JPH0438135B2 - - Google Patents
Info
- Publication number
- JPH0438135B2 JPH0438135B2 JP58204809A JP20480983A JPH0438135B2 JP H0438135 B2 JPH0438135 B2 JP H0438135B2 JP 58204809 A JP58204809 A JP 58204809A JP 20480983 A JP20480983 A JP 20480983A JP H0438135 B2 JPH0438135 B2 JP H0438135B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- wire bonding
- identification
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 10
- 230000007547 defect Effects 0.000 description 9
- 239000000725 suspension Substances 0.000 description 6
- 239000008188 pellet Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004092 self-diagnosis Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
Description
【発明の詳細な説明】
［技術分野］
本発明は、ワイヤボンデイング技術、特に、複
数台のワイヤボンデイング装置（以下、ボンダと
いう。）を群制御してワイヤボンデイングを行う
技術に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a wire bonding technique, and particularly to a technique for performing wire bonding by controlling a plurality of wire bonding apparatuses (hereinafter referred to as bonders) in a group.
［背景技術］
半導体装置の製造において、ペレツトボンデイ
ングとワイヤボンデイングとのサイクルタイムの
差を解消するため、複数台のボンダを用いてワイ
ヤボンデイングを行う技術が考えられる。[Background Art] In order to eliminate the difference in cycle time between pellet bonding and wire bonding in the manufacture of semiconductor devices, a technique for performing wire bonding using a plurality of bonders is considered.
しかし、かかるワイヤボンデイング技術におい
ては、各ボンダが同一形態の被ボンデイング物に
同一のボンデイングをそれぞれに行うことになる
ため、ボンデイング後に欠陥が発見された場合、
いずれのボンダによる欠陥であるかの追跡調査が
できず、原因解析、対策等が遅延するという問題
点があることが、本発明者によつて明らかにされ
た。 However, in such wire bonding technology, each bonder performs the same bonding on the same type of bonded object, so if a defect is discovered after bonding,
The inventor of the present invention has revealed that there is a problem in that it is not possible to trace the defect to which bonder the defect is caused, which delays cause analysis, countermeasures, etc.
［発明の目的］
本発明の目的は、ワイヤボンデイング欠陥の追
跡調査を簡単化できるワイヤボンデイング技術を
提供することにある。[Object of the Invention] An object of the present invention is to provide a wire bonding technique that can simplify tracing of wire bonding defects.
本発明の前記ならびにその他の目的と新規な特
徴は、本明細書の記述および添付図面から明らか
になるであろう。 The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
［発明の概要］
本願において開示される発明のうち代表的なも
のの概要を簡単に説明すれば、次の通りである。[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.
すなわち、ボンダのそれぞれに識別ワイヤを独
自の態様でボンデイングさせることにより、その
識別ワイヤの判別によつてボンデイングしたボン
ダを容易に割り出せるようにしたものである。 That is, by bonding each bonder with an identification wire in a unique manner, it is possible to easily identify the bonded bonder by identifying the identification wire.
［実施例］
第１図は本発明の一実施例であるワイヤボンデ
イングシステムを示す概略系統図、第２図および
第３図は作用を説明するための被ボンデイング物
の各平面図である。[Embodiment] FIG. 1 is a schematic system diagram showing a wire bonding system as an embodiment of the present invention, and FIGS. 2 and 3 are plan views of objects to be bonded for explaining the operation.
本実施例において、このワイヤボンデイングシ
ステムは、マイクロコンピユータ等からなる中央
制御部１を備えており、この制御部１には、図形
処理部２と、データ読み取り機３と、インタフエ
ース回路４を介して複数台のボンダ５と、位置合
わせを行うための視覚系６とが接続されている。 In this embodiment, this wire bonding system is equipped with a central control section 1 consisting of a microcomputer, etc., and this control section 1 is connected to a graphic processing section 2, a data reader 3, and an interface circuit 4. A plurality of bonders 5 are connected to a visual system 6 for positioning.
