JPH0461249A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPH0461249A
JPH0461249A JP2173533A JP17353390A JPH0461249A JP H0461249 A JPH0461249 A JP H0461249A JP 2173533 A JP2173533 A JP 2173533A JP 17353390 A JP17353390 A JP 17353390A JP H0461249 A JPH0461249 A JP H0461249A
Authority
JP
Japan
Prior art keywords
bonding
horn
ultrasonic horn
control device
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2173533A
Other languages
Japanese (ja)
Inventor
Ryuichiro Mori
隆一郎 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2173533A priority Critical patent/JPH0461249A/en
Publication of JPH0461249A publication Critical patent/JPH0461249A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Abstract

PURPOSE:To prevent the positional deviation of a horn induced by thermal expansion of an ultrasonic horn by detecting the amount of elongation of the ultrasonic horn and correcting bonding positions. CONSTITUTION:A detector 13, which is designed to detect the tip position of an ultrasonic horn 6, uses the reflection of laser, for example, and transmits detected data to a control device 10. Correction is input so that the coordinates (X, Y) calculated by a recognition device 9 may agree with the coordinates (X, Y) used by the control device 10. At that time, the tip position of the horn is measured by the detector 13 under the condition where the ultrasonic horn 6 is suspended at a certain position A. Then, after repeated bonding, the tip position of the horn is measured by the detector 13 under the condition where the ultrasonic horn 6 is suspended at the position A once again. If the horn is elongated, the amount of elongation is determined, and the movement of the XY table is corrected by the control device 10 so that bonding may be carried out.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体組立工程で用いるワイヤボンド装置
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire bonding device used in a semiconductor assembly process.

〔従来の技術〕[Conventional technology]

第３図は、従来のワイヤボンド装置の構成を示す模式正
面図であす、（１）は半導体素子、（２）は半導体素子
（１）が固着しであるリードフレーム、（３）は半導体
素子（１）及びリードフレーム（２）を加熱すると一ド
ブロック、、　（４）は架台、（７）はポンディングツ
ール、（６）はボンディングツール（７）を保持する超
音波ホーン、（１１）は超音波ホーン（６）を上下動さ
せる２動駆動部、（５）は２動駆動部（１１）を前後左
右に動かすｘｙテーブル、（８）は半導体素子（１）を
撮像するカメツで、カメツ支持枠（１２）により、ＸＹ
テーブル（５）に固定されている。（９）はカメツ（８
）から送られた画像を処理する認識装置、（１０）は認
識装置（９）から送られる座標データに基きＸＹテーブ
ル（５）を動かす制御装置である。FIG. 3 is a schematic front view showing the configuration of a conventional wire bonding device. (1) is a semiconductor element, (2) is a lead frame to which the semiconductor element (1) is fixed, and (3) is a semiconductor element. (1) and the lead frame (2) are heated to form a single block, (4) is the mount, (7) is the bonding tool, (6) is the ultrasonic horn that holds the bonding tool (7), (11) is a two-motion drive unit that moves the ultrasonic horn (6) up and down, (5) is an xy table that moves the two-motion drive unit (11) back and forth, left and right, and (8) is a camera that images the semiconductor element (1). The XY support frame (12)
It is fixed to the table (5). (9) is Kametsu (8
), and (10) is a control device that moves the XY table (5) based on the coordinate data sent from the recognition device (9).

第４図ないし第８図は半導体素子（１）の上面図を示し
、第４図はポンディング前、第５図はポンディング後、
第６図はポンディング後の１つの電極、第７図は正常な
ポンディング後、第８図は位置ズレ補正後に起きるボン
ディングズレを示す。図において、（１４）は電極、（
１５）はボールである。4 to 8 show top views of the semiconductor device (1), FIG. 4 is before bonding, FIG. 5 is after bonding,
FIG. 6 shows one electrode after bonding, FIG. 7 shows bonding deviation after normal bonding, and FIG. 8 shows bonding deviation that occurs after positional deviation correction. In the figure, (14) is the electrode, (
15) is a ball.

