JPS61252643A - 半導体ペレットボンディング装置における吸着用コレットの清掃方法 - Google Patents

半導体ペレットボンディング装置における吸着用コレットの清掃方法

Info

Publication number
JPS61252643A
JPS61252643A JP61083790A JP8379086A JPS61252643A JP S61252643 A JPS61252643 A JP S61252643A JP 61083790 A JP61083790 A JP 61083790A JP 8379086 A JP8379086 A JP 8379086A JP S61252643 A JPS61252643 A JP S61252643A
Authority
JP
Japan
Prior art keywords
pellet
lead frame
collets
sucking
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61083790A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6210022B2 (enrdf_load_stackoverflow
Inventor
Hisaya Suzuki
鈴木　久彌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Seiki Co Ltd filed Critical Toshiba Seiki Co Ltd
Priority to JP61083790A priority Critical patent/JPS61252643A/ja
Publication of JPS61252643A publication Critical patent/JPS61252643A/ja
Publication of JPS6210022B2 publication Critical patent/JPS6210022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
JP61083790A 1986-04-10 1986-04-10 半導体ペレットボンディング装置における吸着用コレットの清掃方法 Granted JPS61252643A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61083790A JPS61252643A (ja) 1986-04-10 1986-04-10 半導体ペレットボンディング装置における吸着用コレットの清掃方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61083790A JPS61252643A (ja) 1986-04-10 1986-04-10 半導体ペレットボンディング装置における吸着用コレットの清掃方法

Publications (2)

Publication Number Publication Date
JPS61252643A true JPS61252643A (ja) 1986-11-10
JPS6210022B2 JPS6210022B2 (enrdf_load_stackoverflow) 1987-03-04

Family

ID=13812440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61083790A Granted JPS61252643A (ja) 1986-04-10 1986-04-10 半導体ペレットボンディング装置における吸着用コレットの清掃方法

Country Status (1)

Country Link
JP (1) JPS61252643A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234999A (ja) * 1988-07-25 1990-02-05 Matsushita Electric Ind Co Ltd 部品装着装置及びその清浄方法
JPH02143598A (ja) * 1988-11-25 1990-06-01 Matsushita Electric Ind Co Ltd 電子部品装着装置
JP2007098241A (ja) * 2005-10-03 2007-04-19 Matsushita Electric Ind Co Ltd 吸着ノズル洗浄方法及び装置と電子部品実装装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234999A (ja) * 1988-07-25 1990-02-05 Matsushita Electric Ind Co Ltd 部品装着装置及びその清浄方法
JPH02143598A (ja) * 1988-11-25 1990-06-01 Matsushita Electric Ind Co Ltd 電子部品装着装置
JP2007098241A (ja) * 2005-10-03 2007-04-19 Matsushita Electric Ind Co Ltd 吸着ノズル洗浄方法及び装置と電子部品実装装置

Also Published As

Publication number Publication date
JPS6210022B2 (enrdf_load_stackoverflow) 1987-03-04

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