JPH01161727A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPH01161727A
JPH01161727A JP62322111A JP32211187A JPH01161727A JP H01161727 A JPH01161727 A JP H01161727A JP 62322111 A JP62322111 A JP 62322111A JP 32211187 A JP32211187 A JP 32211187A JP H01161727 A JPH01161727 A JP H01161727A
Authority
JP
Japan
Prior art keywords
capillary
bonding
camera
horn
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62322111A
Other languages
Japanese (ja)
Inventor
Toshiaki Shoji
俊明 庄司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62322111A priority Critical patent/JPH01161727A/en
Publication of JPH01161727A publication Critical patent/JPH01161727A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

PURPOSE:To accurately bond without displacement of a bonding point due to temperature change by providing temperature detecting means for detecting the temperature of a horn, and correcting means for correcting a distance between a capillary and a camera by obtaining a length variation due to the thermal expansion of the horn based on the detected result. CONSTITUTION:A capillary 2 for bonding a wire 11, a horn 3 secured to a pedestal 4 for supporting the capillary 2, a camera 1 secured to the pedestal 4, a monitor 12, and drive control means 8 for controlling to drive the position of the pedestal 4 are provided. The pedestal 4 is driven to determine a bonding point on a screen of the monitor 12, the capillary 2 is moved on the bonding point by considering the distance between the preset capillary 2 and the camera 2 by the means 8, thereby bonding them. Temperature detecting means 18 attached to the horn 2 for detecting the temperature of the horn 2, and correcting means 19 for correcting a distance between the preset capillary 2 and the camera 1 by obtaining the length variation due to the thermal expansion of the horn 2 based on the detected result are provided.

Description

【発明の詳細な説明】 ［産業上の利用分野］ この発明は、モニタ画面等を介してボンディング位置を
設定し自動あるいは半自動でワイヤーのボンディング（
結合）を行なう装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention sets the bonding position via a monitor screen, etc., and automatically or semi-automatically performs wire bonding (
The present invention relates to a device for performing a bonding process.

［従来の技術］ 第２図は従来のワイヤーボンディング装置（特にボンデ
ィングステージ付近）を示す構成図であり、図において
、１は被ボンディング材を撮像するカメラ、２はワイヤ
ー１１を導きながらこのワイヤー１１を被ボンディング
材の所定位置にボンディングするためのキャピラリー、
３はキャピラリー２を支持しボンディングの際にはキャ
ピラリー２を介してワイヤー１１に超音波を加える超音
波ホーン、４はボンディング動作を制御する台座として
のボンディングヘッド、５はボンディングヘッド４を前
後左右に駆動するＸＹ子テーブル６はＹ方向の動きを制
御するＹ方向モータ、７はＸ方向の動きを制御するＸ方
向モータ、８は各モータ６．７の回転数を制御するＸＹ
コントローラ、９は被ボンディング材としてのワーク、
１ｏはワーク９を加熱するヒーターブロック、１１はボ
ンディングする箇所どうしを結ぶワイヤー、１２はカメ
ラ１からの画像を映し出すモニタである。なお、ｘｙ子
テーブル、各−Ｔ−−１６，７およびＸＹコントローラ
８から、台座であるボンディングヘッド４を駆動制御す
るための駆動制御手段が構成されている。また、カメラ
１およびキャピラリー２は、ボンディングヘッド４に対
して固定されている。[Prior Art] FIG. 2 is a configuration diagram showing a conventional wire bonding apparatus (particularly near the bonding stage). In the figure, 1 is a camera that takes an image of the material to be bonded; capillary for bonding to a predetermined position on the material to be bonded,
3 is an ultrasonic horn that supports the capillary 2 and applies ultrasonic waves to the wire 11 through the capillary 2 during bonding; 4 is a bonding head as a pedestal that controls the bonding operation; 5 is a bonding head that moves the bonding head 4 forward, backward, left and right. The XY child table 6 to be driven is a Y direction motor that controls movement in the Y direction, 7 an X direction motor that controls movement in the X direction, and 8 an XY motor that controls the rotation speed of each motor 6.7.
A controller, 9 a workpiece as a material to be bonded,
1o is a heater block that heats the workpiece 9; 11 is a wire that connects the parts to be bonded; and 12 is a monitor that displays images from the camera 1. Note that the xy child table, each T-16, 7, and the XY controller 8 constitute a drive control means for controlling the drive of the bonding head 4, which is a pedestal. Further, the camera 1 and the capillary 2 are fixed to the bonding head 4.