次に動作について脱明する。第４図において、カメツ（
８）と認識装置（９）により、電極（１４）を認識して
、位置座標データを制御装置（１０）に送り、制御装置
（ｌＯ）がＸＹテープ１ｖ（５）と２動駆動部（１１）
をコントロールして、電極（１４）上にボンディングを
行う。第５図のように電［（１４）の中心から、ボール
（１５）の位置がズしている時は、認１ｍ装置（９）で
計算される座１［（Ｘ、Ｙ）と制御装置（１０）で用い
る座１Ｍ（ｘ、ｙ’）が一致するよう補正値を制御装置
（１０）に作業者が入力する。第６図のようにズレが（
Δｘ、Ｊｙ）である時、（ｘ、ｙ）＝（Ｘ−Δｘ　、　
Ｙ　−Ｊｙ）のように補正し７て第７図に示すごとくボ
ール（１５）が電１ｉ（１４）の中心にくるようにする
。Next, let's clarify the operation. In Figure 4, Kametsu (
8) and the recognition device (9), the electrode (14) is recognized and the position coordinate data is sent to the control device (10). )
is controlled to perform bonding on the electrode (14). As shown in Figure 5, when the position of the ball (15) deviates from the center of the electric field (14), the position of the seat 1 [(X, Y) calculated by the recognition 1m device (9) and the controller The operator inputs correction values into the control device (10) so that the seats 1M (x, y') used in (10) match. As shown in Figure 6, there is a misalignment (
Δx, Jy), then (x, y)=(X−Δx,
Y - Jy) 7 to bring the ball (15) to the center of the electric field 1i (14) as shown in FIG.

［発明が解決しようとする課題］ 従来のワイヤボンド装置は、以上のように構成されてい
るので、−旦、補正値を入力［７て、ボールが第７図に
示す１番上（奥）　ＩＩＩの電極の中心にくるようにし
ても、ボンディングしていると超音波ホーンが、ヒート
ブロックから熱を受けて、手前側（Ｙ方向）に膨張して
延びるため、第８図のように１ボンデイングが手前側の
電極に移動１れげする程ボールの位置が電極から手前側
（Ｙ方向）にズしてくるという問題点があった。[Problem to be Solved by the Invention] Since the conventional wire bonding device is configured as described above, the correction value is inputted [7] and the ball is located at the top (back) as shown in FIG. Even if the ultrasonic horn is placed in the center of electrode III, during bonding, the ultrasonic horn receives heat from the heat block and expands and extends toward the front side (Y direction), as shown in Figure 8. There is a problem in that the more the bonding moves to the electrode on the front side, the more the ball shifts from the electrode to the front side (in the Y direction).

この発明は上記の↓うな問題点を解消するためになされ
た本ので、超音波ホーンの熱膨張によるボール位置ズレ
を防ぐワイヤボンド装置を得ることを目的とする。This invention was made to solve the above-mentioned problems, and its purpose is to provide a wire bonding device that prevents ball position deviation due to thermal expansion of an ultrasonic horn.

［課題を解決するための手段］ この発明に係るワイヤボンド装置は、超６波ホーンの伸
び量を検出し、ボンディング位置を修正するようにした
ものである。[Means for Solving the Problems] A wire bonding device according to the present invention detects the amount of elongation of an ultra-six-wave horn and corrects the bonding position.

［作用］ この発横１におけるワイヤボンド装置は、超音波ホーン
の伸び量を検出して、その伸び量分−゛けボンディング
位置を修正することにより、ボスディングさｈ六ボール
が電極の中心にくるようにする。[Function] The wire bonding device in the first firing position detects the amount of elongation of the ultrasonic horn and corrects the bonding position by the amount of elongation, thereby aligning the bossing ball with the center of the electrode. so that it comes.

（！！施例］ 以下、この発明の−ｌ＊施例を図について睨引″夕る。(!!Example) Embodiments of the present invention will be described below with reference to the drawings.

第１図において、（１）〜（１２）は第３図の従来例に
ボしたものと同等であるので説明を省略する。In FIG. 1, (1) to (12) are the same as those omitted in the conventional example of FIG. 3, and therefore their explanations will be omitted.

