大型の素子ではさらに顕著と
なってくる。This problem becomes even more pronounced in highly integrated large-sized devices.

本発明は前記問題点を解消した装置を提供するものであ
る。The present invention provides an apparatus that solves the above problems.

〔問題点を解決するための手段〕[Means for solving problems]

本発明によるワイヤデンディング装置は、がンディング
中の素子の温度を測定する温度センサーと、素子の熱膨
張による電極座標のずれを演算、補正する処理手段を有
することを特徴とするものである。The wire ending device according to the present invention is characterized by having a temperature sensor that measures the temperature of an element during soldering, and processing means that calculates and corrects deviations in electrode coordinates due to thermal expansion of the element.

〔実施例〕〔Example〕

以下本発明の一実施例について図面を参照して説明する
。第１図は本発明の一実施例の概略図である。An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram of an embodiment of the present invention.

ＴＶカメラ１により得られる画像情報は画像処理装置３
によシニ値化処理され、それにより、コントロールユニ
ット４で素子８上の認識エリアの採漿と基準位置からの
ずれ量の演算が行なわれ、メモリー５に記憶されている
デンディング座標の原点が補正される。また、加熱板１
３には温度センサー９が設けられておシ、これにより素
子８の温度が検出され、マイクロプロセッサ−からなる
処理手段１０に入力される。処理手段１０には、予じめ
素子の熱膨張係数が入力されており、その温度における
素子の熱膨張による個々の電極の座標のずれ竜を演算し
、補正を行なう。この補正されたポンディング座標に従
ってざンディングヘッド６の搭載された茸テーブル７が
移動し、電極と内部リード間がデンディングされる。こ
の際、デンディング座標は基準位置からだけでなく、素
子の熱膨張による電極のいずれも補正されている為に第
３図に示すように？−ル１２の電極からのずれはなく、
従ってゴールの内部配線とのショートや、がンディング
強度の低下もない。その他の構成は従来と同様である。The image information obtained by the TV camera 1 is processed by the image processing device 3.
As a result, the control unit 4 samples the recognition area on the element 8 and calculates the amount of deviation from the reference position, and the origin of the Dending coordinates stored in the memory 5 is determined. Corrected. In addition, heating plate 1
3 is provided with a temperature sensor 9, whereby the temperature of the element 8 is detected and inputted to a processing means 10 consisting of a microprocessor. The thermal expansion coefficient of the element is input in advance to the processing means 10, and the deviation of the coordinates of each electrode due to the thermal expansion of the element at that temperature is calculated and corrected. The mushroom table 7 on which the sanding head 6 is mounted moves according to the corrected pounding coordinates, and the area between the electrode and the internal lead is dented. At this time, the dending coordinates are corrected not only from the reference position but also from the electrodes due to thermal expansion of the element, as shown in Figure 3. - There is no deviation from the electrode of rule 12,
Therefore, there is no short circuit with the internal wiring of the goal, and there is no reduction in the bonding strength. Other configurations are the same as before.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明のワイヤデンディング装置は
、素子の温度を検出し、素子の熱膨張による電極位置ズ
レを演算補正することによ、シ、ポンディングワイヤー
と内部配線とのショートを防止でき、これによシ半導体
ＩＣの製造歩留を向上させるとともに信頼性も著しく向
上させることができる効果を有するものである。As explained above, the wire ending device of the present invention detects the temperature of the element and calculates and corrects electrode position deviation due to thermal expansion of the element, thereby preventing short circuits between the bonding wire and internal wiring. This has the effect of improving the manufacturing yield of semiconductor ICs and significantly improving reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明によるワイヤがンディング装置の一実施
例を示す概略図、第２図は本発明によるワイヤがンディ
ング装置及び従来のワイヤデンディング装置のがンディ
ング位置を示す説明図、第３図は従来のワイヤデンディ
ング装置を示ス概略図である。 １・・・ＴＶカメラ、２・・・ＴＶモニタ、３・・・画
像処理装置、４・・・コントロールユニット、５・・・
メモリ、６・・・デンディングヘッド、７・・・ｎ′テ
ーブル、８・・・素子、９・・・温度センサー、１０・
・・処理手段、１１・・・電極、１２・・・本発明のワ
イヤデンディング装置によるポール、１２’−・・従来
のワイヤデンディング装置によるポール、１３・・・加
熱板。 第１図 第３図FIG. 1 is a schematic diagram showing an embodiment of a wire ending device according to the present invention, FIG. 2 is an explanatory diagram showing the winding positions of a wire ending device according to the present invention and a conventional wire ending device, and FIG. 1 is a schematic diagram showing a conventional wire ending device. 1...TV camera, 2...TV monitor, 3...image processing device, 4...control unit, 5...
Memory, 6... Dending head, 7... n' table, 8... Element, 9... Temperature sensor, 10...
. . . Processing means, 11 . . . Electrode, 12 . Figure 1 Figure 3

Claims (1)

【特許請求の範囲】[Claims] （１）熱圧着方式のワイヤボンディング装置において、
半導体素子の温度を測定する温度センサーと、該ボンデ
ィング温度における素子の熱膨張による電極位置座標の
ずれを演算し補正する処理手段とを具備することを特徴
とするワイヤボンディング装置。(1) In a thermocompression wire bonding device,
A wire bonding apparatus comprising: a temperature sensor that measures the temperature of a semiconductor element; and a processing means that calculates and corrects a shift in electrode position coordinates due to thermal expansion of the element at the bonding temperature.
JP60114918A 1985-05-28 1985-05-28 Wire bonding device Pending JPS61272943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60114918A JPS61272943A (en) 1985-05-28 1985-05-28 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60114918A JPS61272943A (en) 1985-05-28 1985-05-28 Wire bonding device

Publications (1)

Publication Number Publication Date
JPS61272943A true JPS61272943A (en) 1986-12-03

Family

ID=14649886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60114918A Pending JPS61272943A (en) 1985-05-28 1985-05-28 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS61272943A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63229731A (en) * 1987-03-18 1988-09-26 Nec Kyushu Ltd Ultrasonic wedge bonder
JP2002261114A (en) * 2001-03-02 2002-09-13 Nec Corp Wire bonding apparatus and wire bonding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63229731A (en) * 1987-03-18 1988-09-26 Nec Kyushu Ltd Ultrasonic wedge bonder
JP2002261114A (en) * 2001-03-02 2002-09-13 Nec Corp Wire bonding apparatus and wire bonding method

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