各ボンダ５は、被ボンデイング物としてのリー
ドフレーム８を搬送するコンベア７にそれぞれ臨
まされており、コンベア７上のリードフレーム８
を適宜ボンデイングステージに取り込んでワイヤ
ボンデイングを行うようになつている。 Each bonder 5 faces a conveyor 7 that conveys a lead frame 8 as an object to be bonded.
wire bonding is performed by taking the wire into the bonding stage as appropriate.
ボンダ５のそれぞれはマイクロコンピユータ等
からなるコントローラ（図示せず）を備えてお
り、このコントローラは、ボンデイングシーケン
スの制御、ボンデイング位置演算、図形処理部と
のデータ転送、ボンダの自己診断および異常表示
等を行うようになつている。さらに、コントロー
ラのそれぞれは、各ボンデイング作業の一貫とし
て、後述する如く、リードフレームのタブ吊りリ
ードにおける各所定位置に識別ワイヤをボンデイ
ングさせるようにプログラミングされている。 Each of the bonders 5 is equipped with a controller (not shown) consisting of a microcomputer, etc., and this controller controls the bonding sequence, calculates the bonding position, transfers data with the graphic processing section, performs bonder self-diagnosis, displays abnormalities, etc. People are starting to do this. Furthermore, each of the controllers is programmed to bond an identification wire to each predetermined position on the tab suspension lead of the lead frame as part of each bonding operation, as will be described below.
次に、前記システムによつて実施されるワイヤ
ボンデイング方法について説明する。 Next, a wire bonding method performed by the system will be described.
リードフレーム８はペレツト９をタブ１０上に
ボンデイングされた状態でコンベア７により各ボ
ンダ５に沿つて搬送される。 The lead frame 8 is conveyed along each bonder 5 by the conveyor 7 with the pellet 9 bonded onto the tab 10.
中央制御部１の指令により、待機中のボンダ５
はコンベア７上のリードフレーム８をボンデイン
グステージに取り込む。続いて、視覚系６と図形
処理部３等の協働により、あらかじめ記憶されて
いる基準位置とペレツト９のボンデイングパツド
とのずれが求められ、座標的に補正される。 According to a command from the central control unit 1, the bonder 5 on standby
The lead frame 8 on the conveyor 7 is taken into the bonding stage. Subsequently, the visual system 6, the graphic processing unit 3, etc. work together to determine the deviation between the pre-stored reference position and the bonding pad of the pellet 9, and correct it in terms of coordinates.
その後、ボンダ５は内部コントローラの制御に
より、ペレツト９と各リード１１とのボンデイン
グパツド間にワイヤ１３を架橋するワイヤボンデ
イング作業を順次実施して行く。 Thereafter, the bonder 5 sequentially performs a wire bonding operation for bridging the wire 13 between the bonding pads of the pellet 9 and each lead 11 under the control of the internal controller.
このワイヤボンデイングの作業中、ボンダ５は
タブ吊りリード１２の所定位置に識別ワイヤ１４
をボンデイングする。この識別ワイヤ１４の所定
位置は各ボンダ５ごとに相異され、独自の位置に
なつている。たとえば、第２図および第３図に示
されるように、あるボンダではタブ吊りリード１
２の先端位置に識別ワイヤ１４がボンデイングさ
れ、他のボンダではタブ吊りリード１２の基端位
置に識別ワイヤ１４がボンデイングされる。この
位置の相異により、識別ワイヤ１４相互の識別が
可能になる。 During this wire bonding work, the bonder 5 attaches the identification wire 14 to a predetermined position of the tab suspension lead 12.
Bonding. The predetermined position of this identification wire 14 is different for each bonder 5 and has its own position. For example, as shown in FIGS. 2 and 3, in some bonders tab suspension lead 1
The identification wire 14 is bonded to the distal end position of the tab suspension lead 12 in the second bonder, and the identification wire 14 is bonded to the base end position of the tab suspension lead 12 in the other bonders. This difference in position allows the identification wires 14 to be identified from each other.
