JPS61264787A - チツプ部品の保持プレ−ト - Google Patents

チツプ部品の保持プレ−ト

Info

Publication number
JPS61264787A
JPS61264787A JP60106271A JP10627185A JPS61264787A JP S61264787 A JPS61264787 A JP S61264787A JP 60106271 A JP60106271 A JP 60106271A JP 10627185 A JP10627185 A JP 10627185A JP S61264787 A JPS61264787 A JP S61264787A
Authority
JP
Japan
Prior art keywords
holding plate
sheet
plate
chip component
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60106271A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365918B2 (enrdf_load_stackoverflow
Inventor
山口　勝巳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP60106271A priority Critical patent/JPS61264787A/ja
Publication of JPS61264787A publication Critical patent/JPS61264787A/ja
Publication of JPH0365918B2 publication Critical patent/JPH0365918B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP60106271A 1985-05-17 1985-05-17 チツプ部品の保持プレ−ト Granted JPS61264787A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60106271A JPS61264787A (ja) 1985-05-17 1985-05-17 チツプ部品の保持プレ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60106271A JPS61264787A (ja) 1985-05-17 1985-05-17 チツプ部品の保持プレ−ト

Publications (2)

Publication Number Publication Date
JPS61264787A true JPS61264787A (ja) 1986-11-22
JPH0365918B2 JPH0365918B2 (enrdf_load_stackoverflow) 1991-10-15

Family

ID=14429416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60106271A Granted JPS61264787A (ja) 1985-05-17 1985-05-17 チツプ部品の保持プレ−ト

Country Status (1)

Country Link
JP (1) JPS61264787A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02158118A (ja) * 1988-12-12 1990-06-18 Murata Mfg Co Ltd チップ部品の保持プレート
JPH04113498U (ja) * 1991-03-23 1992-10-05 太陽誘電株式会社 チツプ状回路部品マウント装置用テンプレート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153259A (enrdf_load_stackoverflow) * 1974-11-06 1976-05-11 Hitachi Ltd
JPS5653576U (enrdf_load_stackoverflow) * 1979-10-02 1981-05-11
JPS5726397U (enrdf_load_stackoverflow) * 1980-07-22 1982-02-10

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153259A (enrdf_load_stackoverflow) * 1974-11-06 1976-05-11 Hitachi Ltd
JPS5653576U (enrdf_load_stackoverflow) * 1979-10-02 1981-05-11
JPS5726397U (enrdf_load_stackoverflow) * 1980-07-22 1982-02-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02158118A (ja) * 1988-12-12 1990-06-18 Murata Mfg Co Ltd チップ部品の保持プレート
JPH04113498U (ja) * 1991-03-23 1992-10-05 太陽誘電株式会社 チツプ状回路部品マウント装置用テンプレート

Also Published As

Publication number Publication date
JPH0365918B2 (enrdf_load_stackoverflow) 1991-10-15

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term