次に動作について説明する。作業員等は、カメラ１によ
ってモニタ１２に映し出され・た画面を参照して、第１
のボンディング点を定める。その位置信号は、各モータ
６．７を介し各モータ６．７の回転位置としてｘＹコン
トローラ８内に記憶される。また、同様にして、第２の
ボンディング点を定めて記憶させる。Next, the operation will be explained. Workers etc. refer to the screen displayed on the monitor 12 by the camera 1 and
Determine the bonding point. The position signal is stored in the xY controller 8 via each motor 6.7 as the rotational position of each motor 6.7. Similarly, a second bonding point is determined and stored.

この後に、ワイヤー１１を実際にボンディングする動作
をスタートさせると、まず、予め記憶された第１のボン
ディング点の位置（カメラ１が基準となっている）と、
カメラ１とキャピラリー２との位置関係（距離Ｑ）とを
考慮して、ＸＹ子テーブルを各モータ６．７により駆動
し、第１のボンディング点上にキャピラリー２を移動さ
せる。After this, when the operation of actually bonding the wire 11 is started, first, the position of the first bonding point stored in advance (camera 1 is the reference),
Considering the positional relationship (distance Q) between the camera 1 and the capillary 2, the XY child table is driven by each motor 6.7 to move the capillary 2 onto the first bonding point.

第１のボンディング点に達すると、キャピラリー２がワ
ーク９上に降下し、ワイヤー１１をワーク９上の所定位
置にボンディングする。When the first bonding point is reached, the capillary 2 descends onto the workpiece 9 and the wire 11 is bonded to a predetermined position on the workpiece 9.

ついで、同様にして第２のボンディング点に移動し、ボ
ンディングを行なった後、ワイヤー１１を切断すること
によって、第１のボンディング点と第２のボンディング
点とがワイヤー１１により結ばれる。Next, the first bonding point and the second bonding point are connected by the wire 11 by moving to the second bonding point and performing bonding in the same manner, and then cutting the wire 11.

［発明が解決しようとする問題点コ 従来のワイヤーボンディング装置は以上のように構成さ
れているので、温度変化に伴い、機構部品、特に超音波
ホーン３がヒーターブロック１０からの熱等により熱膨
張すると、カメラ１とキャピラリー２との距離Ωが初期
設定と異なってくる。[Problems to be Solved by the Invention] Since the conventional wire bonding apparatus is configured as described above, mechanical parts, especially the ultrasonic horn 3, undergo thermal expansion due to heat from the heater block 10 due to temperature changes. Then, the distance Ω between the camera 1 and the capillary 2 becomes different from the initial setting.

通常、第３図に示すモニタ１２の画面１６中のクロスラ
イン１５でワーク９上におけるチップ１３のポンディン
グパッド１４中心をボンディング点と定めた場合には、
ワイヤーボール１７が、第４図に示すように配置されて
ボンディングされるべきところが、上述のように熱膨張
によりカメラ１とキャピラリー２との距離Ｑが変化する
と、第５図に示すように、ワイヤーボール１７の位置つ
まりボンディング点がずれるという問題点があった。Normally, when the center of the bonding pad 14 of the chip 13 on the workpiece 9 is determined as the bonding point by the cross line 15 on the screen 16 of the monitor 12 shown in FIG.
The wire ball 17 should be arranged and bonded as shown in FIG. 4, but when the distance Q between the camera 1 and the capillary 2 changes due to thermal expansion as described above, the wire ball 17 is arranged and bonded as shown in FIG. There was a problem in that the position of the ball 17, that is, the bonding point, was shifted.

この発明は上記のような問題点を解消するためになされ
たもので、熱膨張によってカメラとキャピラリーとの距
離が初期設定値から変化しても、これを自動的に補正し
、温度変化によるボンディング点ずれを生じることなく
、正確にボンディングを行なえるようにしたワイヤーボ
ンディング装置を得ることを目的とする。This invention was made to solve the above-mentioned problems. Even if the distance between the camera and the capillary changes from the initial setting value due to thermal expansion, this invention is automatically corrected, and bonding due to temperature changes is prevented. It is an object of the present invention to provide a wire bonding device capable of performing bonding accurately without causing point deviation.

［問題点を解決するための手段］ この発明に係るワイヤーボンディング装置は。[Means for solving problems] A wire bonding device according to the present invention.

