JPS61261473A - スパツタリング装置 - Google Patents

スパツタリング装置

Info

Publication number
JPS61261473A
JPS61261473A JP10341385A JP10341385A JPS61261473A JP S61261473 A JPS61261473 A JP S61261473A JP 10341385 A JP10341385 A JP 10341385A JP 10341385 A JP10341385 A JP 10341385A JP S61261473 A JPS61261473 A JP S61261473A
Authority
JP
Japan
Prior art keywords
sputtering
target
cathode
gas
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10341385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH024674B2 (enExample
Inventor
Noboru Kuriyama
昇 栗山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuda Seisakusho Co Ltd
Original Assignee
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuda Seisakusho Co Ltd filed Critical Tokuda Seisakusho Co Ltd
Priority to JP10341385A priority Critical patent/JPS61261473A/ja
Publication of JPS61261473A publication Critical patent/JPS61261473A/ja
Publication of JPH024674B2 publication Critical patent/JPH024674B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP10341385A 1985-05-15 1985-05-15 スパツタリング装置 Granted JPS61261473A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10341385A JPS61261473A (ja) 1985-05-15 1985-05-15 スパツタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10341385A JPS61261473A (ja) 1985-05-15 1985-05-15 スパツタリング装置

Publications (2)

Publication Number Publication Date
JPS61261473A true JPS61261473A (ja) 1986-11-19
JPH024674B2 JPH024674B2 (enExample) 1990-01-30

Family

ID=14353359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10341385A Granted JPS61261473A (ja) 1985-05-15 1985-05-15 スパツタリング装置

Country Status (1)

Country Link
JP (1) JPS61261473A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6415370A (en) * 1987-07-08 1989-01-19 Matsushita Electric Industrial Co Ltd Dc sputtering method
US5015493A (en) * 1987-01-11 1991-05-14 Reinar Gruen Process and apparatus for coating conducting pieces using a pulsed glow discharge
WO1998034267A1 (de) * 1997-02-01 1998-08-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur regelung von glimmentladungen mit pulsförmiger energieversorgung
US20110247928A1 (en) * 2008-12-15 2011-10-13 Naoki Morimnoto Sputtering apparatus and sputtering method
JP5495083B1 (ja) * 2013-02-28 2014-05-21 株式会社アヤボ パルススパッタ装置
WO2014132852A1 (ja) * 2013-02-28 2014-09-04 株式会社アヤボ パルススパッタ装置およびパルススパッタ方法
US10283333B2 (en) 2013-05-29 2019-05-07 Japan Science And Technology Agency Nanocluster production device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015493A (en) * 1987-01-11 1991-05-14 Reinar Gruen Process and apparatus for coating conducting pieces using a pulsed glow discharge
JPS6415370A (en) * 1987-07-08 1989-01-19 Matsushita Electric Industrial Co Ltd Dc sputtering method
WO1998034267A1 (de) * 1997-02-01 1998-08-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur regelung von glimmentladungen mit pulsförmiger energieversorgung
US20110247928A1 (en) * 2008-12-15 2011-10-13 Naoki Morimnoto Sputtering apparatus and sputtering method
US8834685B2 (en) * 2008-12-15 2014-09-16 Ulvac, Inc. Sputtering apparatus and sputtering method
JP5550565B2 (ja) * 2008-12-15 2014-07-16 株式会社アルバック スパッタリング装置及びスパッタリング方法
WO2014132852A1 (ja) * 2013-02-28 2014-09-04 株式会社アヤボ パルススパッタ装置およびパルススパッタ方法
JP5495083B1 (ja) * 2013-02-28 2014-05-21 株式会社アヤボ パルススパッタ装置
JP2014194069A (ja) * 2013-02-28 2014-10-09 Ayabo:Kk パルススパッタ装置およびパルススパッタ方法
US20160005577A1 (en) * 2013-02-28 2016-01-07 Ayabo Corporation Pulsed Sputtering Apparatus and Pulsed Sputtering Method
EP2963149A4 (en) * 2013-02-28 2016-10-12 Ayabo Corp PULSED SPUTTER AND PULSED SPUTTER PROCESS
US10818483B2 (en) 2013-02-28 2020-10-27 Ayabo Corporation Pulsed sputtering apparatus and pulsed sputtering method
US10283333B2 (en) 2013-05-29 2019-05-07 Japan Science And Technology Agency Nanocluster production device

Also Published As

Publication number Publication date
JPH024674B2 (enExample) 1990-01-30

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Legal Events

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