JPS5866652U - 半導体素子用取付け構造 - Google Patents

半導体素子用取付け構造

Info

Publication number
JPS5866652U
JPS5866652U JP1982146407U JP14640782U JPS5866652U JP S5866652 U JPS5866652 U JP S5866652U JP 1982146407 U JP1982146407 U JP 1982146407U JP 14640782 U JP14640782 U JP 14640782U JP S5866652 U JPS5866652 U JP S5866652U
Authority
JP
Japan
Prior art keywords
mounting structure
spacer
semiconductor element
semiconductor devices
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982146407U
Other languages
English (en)
Inventor
デビツド・デイ・ポラ−ド
テイング−ロング・ホ−
Original Assignee
ウエスチングハウス　エレクトリック　コ−ポレ−ション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ウエスチングハウス　エレクトリック　コ−ポレ−ション filed Critical ウエスチングハウス　エレクトリック　コ−ポレ−ション
Publication of JPS5866652U publication Critical patent/JPS5866652U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図はこの考案に係る半導体素子アセンブリの一実施
例を示す立面図、第２図は第１図の線■−■沿いに切っ
た断面図、第３図は第２図に示したスペーサの他の例を
示す平面図、第４図は線■−ＩＶ沿い１こ切った第３図
のスペーサの断面図である。 １０ａと１０ｂは圧接面、１０は平形半導体素　−子、
２０と２８はくぼみ、１２と２６はスペーサ、１６は力
印加手段、２２と３０は凸面である。

Claims (1)

  1. 【実用新案登録請求の範囲】 １　対抗する圧接面を持つ平形半導体素子と、−側にく
    ぼみを持ち、このくぼみのある側が前記半導体素子の一
    方の圧接面と接触して配置されるスペーサと、 所定の力を加えて前記半導体素子と前記スペーサを良く
    接触させるための手段と、 前記力を前記スペーサの他側に集中させるための手段と
    、 を備えた半導体素子用取付は構造。 ２　力を集中させるための手段は、スペーサの他側の凸
    面である実用新案登録請求の範囲第１項記載の半導体素
    子用取付は構造。
JP1982146407U 1981-10-02 1982-09-29 半導体素子用取付け構造 Pending JPS5866652U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/308,320 US4504850A (en) 1981-10-02 1981-10-02 Disc-type semiconductor mounting arrangement with force distribution spacer
US308320 1994-09-19

Publications (1)

Publication Number Publication Date
JPS5866652U true JPS5866652U (ja) 1983-05-06

Family

ID=23193507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982146407U Pending JPS5866652U (ja) 1981-10-02 1982-09-29 半導体素子用取付け構造

Country Status (2)

Country Link
US (1) US4504850A (ja)
JP (1) JPS5866652U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015130718A (ja) * 2014-01-06 2015-07-16 東芝三菱電機産業システム株式会社 電力変換装置
JP2019140176A (ja) * 2018-02-07 2019-08-22 株式会社Ｓｏｋｅｎ 半導体装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4896205A (en) * 1987-07-14 1990-01-23 Rockwell International Corporation Compact reduced parasitic resonant frequency pulsed power source at microwave frequencies
US4985752A (en) * 1988-08-01 1991-01-15 Sundstrand Corporation Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements
US4954876A (en) * 1988-08-01 1990-09-04 Sundstrand Corporation Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements
US5034803A (en) * 1988-08-01 1991-07-23 Sundstrand Corporation Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies
US4830979A (en) * 1988-08-01 1989-05-16 Sundstrand Corp. Method of manufacturing hermetically sealed compression bonded circuit assemblies
DE3838085A1 (de) * 1988-11-10 1990-05-17 Rheinmetall Gmbh Beschleunigungsfeste verpackung fuer integrierte schaltungen und verfahren zu ihrer herstellung
US4947287A (en) * 1988-11-30 1990-08-07 Sundstrand Corporation Capacitor cooling arrangement
US4994890A (en) * 1989-11-27 1991-02-19 Snap-On Tools Corporation Rectifier structure with individual links
US5749413A (en) * 1991-09-23 1998-05-12 Sundstrand Corporation Heat exchanger for high power electrical component and package incorporating same
US7211884B1 (en) 2002-01-28 2007-05-01 Pacesetter, Inc. Implantable medical device construction using a flexible substrate
US8464781B2 (en) * 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
US20080013278A1 (en) * 2006-06-30 2008-01-17 Fredric Landry Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles
US7773382B2 (en) * 2007-08-22 2010-08-10 Rockwell Automation Technologies, Inc. System and method for supporting one or more heat-generating electrical devices
CN108216928A (zh) * 2017-12-28 2018-06-29 惠州市华星光电技术有限公司 一种用于保护液晶面板的间隔垫片

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4718967U (ja) * 1971-03-31 1972-11-02

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2368843A (en) * 1943-05-10 1945-02-06 Thomas E Jackson Clamp
US2486482A (en) * 1945-10-18 1949-11-01 Bell Telephone Labor Inc Sealed container for electrode assemblies
US3448957A (en) * 1967-05-31 1969-06-10 Master Appliances Inc Wig block support
US3704014A (en) * 1971-02-08 1972-11-28 Robert F Keene Quick adjusting c-clamp
US3723836A (en) * 1972-03-15 1973-03-27 Motorola Inc High power semiconductor device included in a standard outline housing
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly
DE2603813C2 (de) * 1976-02-02 1982-11-18 Brown, Boveri & Cie Ag, 6800 Mannheim Spannvorrichtung für ein thermisch und elektrisch druckkontaktiertes Halbleiterbauelement in Scheibenzellenbauweise

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4718967U (ja) * 1971-03-31 1972-11-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015130718A (ja) * 2014-01-06 2015-07-16 東芝三菱電機産業システム株式会社 電力変換装置
JP2019140176A (ja) * 2018-02-07 2019-08-22 株式会社Ｓｏｋｅｎ 半導体装置

Also Published As

Publication number Publication date
US4504850A (en) 1985-03-12

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