ホーンに取り付けられ同ホーンの温度を検出する温度検
出手段と、同温度検出手段からの検出結果に基づき上記
ホーンの熱膨張による長さ変化分を求め予め設定される
キャピラリーとカメラとの距離を補正する補正手段とを
設けたものである。A temperature detection means attached to the horn detects the temperature of the horn, and based on the detection result from the temperature detection means, the length change due to thermal expansion of the horn is calculated and the distance between the capillary and the camera set in advance is corrected. A correction means is provided.

［作　　　用］ この発明におけるワイヤーボンディング装置では、温度
検出手段がホーンの温度を検出しその検出結果を補正手
段に送る。そして、この補正手段は、上記温度検出手段
からの温度変化分に対応する上記ホーンの熱膨張による
長さ変化分を求めた後、その長さ変化分に応じて、予め
設定されるキャピラリーとカメラとの距離（初期設定値
）を増減・補正する。これにより、モニタの画面上で定
められたボンディング点と、実際に上記キャピラリーに
よりワイヤーをボンディングされる位置とにずれが生じ
るのを防止できる。[Function] In the wire bonding apparatus according to the present invention, the temperature detection means detects the temperature of the horn and sends the detection result to the correction means. This correction means calculates a length change due to thermal expansion of the horn corresponding to a temperature change from the temperature detection means, and then sets a capillary and a camera in advance according to the length change. Increase/decrease/correct the distance to (initial setting value). This can prevent a deviation between the bonding point defined on the monitor screen and the position where the wire is actually bonded by the capillary.

［発明の実施例］ 以下、この発明の一実施例を図について説明する。第１
図はこの発明の一実施例によるワイヤーボンディング装
置を示す構成図であり、この第１図中、既述の符号と同
一の符号は同一または相当部分を示しているので、その
説明は省略する。[Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1st
FIG. 1 is a configuration diagram showing a wire bonding apparatus according to an embodiment of the present invention. In FIG. 1, the same reference numerals as those already described indicate the same or corresponding parts, and the explanation thereof will be omitted.

第１図において、１８は超音波ホーン３に取り付けられ
この超音波ホーン３の温度を検出する温度検出手段とし
ての温度センサ、１９は補正手段としてのデコーダで、
このデコーダ１９は、温度センサ１８からの検出結果（
温度変化分）を超音波ホーン３の熱膨張による長さ変化
分に変換し、求められた長さ変化分に基づいて、予めＸ
Ｙコントローラ８内に設定されているキャピラリー２と
カメラ１との距離（初期設定値）を補正するものである
。In FIG. 1, 18 is a temperature sensor attached to the ultrasonic horn 3 and serves as a temperature detection means for detecting the temperature of the ultrasonic horn 3; 19 is a decoder as a correction means;
This decoder 19 receives the detection result from the temperature sensor 18 (
The temperature change) is converted into the length change due to thermal expansion of the ultrasonic horn 3, and based on the obtained length change,
This is to correct the distance (initial setting value) between the capillary 2 and the camera 1 that is set in the Y controller 8.

次に、本実施例の装置の動作について説明するが、基本
的動作つまりワイヤー１１をワーク９にボンディングす
る動作は、従来装置と全く同様であるので、その説明は
省略する。Next, the operation of the apparatus of this embodiment will be described, but since the basic operation, that is, the operation of bonding the wire 11 to the workpiece 9, is completely the same as that of the conventional apparatus, the explanation thereof will be omitted.

本実施例の装置では、ヒーターブロック１０によって発
せられる熱等により超音波ホーン３の温度が変化すると
、その変化分が、温度センサ１８により検出され、その
検出信号がデコーダ１９に送られる。デコーダ１９は、
温度変化分についての検出信号を、温度変化（熱膨張）
に伴う超音波ホーン３の長さ変化分に換算して、その信
号をＸＹコントローラ８へ送出し、このＸＹコントロー
ラ８内に初期設定されているカメラ１とキャピラリー２
との距離Ｑ（第２図参照）を、上記長さ変化分に応じて
増減し補正する。In the device of this embodiment, when the temperature of the ultrasonic horn 3 changes due to heat generated by the heater block 10, the change is detected by the temperature sensor 18, and the detection signal is sent to the decoder 19. The decoder 19 is
The detection signal for the temperature change is detected by the temperature change (thermal expansion).
The signal is converted into the length change of the ultrasonic horn 3 due to the change in length and sent to the XY controller 8, and the camera 1 and capillary 2 initially set in the XY controller 8 are
The distance Q (see FIG. 2) between the two ends is corrected by increasing or decreasing in accordance with the above-mentioned length change.

