JPS61270078A - 研削盤における研削方法 - Google Patents

研削盤における研削方法

Info

Publication number
JPS61270078A
JPS61270078A JP11368985A JP11368985A JPS61270078A JP S61270078 A JPS61270078 A JP S61270078A JP 11368985 A JP11368985 A JP 11368985A JP 11368985 A JP11368985 A JP 11368985A JP S61270078 A JPS61270078 A JP S61270078A
Authority
JP
Japan
Prior art keywords
grinding
abrasive grains
wheel
dressing
diamond wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11368985A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04788B2 (enExample
Inventor
Teruhiro Nakamura
彰宏 中村
Katsumi Uesugi
上杉　勝美
Ryozo Kikuma
菊間　良三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP11368985A priority Critical patent/JPS61270078A/ja
Publication of JPS61270078A publication Critical patent/JPS61270078A/ja
Publication of JPH04788B2 publication Critical patent/JPH04788B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP11368985A 1985-05-27 1985-05-27 研削盤における研削方法 Granted JPS61270078A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11368985A JPS61270078A (ja) 1985-05-27 1985-05-27 研削盤における研削方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11368985A JPS61270078A (ja) 1985-05-27 1985-05-27 研削盤における研削方法

Publications (2)

Publication Number Publication Date
JPS61270078A true JPS61270078A (ja) 1986-11-29
JPH04788B2 JPH04788B2 (enExample) 1992-01-08

Family

ID=14618686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11368985A Granted JPS61270078A (ja) 1985-05-27 1985-05-27 研削盤における研削方法

Country Status (1)

Country Link
JP (1) JPS61270078A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009088027A (ja) * 2007-09-27 2009-04-23 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの両面研磨方法
JP2016068218A (ja) * 2014-09-30 2016-05-09 株式会社ノリタケカンパニーリミテド 砥石及び砥石製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52165493U (enExample) * 1976-06-09 1977-12-15
JPS57162037U (enExample) * 1981-04-01 1982-10-12

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52165493U (enExample) * 1976-06-09 1977-12-15
JPS57162037U (enExample) * 1981-04-01 1982-10-12

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009088027A (ja) * 2007-09-27 2009-04-23 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの両面研磨方法
JP2016068218A (ja) * 2014-09-30 2016-05-09 株式会社ノリタケカンパニーリミテド 砥石及び砥石製造方法

Also Published As

Publication number Publication date
JPH04788B2 (enExample) 1992-01-08

Similar Documents

Publication Publication Date Title
US6645043B1 (en) Method and apparatus for cold-end processing full lead crystal
JPH1071549A (ja) 遊離砥粒によるウエーハの面取装置及び面取方法
TWI513548B (zh) 磨石及使用其之研削研磨裝置
JP2003300165A (ja) セグメントタイプ砥石
US3177628A (en) Grinding of materials with hard abrasives
JPH04315574A (ja) 固定式の形直しおよび目直し用微小切刃ダイヤモンドブロックおよびそれの使用方法
JPS61270078A (ja) 研削盤における研削方法
JPS61226260A (ja) 研削盤におけるドレツシング装置
JP3719780B2 (ja) 超砥粒砥石のツルーイング方法
US3243922A (en) Surfacing of materials
JPS62152674A (ja) 研削砥石の目詰り防止装置
JPS61226266A (ja) 研削盤における研削方法
JPH0957614A (ja) 両面砥石ラッピング装置
JPH05208373A (ja) 切断砥石及び切断方法
JP2000326236A (ja) 縦軸研削用砥石
JP2005271157A (ja) ラップホイール
US3236009A (en) Apparatus for surfacing
JPH05162071A (ja) 研削砥石のドレッシング方法および装置
JP2000210862A (ja) 球体研磨方法および球体研磨装置
JPS6179566A (ja) 超硬質砥粒砥石のドレツシング方法
JPS6279954A (ja) 研削方法
JPS63283865A (ja) 鋳鉄ボンドダイヤモンドまたはｃｂｎ砥石
JPH0222219Y2 (enExample)
JP2534951B2 (ja) ｃＢＮホイ―ル用ツル―イング材
JPS61226272A (ja) ウエ−ハ研削用砥石