JPS61259555A - 半導体装置用Ｃｕ合金製ボンデイングワイヤ - Google Patents

半導体装置用Ｃｕ合金製ボンデイングワイヤ

Info

Publication number
JPS61259555A
JPS61259555A JP60102233A JP10223385A JPS61259555A JP S61259555 A JPS61259555 A JP S61259555A JP 60102233 A JP60102233 A JP 60102233A JP 10223385 A JP10223385 A JP 10223385A JP S61259555 A JPS61259555 A JP S61259555A
Authority
JP
Japan
Prior art keywords
alloy
bonding wire
bonding
wire
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60102233A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0413858B2 (enExample
Inventor
Naoyuki Hosoda
細田　直之
Naoki Uchiyama
直樹 内山
Toshiaki Ono
敏昭 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP60102233A priority Critical patent/JPS61259555A/ja
Publication of JPS61259555A publication Critical patent/JPS61259555A/ja
Publication of JPH0413858B2 publication Critical patent/JPH0413858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Wire Bonding (AREA)
JP60102233A 1985-05-14 1985-05-14 半導体装置用Ｃｕ合金製ボンデイングワイヤ Granted JPS61259555A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60102233A JPS61259555A (ja) 1985-05-14 1985-05-14 半導体装置用Ｃｕ合金製ボンデイングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60102233A JPS61259555A (ja) 1985-05-14 1985-05-14 半導体装置用Ｃｕ合金製ボンデイングワイヤ

Publications (2)

Publication Number Publication Date
JPS61259555A true JPS61259555A (ja) 1986-11-17
JPH0413858B2 JPH0413858B2 (enExample) 1992-03-11

Family

ID=14321923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60102233A Granted JPS61259555A (ja) 1985-05-14 1985-05-14 半導体装置用Ｃｕ合金製ボンデイングワイヤ

Country Status (1)

Country Link
JP (1) JPS61259555A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6456841A (en) * 1987-08-27 1989-03-03 Nippon Mining Co Copper alloy foil for flexible circuit board
JP2007226058A (ja) * 2006-02-24 2007-09-06 Tosoh Corp 液晶ディスプレイパネル及びその製造方法並びにＣｕ合金スパッタリングターゲット
EP2133915A1 (de) * 2008-06-09 2009-12-16 Micronas GmbH Halbleiteranordnung mit besonders gestalteten Bondleitungen und Verfahren zum Herstellen einer solchen Anordnung

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124960A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124960A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6456841A (en) * 1987-08-27 1989-03-03 Nippon Mining Co Copper alloy foil for flexible circuit board
JP2007226058A (ja) * 2006-02-24 2007-09-06 Tosoh Corp 液晶ディスプレイパネル及びその製造方法並びにＣｕ合金スパッタリングターゲット
EP2133915A1 (de) * 2008-06-09 2009-12-16 Micronas GmbH Halbleiteranordnung mit besonders gestalteten Bondleitungen und Verfahren zum Herstellen einer solchen Anordnung
US8174104B2 (en) 2008-06-09 2012-05-08 Micronas Gmbh Semiconductor arrangement having specially fashioned bond wires

Also Published As

Publication number Publication date
JPH0413858B2 (enExample) 1992-03-11

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