これにより、各モータ６．７を介してＸＹ子テーブルの
移動量が調整・制御され、モニタ１２の画面上で定めら
れたボンディング点と、実際にキャピラリー２によりワ
イヤー１１をボンディングされる位置とにずれが生じる
のを防止できるので、常に、設定されたボンディング点
に正確にボンディングを行なえるのである。As a result, the amount of movement of the XY child table is adjusted and controlled via each motor 6.7, and the bonding point determined on the screen of the monitor 12 and the position where the wire 11 is actually bonded by the capillary 2 are adjusted and controlled. Since misalignment can be prevented, bonding can always be performed accurately at the set bonding point.

なお、上記実施例では、温度検出手段として、温度セン
サ１８により超音波ホーン３の温度変化を直接検出する
ようにしているが、温度変化（ホーン長さ変化）に伴う
超音波ホーン３の共振周波数の変化を検出することによ
り、間接的に温度変化を検出してもよく、この場合も上
記実施例と同様の効果を奏する。In the above embodiment, the temperature sensor 18 is used as the temperature detection means to directly detect the temperature change of the ultrasonic horn 3, but the resonance frequency of the ultrasonic horn 3 due to the temperature change (horn length change) The temperature change may be indirectly detected by detecting the change in the temperature, and in this case, the same effect as in the above embodiment can be obtained.

［発明の効果］ 以上のように、この発明によれば、温度検出手段により
ホーンの温度を検出し、検出された温度変化分に対応す
る上記ホーンの長さ変化分に応じて、予め設定されたキ
ャピラリーとカメラとの距離を補正手段により増減・補
正するように構成したので、熱膨張によってカメラとキ
ャピラリーとの距離が初期設定値から変化しても、これ
を自動的に補正でき二温度変化によるボンディング点ず
れを全く生じることなく、常に、設定されたボンディン
グ点に正確にボンディングを行なえる効果がある。[Effects of the Invention] As described above, according to the present invention, the temperature of the horn is detected by the temperature detection means, and the temperature is set in advance according to the length change of the horn corresponding to the detected temperature change. Since the distance between the capillary and the camera is configured to be increased/decreased/corrected by the correction means, even if the distance between the camera and the capillary changes from the initial setting value due to thermal expansion, this can be automatically corrected and the distance between the capillary and the camera can be corrected automatically. This has the effect that bonding can always be performed accurately at the set bonding point without causing any bonding point shift due to