（１３）は超音波ホーン（６）の先端位置を検出する検
出器で例えばレーザー光の反射を用いる。検出さねたデ
ータは制御装置（１０）に送られる。支持台（１６）は
検出器（１３）を固定する。(13) is a detector for detecting the tip position of the ultrasonic horn (6), which uses reflection of laser light, for example. The data that is not detected is sent to the control device (10). The support base (16) fixes the detector (13).

第２図０第１図のワイヤボンド装置においで、ポンダイ
ング位置を修正する工程を示すフローチャートである。FIG. 2 is a flowchart showing a process of correcting the bonding position in the wire bonding apparatus of FIG. 1.

図において（１７）〜（２０）はステップである。In the figure, (17) to (20) are steps.

次に動作について説明する。まず、第３図の従来装置と
同様に、認識装置（９）で計算される座標（ＸＹ）と、
制御装置（１０）で用いる座Ｍ（ｘ、ｙンが一致するよ
うに、作業者が補正値を入力する。Next, the operation will be explained. First, like the conventional device shown in FIG. 3, the coordinates (XY) calculated by the recognition device (9),
The operator inputs correction values so that the seats M (x, y) used in the control device (10) match.

この時、超音波ホーン（６）がある位置Ａ（例えば原点
）に停止した状態で、超音波ホーン（６）の先端位置を
検出器（１３）により測定する。その際の測定値を】０
とする。次Ｋ、何回かボンディングした後に、再び超音
波ホーン（６）がある位置Ａに停止した状態で、ホーン
先端位置を検出器（１３）により測定する。この時の測
定値を１１とする。ホーンの伸びがあれば、伸び量をス
テップ（１７）によ！ＳＩΔ１＝１１−１０と求め、伸
び量１１があればステップ（１８）により次回のボンデ
ィングから、ステップ（１９）によりｘＹテーブルのＹ
方向の移動量を（ｘ、ｙ−Δ１　）のように、制御装置
（１０）で、修正の上、ステップ（２０）によ秒ボンデ
ィングを行う。伸び量１１が無ければステップ（１９）
を行うとと々く、ステップ（２０）によリボンディング
を行う。At this time, with the ultrasonic horn (6) stopped at a certain position A (for example, the origin), the tip position of the ultrasonic horn (6) is measured by the detector (13). Measured value at that time] 0
shall be. Next, after bonding is performed several times, the ultrasonic horn (6) is again stopped at a certain position A, and the horn tip position is measured by the detector (13). The measured value at this time is assumed to be 11. If the horn is elongated, measure the amount of elongation in step (17)! Find SIΔ1=11-10, and if there is an elongation amount of 11, proceed to step (18) from the next bonding, and proceed to step (19) to adjust Y of the xY table.
The amount of movement in the direction is corrected by the control device (10) as (x, y-Δ1), and second bonding is performed in step (20). If there is no elongation amount 11, step (19)
As soon as this is done, rebonding is performed in step (20).

