JPS61259538A - 半導体ウエハ移送箱 - Google Patents

半導体ウエハ移送箱

Info

Publication number
JPS61259538A
JPS61259538A JP10055885A JP10055885A JPS61259538A JP S61259538 A JPS61259538 A JP S61259538A JP 10055885 A JP10055885 A JP 10055885A JP 10055885 A JP10055885 A JP 10055885A JP S61259538 A JPS61259538 A JP S61259538A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
container
lid
transfer box
feeding box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10055885A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0562822B2 (enrdf_load_stackoverflow
Inventor
Masakazu Ishino
正和 石野
Ryuichi Funatsu
隆一 船津
Tsutomu Takahashi
勉 高橋
Fumikazu Ito
伊藤　文和
Tatsuya Araya
新家　達弥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10055885A priority Critical patent/JPS61259538A/ja
Publication of JPS61259538A publication Critical patent/JPS61259538A/ja
Publication of JPH0562822B2 publication Critical patent/JPH0562822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
JP10055885A 1985-05-14 1985-05-14 半導体ウエハ移送箱 Granted JPS61259538A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10055885A JPS61259538A (ja) 1985-05-14 1985-05-14 半導体ウエハ移送箱

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10055885A JPS61259538A (ja) 1985-05-14 1985-05-14 半導体ウエハ移送箱

Publications (2)

Publication Number Publication Date
JPS61259538A true JPS61259538A (ja) 1986-11-17
JPH0562822B2 JPH0562822B2 (enrdf_load_stackoverflow) 1993-09-09

Family

ID=14277259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10055885A Granted JPS61259538A (ja) 1985-05-14 1985-05-14 半導体ウエハ移送箱

Country Status (1)

Country Link
JP (1) JPS61259538A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107618763A (zh) * 2017-09-20 2018-01-23 长兴三通能源科技有限公司 一种防火散热型电子元器件收纳盒

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107618763A (zh) * 2017-09-20 2018-01-23 长兴三通能源科技有限公司 一种防火散热型电子元器件收纳盒

Also Published As

Publication number Publication date
JPH0562822B2 (enrdf_load_stackoverflow) 1993-09-09

Similar Documents

Publication Publication Date Title
US5752796A (en) Vacuum integrated SMIF system
JP3202991B2 (ja) 閉鎖された密封可能で掃気可能な半導体ウェーハ保持装置
US6352403B1 (en) Controlled environment enclosure and mechanical interface
JP2525284B2 (ja) クリ―ン搬送方法及び装置
TW434175B (en) System for transferring wafers from cassettes to furnaces and method
EP0570967B1 (en) Vacuum container
JPH0774227A (ja) マイクロ環境下のロードロック
JP3265252B2 (ja) 半導体収納治具、ハンドリング方法及び生産システム
JP2023111721A (ja) 基板処理システム及びパーティクル除去方法
JPS61259538A (ja) 半導体ウエハ移送箱
US5515618A (en) Substrate transportation system
KR100823430B1 (ko) 카세트 반송 방법 및 카세트 반송 시스템
JP4260298B2 (ja) 半導体部品の製造方法
KR20030065275A (ko) 비마찰식 도어를 갖는 기판 저장 용기
JPH0615720B2 (ja) 真空処理装置
JP2550787B2 (ja) 半導体装置の製造装置
JPH04184958A (ja) キャリヤボックス内容物の収容取出方法及び装置
JPH0296348A (ja) ウェハ収納器
TW200428561A (en) A substrate treatment apparatus
JPH08195426A (ja) 真空搬送用インターフェイス装置
JPH04294766A (ja) キャリヤボックスの真空引き方法及びキャリヤボッ　クス
JPH07130831A (ja) 半導体ウエハの収納・搬送装置
JP4007735B2 (ja) 薄板収納容器開閉装置
JPS6246266Y2 (enrdf_load_stackoverflow)
KR200280365Y1 (ko) 스탠더드 미케니컬 인터페이스 시스템

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term