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明の一実施例によるワイヤーボンディン
グ装置を示す構成図、第２図は従来のワイヤーボンディ
ング装置を示す構成図、第３図はボンディング点を設定
するときのモニタ画面の例を示す図、第４図は温度変化
のない場合でのワイヤーボンディング状態を示す図、第
５図は温度変化のある場合でのワイヤーボンディング状
態を示す図である。 図において、１−カメラ、２−キャピラリー、３−超音
波ホーン、４−台座としてのボンディングヘッド、５−
ＸＹ子テーブル６−Ｙ方向モータ、７−Ｘ方向モータ、
８−ＸＹコントローラ、９−被ボンディング材としての
ワーク、１１・−ワイヤー、１２−・−モニタ、１８−
・温度検出手段としての温度センサ、１９−補正手段と
してのデコーダ。 なお、図中、同一の符号は同一、又は相当部分を示して
いる。FIG. 1 is a block diagram showing a wire bonding device according to an embodiment of the present invention, FIG. 2 is a block diagram showing a conventional wire bonding device, and FIG. 3 is a block diagram showing an example of a monitor screen when setting bonding points. 4 are diagrams showing the wire bonding state when there is no temperature change, and FIG. 5 is a diagram showing the wire bonding state when there is a temperature change. In the figure, 1-camera, 2-capillary, 3-ultrasonic horn, 4-bonding head as a pedestal, 5-
XY child table 6-Y direction motor, 7-X direction motor,
8-XY controller, 9-work as bonding material, 11--wire, 12--monitor, 18-
- Temperature sensor as temperature detection means, 19-decoder as correction means. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 　ワイヤーを導きながら同ワイヤーを被ボンディング材
の所定位置にボンディングするキャピラリーと、同キャ
ピラリーを支持して台座に固定するホーンと、上記台座
に固定され上記被ボンディング材を撮像するカメラと、
同カメラからの画像を映し出すモニタと、上記台座の位
置を駆動制御する駆動制御手段とをそなえ、上記台座を
駆動し上記カメラを移動させて上記モニタの画面上でボ
ンディング点を定め、上記駆動制御手段により、予め設
定される上記のキャピラリーとカメラとの距離を考慮し
ながら上記キャピラリーを上記ボンディング点上に移動
させてからボンディングを行なうワイヤーボンディング
装置において、上記ホーンに取り付けられ同ホーンの温
度を検出する温度検出手段と、同温度検出手段からの検
出結果に基づき上記ホーンの熱膨張による長さ変化分を
求め予め設定される上記のキャピラリーとカメラとの距
離を補正する補正手段とが設けられたことを特徴とする
ワイヤーボンディング装置。a capillary that guides the wire and bonds the wire to a predetermined position of the bonding material; a horn that supports the capillary and fixes it to a pedestal; and a camera that is fixed to the pedestal and takes an image of the bonding material;
A monitor for displaying an image from the camera and a drive control means for driving and controlling the position of the pedestal are provided, the pedestal is driven and the camera is moved to determine a bonding point on the screen of the monitor, and the drive control means is provided. In a wire bonding device that performs bonding after moving the capillary to the bonding point while taking into account a preset distance between the capillary and the camera, the wire bonding device is attached to the horn and detects the temperature of the horn. and a correction means for correcting the distance between the capillary and the camera, which is set in advance by calculating the length change due to thermal expansion of the horn based on the detection result from the temperature detection means. A wire bonding device characterized by:
JP62322111A 1987-12-17 1987-12-17 Wire bonding apparatus Pending JPH01161727A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62322111A JPH01161727A (en) 1987-12-17 1987-12-17 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62322111A JPH01161727A (en) 1987-12-17 1987-12-17 Wire bonding apparatus

Publications (1)

Publication Number Publication Date
JPH01161727A true JPH01161727A (en) 1989-06-26

Family

ID=18140038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62322111A Pending JPH01161727A (en) 1987-12-17 1987-12-17 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPH01161727A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261114A (en) * 2001-03-02 2002-09-13 Nec Corp Wire bonding apparatus and wire bonding method
US8091761B2 (en) * 2008-03-31 2012-01-10 Shinkawa Ltd. Bonding apparatus and bonding method
CN104708157A (en) * 2013-12-17 2015-06-17 库利克和索夫工业公司 Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
US20180161914A1 (en) * 2016-12-09 2018-06-14 Branson Ultrasonics Corporation Dynamic Adjustment Of Weld Parameter Of An Ultrasonic Welder

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261114A (en) * 2001-03-02 2002-09-13 Nec Corp Wire bonding apparatus and wire bonding method
US6669076B2 (en) 2001-03-02 2003-12-30 Nec Electronics Corporation Wire bonding device
US8091761B2 (en) * 2008-03-31 2012-01-10 Shinkawa Ltd. Bonding apparatus and bonding method
CN104708157A (en) * 2013-12-17 2015-06-17 库利克和索夫工业公司 Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
US20150171049A1 (en) * 2013-12-17 2015-06-18 Kulicke And Soffa Industries, Inc. Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
US9165902B2 (en) * 2013-12-17 2015-10-20 Kulicke And Soffa Industries, Inc. Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
US9478516B2 (en) 2013-12-17 2016-10-25 Kulicke And Soffa Industries, Inc. Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
US20180161914A1 (en) * 2016-12-09 2018-06-14 Branson Ultrasonics Corporation Dynamic Adjustment Of Weld Parameter Of An Ultrasonic Welder
JP2018094629A (en) * 2016-12-09 2018-06-21 ブランソン・ウルトラソニックス・コーポレーション Dynamic adjustment of weld parameter of ultrasonic welder
CN108215213A (en) * 2016-12-09 2018-06-29 必能信超声公司 The dynamic adjustment of the welding parameter of ultrasonic welding machine
CN108215213B (en) * 2016-12-09 2020-04-28 必能信超声公司 Dynamic adjustment of welding parameters for ultrasonic welding machines
US10722973B2 (en) 2016-12-09 2020-07-28 Branson Ultrasonics Corporation Dynamic adjustment of weld parameter of an ultrasonic welder

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