なお、識別ワイヤ１４のボンデイングはボンデ
イング作業中、相対移動効率等を考慮して適時実
施すればよいが、作業の最初に実施した場合、ウ
オーミングアツプの役目を果たし、待機中の冷却
等による作動誤差を排除できるという効果が得ら
れる。 It should be noted that bonding of the identification wire 14 may be carried out at the appropriate time during the bonding work, taking into account the relative movement efficiency, etc. However, if it is carried out at the beginning of the work, it will serve as a warming-up and prevent operational errors due to cooling during standby, etc. This has the effect of eliminating the
ワイヤボンデイング作業が完了すると、リード
フレーム８はコンベア７に戻され、次工程へ搬送
されて行く。 When the wire bonding work is completed, the lead frame 8 is returned to the conveyor 7 and transported to the next process.
このようにしてワイヤボンデイングされたリー
ドフレーム８はその後、たとえば、断線不良や短
絡不良等についての欠陥検査を受ける。この検査
において、欠陥が発見された場合、そのリードフ
レーム８における識別ワイヤ１４の位置により、
そのリードフレーム８に対してワイヤボンデイン
グを行つたボンダ５を求める。欠陥発生源たるボ
ンダを究明した後、欠陥の原因を解析し、これに
逸早く対策を講ずる。 The lead frame 8 wire-bonded in this manner is then subjected to a defect inspection for, for example, disconnections, short circuits, and the like. In this inspection, if a defect is found, the position of the identification wire 14 in the lead frame 8
A bonder 5 that performs wire bonding to the lead frame 8 is determined. After identifying the bonder that is the source of the defect, analyze the cause of the defect and take immediate countermeasures.
［効果］
(1) ボンダのそれぞれに識別ワイヤを独自の態様
でボンデイングさせることにより、ワイヤボン
デイングを行つたボンダを簡単に求めることが
できるため、欠陥発生源の究明が容易になり、
原因解析、対策が迅速に行える。[Effects] (1) By bonding the identification wire to each bonder in a unique manner, it is possible to easily determine the bonder that has been wire-bonded, making it easier to identify the source of defects.
Cause analysis and countermeasures can be taken quickly.
(2) 識別手段をボンデイングワイヤとすることに
より、ワイヤボンデイング作業の一貫として識
別手段を形成できるため、識別手段形成のため
の専用機構の新設や改造が不要であり、設備費
や維持被の増加が回避できる。(2) By using a bonding wire as the identification means, the identification means can be formed as part of the wire bonding work, so there is no need to newly install or modify a dedicated mechanism for forming the identification means, which reduces equipment costs and maintenance costs. can be avoided.
(3) 識別ワイヤを作業の冒頭においてボンデイン
グすることにより、ウオーミングアツプできる
ため、作業開始時の作動誤差が排除できる。(3) By bonding the identification wire at the beginning of work, it is possible to warm up the wire, thereby eliminating operational errors at the start of work.
以上本発明者によつてなされた発明を実施例に
基づき具体的に説明したが、本発明は前記実施例
に限定されるものではなく、その要旨を逸脱しな
い範囲で種々変更可能であることはいうまでもな
い。 Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the Examples described above, and it is understood that various changes can be made without departing from the gist of the invention. Needless to say.
たとえば、識別ワイヤはタブ吊りリードにボン
デイングするに限らず、リードやダム等にボンデ
イングしてもよい。 For example, the identification wire is not limited to being bonded to the tab suspension lead, but may also be bonded to a lead, dam, or the like.
識別ワイヤの識別に必要な独自の態様は、位置
の選定に限らず、長さを相異させて構成してもよ
い。また、実際のボンデイングワイヤのうち特定
のものを、たとえば長さを相異させる等の態様に
より、識別ワイヤとして兼用するようにしてもよ
い。 The unique aspect necessary for identification of the identification wire is not limited to the selection of the position, but may be configured by making the length different. Also, a specific one of the actual bonding wires may be used as an identification wire by, for example, having different lengths.