し発明の効果］ 以上のように、この発明によれば、超音波ホーンの伸び
量を検出して、ボンディングの位置を修正するようにし
たので、熱で超音波ホ・−ンが伸びても、ポンダイング
さｈたボール位置がズレるのを防ぎ、高Ｍ度なボンディ
ング位置を自動的に得られる効果がある。[Effects of the Invention] As described above, according to the present invention, since the amount of elongation of the ultrasonic horn is detected and the bonding position is corrected, even if the ultrasonic horn elongates due to heat, This has the effect of preventing the position of the bonded ball from shifting and automatically obtaining a high bonding position.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明の一実施例によるワイヤボンド装置の
構成を示〜す模式正面間、第２図は第１図のワイヤボン
ド装置において、ボンディング位置を修正する工程を示
すフローチャート、第３図は従来のワイヤボンド装置の
構成を示す榎式■Ｅ面図、第４図ないし第８図は半導体
素子（１）の上面図を示し２、第４図はボンディング前
、第５図はボンディング後、第６図はボンディング後の
１つの電極、第７図は正常座ボンディング後、第８図は
位置ズレ補正後に起きるボンディングずれを示す。 図において、（１）は半導体素子、（２）ｒ、ｔｌＪ−
ドフレ−ム、（３）はヒートグロック、（４）は梨台、
（５）はｘｙテーブル、（６）は超音波ホーン、（７）
はボンディングツール、（８）は力、メツ、（９）は認
識装置、（１０）は制御装置、（１，１）　ｉｊ：　Ｚ
、　ｔＪ駆動部、（１２）は力、メツ支持枠、（１３）
は検出器、（１６）は支持台、（１７）〜（２０）にメ
チツブである。 なお、図中、同一符号゛は同一、又は相当部分を示す。 代　理　人　　人　　岩　　　　増　　雄第２図 １７〜２０ メチツブ。 第１図 ￥導体東了 り−）　７トム Ｌ゛−ドア０゛１２ 架台 ＸＹら一フル ｂ　−ζ５−ノ友・寸、−１・ ｌＳ／デイ、・−１ツー）［ ｔｙメ“） ＝＋ｃ、よＶ賀 第３図 第４図 第６図 第７図 第８図 （瑛使］） ０肋伸ｊ）FIG. 1 is a schematic front view showing the configuration of a wire bonding device according to an embodiment of the present invention, FIG. 2 is a flowchart showing the process of correcting the bonding position in the wire bonding device of FIG. 1, and FIG. Figure 4 shows the top view of the semiconductor element (1), Figure 4 is before bonding, and Figure 5 is after bonding. , FIG. 6 shows one electrode after bonding, FIG. 7 shows bonding deviation after normal position bonding, and FIG. 8 shows bonding deviation that occurs after positional deviation correction. In the figure, (1) is a semiconductor element, (2) r, tlJ-
Doflame, (3) is Heat Glock, (4) is Nashidai,
(5) is an xy table, (6) is an ultrasonic horn, (7)
is a bonding tool, (8) is a force, (9) is a recognition device, (10) is a control device, (1, 1) ij: Z
, tJ drive unit, (12) is force, Metsu support frame, (13)
is a detector, (16) is a support stand, and (17) to (20) are mechibu. In addition, in the figures, the same reference numerals indicate the same or corresponding parts. Agent Hito Iwa Masuo Figure 2 17-20 Mechitsubu. Fig. 1￥Conductor east end -) 7 Tom L゛-Door 0゛12 Frame =+c, YoVga 3rd figure 4th figure 6th figure 7th figure 8th figure (Eishi)) 0 rib extension j)

Claims (1)

【特許請求の範囲】[Claims] 　半導体素子の電極を認識して、超音波熱圧着方式でボ
ンディングするワイヤボンド装置において、超音波ホー
ンの伸び量を検出して、ボンディングの位置を修正する
ことを特徴とするワイヤボンド装置。A wire bonding device that recognizes electrodes of a semiconductor element and performs bonding using an ultrasonic thermocompression method, the wire bonding device being characterized in that the wire bonding device corrects the bonding position by detecting the amount of extension of an ultrasonic horn.
JP2173533A 1990-06-28 1990-06-28 Wire bonding device Pending JPH0461249A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2173533A JPH0461249A (en) 1990-06-28 1990-06-28 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2173533A JPH0461249A (en) 1990-06-28 1990-06-28 Wire bonding device

Publications (1)

Publication Number Publication Date
JPH0461249A true JPH0461249A (en) 1992-02-27

Family

ID=15962299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2173533A Pending JPH0461249A (en) 1990-06-28 1990-06-28 Wire bonding device

Country Status (1)

Country Link
JP (1) JPH0461249A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011110624A (en) * 2009-11-24 2011-06-09 Skg:Kk Light guiding plate machining device
JPWO2010147187A1 (en) * 2009-06-18 2012-12-06 ローム株式会社 Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010147187A1 (en) * 2009-06-18 2012-12-06 ローム株式会社 Semiconductor device
JP2011110624A (en) * 2009-11-24 2011-06-09 Skg:Kk Light guiding plate machining device

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