被ボンデイング物はリードフレームに限らず、
セラミツク基板等であつてもよい。 The objects to be bonded are not limited to lead frames.
It may also be a ceramic substrate or the like.
［利用分野］
以上の説明では主として本発明者によつてなさ
れた発明をその背景となつた利用分野である半導
体装置の製造において使用されるワイヤボンデイ
ング技術に適用した場合について説明したが、そ
れに限定されるものではなく、たとえば、電子部
品等の製造において使用されるワイヤボンデイン
グ技術に適用できる。[Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to the field of application which is its background, wire bonding technology used in the manufacture of semiconductor devices, but the invention is not limited thereto. For example, the present invention can be applied to wire bonding technology used in the manufacture of electronic components.
第１図は本発明の一実施例を示す系統図、第２
図および第３図はその作用を説明するための被ボ
ンデイング物の各平面図である。
１……中央制御部、２……図形処理部、３……
データ読み取り機、４……インタフエース回路、
５……ボンダ、６……視覚系、７……コンベア、
８……リードフレーム（被ボンデイング物）、９
……ペレツト、１０……タブ、１１……リード、
１２……タブ吊りリード、１３……ボンデイング
ワイヤ、１４……識別ワイヤ。
Figure 1 is a system diagram showing one embodiment of the present invention, Figure 2 is a system diagram showing an embodiment of the present invention.
3 and 3 are plan views of objects to be bonded for explaining the operation thereof. 1...Central control unit, 2...Graphic processing unit, 3...
Data reader, 4...interface circuit,
5...Bonda, 6...Visual system, 7...Conveyor,
8...Lead frame (object to be bonded), 9
...Pellet, 10...Tab, 11...Lead,
12... Tab hanging lead, 13... Bonding wire, 14... Identification wire.
Claims (1)
デイング物に同種のワイヤボンデイングをそれぞ
れ行うワイヤボンデイング方法において、前記ワ
イヤボンデイング装置のそれぞれが前記ワイヤボ
ンデイング中に独自の態様の識別ワイヤをボンデ
イングすることを特徴とするワイヤボンデイング
方法。 ２ 識別ワイヤが、各ワイヤボンデイング装置相
互においてボンデイングされる位置を相異されて
なることを特徴とする特許請求の範囲第１項記載
のワイヤボンデイング方法。 ３ 識別ワイヤが、各ワイヤボンデイング装置相
互において長さを相異されてなることを特徴とす
る特許請求の範囲第１項記載のワイヤボンデイン
グ方法。[Scope of Claims] 1. A wire bonding method in which a plurality of wire bonding apparatuses each bond the same type of wire to each bonded object, wherein each of the wire bonding apparatuses uses a unique type of identification wire during the wire bonding. A wire bonding method characterized by bonding. 2. The wire bonding method according to claim 1, wherein the identification wires are bonded at different positions in each wire bonding device. 3. The wire bonding method according to claim 1, wherein the identification wires have different lengths in each wire bonding device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58204809A JPS6097630A (en) | 1983-11-02 | 1983-11-02 | Method for wire bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58204809A JPS6097630A (en) | 1983-11-02 | 1983-11-02 | Method for wire bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6097630A JPS6097630A (en) | 1985-05-31 |
| JPH0438135B2 true JPH0438135B2 (en) | 1992-06-23 |
Family
ID=16496722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58204809A Granted JPS6097630A (en) | 1983-11-02 | 1983-11-02 | Method for wire bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6097630A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4194094B2 (en) | 2003-12-26 | 2008-12-10 | 株式会社クボタ | Working vehicle structure |
| JP4787854B2 (en) * | 2008-03-06 | 2011-10-05 | 力成科技股▲分▼有限公司 | Identification code forming method |
-
1983
- 1983-11-02 JP JP58204809A patent/JPS6097630A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6097630A (en) | 1985-05-31 |
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