JPS61252643A - Cleaning device for sucking collet in semiconductor-pellet bonding apparatus - Google Patents

Cleaning device for sucking collet in semiconductor-pellet bonding apparatus

Info

Publication number
JPS61252643A
JPS61252643A JP61083790A JP8379086A JPS61252643A JP S61252643 A JPS61252643 A JP S61252643A JP 61083790 A JP61083790 A JP 61083790A JP 8379086 A JP8379086 A JP 8379086A JP S61252643 A JPS61252643 A JP S61252643A
Authority
JP
Japan
Prior art keywords
pellet
lead frame
collets
sucking
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61083790A
Other languages
Japanese (ja)
Other versions
JPS6210022B2 (en
Inventor
Hisaya Suzuki
鈴木　久彌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Seiki Co Ltd filed Critical Toshiba Seiki Co Ltd
Priority to JP61083790A priority Critical patent/JPS61252643A/en
Publication of JPS61252643A publication Critical patent/JPS61252643A/en
Publication of JPS6210022B2 publication Critical patent/JPS6210022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To make cleaning efficient, by detecting the absence of a lead frame, which moves on a lead-frame guiding table, with a detector, stopping two sucking collets based on the detected signals at the intermediate positions of the reciprocating movement of the sucking collets, and blowing a gas to the sucking collets. CONSTITUTION:An operating tube 2 is moved forward, lifted and lowered, and one collet A sucks a pellet B, which is accommodated in a container E. The pellet is transferred to a positioner F. Another collet A' sucks the pellet B, whose positioning is finished with the positioner F, in parallel, and the pellet B is transferred on a lead frame H. Then bonding is performed. The operating tube 2 is moved backward, and the collets A and A' are returned to the starting positions. An interval is provided between the preceding lead frame H and the following lead frame, in a lead-frame guiding table G. A detector 4 detects the interval. The collets A and A' are stopped at the intermediate position between the accommodating container E and the positioner F and at the intermediate position between the positioner F and the lead-frame guiding table G. A directional control valve is actuated, a gas is jetted through nozzles 3 and 3' and the sucking surfaces of the collets A and A' are cleaned.

Description

【発明の詳細な説明】 本発明は半導体ペレットボンディング装置における吸着
用コレットの清掃装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cleaning device for a suction collet in a semiconductor pellet bonding device.

半導体ペレットボンディング装置においては、２本のコ
レットを夫々保持アームに取付け、一方のコレットでペ
レット吸着位置から位置決め位置へ、他方のコレットで
位置決め位置からリードフレーム案内台へとペレットを
移乗させ、リードフレーム案内台上を移動するリードフ
レームにペレットを付着させるようになっている。In semiconductor pellet bonding equipment, two collets are attached to respective holding arms, and one collet transfers the pellet from the pellet adsorption position to the positioning position, and the other collet transfers the pellet from the positioning position to the lead frame guide stand, and the lead frame The pellets are attached to a lead frame that moves on a guide table.

吸着用コレットＡは例えば、第１図に示すように、先端
にペレットＢを嵌合する方形の嵌合穴Ｃを設け、この嵌
合穴Ｃに連通する通路りから吸引することによりペレッ
トＢを保持するような構成か、嵌合穴を設けないでフラ
ットな面で保持するような構成になっている。For example, as shown in FIG. 1, the suction collet A has a rectangular fitting hole C at its tip into which the pellet B is fitted, and the pellet B is sucked through a passage communicating with the fitting hole C. The structure is such that it is held, or it is held on a flat surface without a fitting hole.

今、嵌合穴Ｃを設けた場合について説明すると、嵌合穴
ＣにペレットＢの破片或いはゴミ等が付着すると、ペレ
ットＢを確実に保持することができなくなる。しかしな
がら、従来はこの嵌合穴を清掃する有効な手段が提案さ
れていなかった。Now, to explain the case where the fitting hole C is provided, if fragments of the pellet B or dirt or the like adhere to the fitting hole C, the pellet B cannot be held securely. However, no effective means for cleaning this fitting hole has been proposed in the past.

本発明は前記の点に鑑み、簡単に吸着面を清掃すること
ができる半導体ペレットボンディング装置における吸着
用コレットの清掃装置を提供するのが目的である。In view of the above-mentioned points, it is an object of the present invention to provide a cleaning device for a suction collet in a semiconductor pellet bonding apparatus, which allows the suction surface to be easily cleaned.

本発明の構成を第２図に示す回動式に実施した例に基づ
き詳細に説明すると、２個の吸着用コレットＡ、Ａ”は
夫々保持アーム１．１′に取付け、両保持アーム１．１
′を回動及び昇降する作動管２に固定して、一方の吸着
用コレットＡでペレット収納容器Ｅ（ペレット吸着位置
）に収納されているペレットＢを吸着保持して位置決め
装置Ｆ（位置決め位置）へ移乗させ、この位置決め装置
Ｆから他方の吸着用コレットＡ′でリードフレーム案内
台Ｇ上のリードフレームＨ上へペレットＢを移乗させ、
このペレットＢをスクラブ或いは接着によりリードフレ
ームＨに付着させる。The structure of the present invention will be explained in detail based on an example in which the present invention is implemented in a rotary manner as shown in FIG. 1
' is fixed to the actuating tube 2 which rotates and moves up and down, and one suction collet A is used to suction and hold the pellet B stored in the pellet storage container E (pellet suction position), thereby moving the positioning device F (positioning position). Transfer the pellet B from this positioning device F to the lead frame H on the lead frame guide G using the other suction collet A',
This pellet B is attached to the lead frame H by scrubbing or adhesive.

一方、両眼着用コレットＡＳＡ−が移動する軌跡上で且
つペレット収納容器Ｅと位置決め装置１間及び位置決め
装置Ｆとペレット案内台０間に気体噴射ノズル３．３′
を設置し、ペレット案内台Ｇ上に設置したリードフレー
ム検出器４の検出信号により切換弁（図示省略）を作動
させて気体を噴射させるようになっている。On the other hand, the gas injection nozzle 3.3' is placed on the trajectory of the binocular collet ASA-, between the pellet storage container E and the positioning device 1, and between the positioning device F and the pellet guide table 0.
is installed, and a switching valve (not shown) is actuated by a detection signal from a lead frame detector 4 installed on the pellet guide stand G to inject gas.

本発明は前記のように構成したもので、実施例において
はペレットＢを５個す−ドフレームＨに付着させると、
次のリードフレームＨとの間に間隔が設けられる。この
間隔をリードフレーム検出器４で検出して両眼着用コレ
ットＡ、Ａ”を図面で示すように、ペレット収納容器Ｅ
と位置決め位置Ｆの中間位置及び位置決め装置Ｆとペレ
ット案内台Ｇの中間位置で停止させる。The present invention is constructed as described above, and in the embodiment, when five pellets B are attached to the frame H,
A gap is provided between the lead frame H and the next lead frame H. This interval is detected by the lead frame detector 4, and the binocular collets A, A'' are detected in the pellet storage container E as shown in the drawing.
and the positioning position F, and at the intermediate position between the positioning device F and the pellet guide G.

尚、吸着用コレットＡ、Ａ＝の中間位置での停止は保持
アーム１．１−の駆動源を停止させることにより簡単に
行なえる。Incidentally, the suction collets A, A= can be easily stopped at an intermediate position by stopping the drive source of the holding arm 1.1-.

前記の両眼着用コレットＡ、Ａ−が中間位置で停止する
と、リードフレーム検出器４の信号により切換弁（図示
省略〉が作動して気体噴射ノズル３．３′から空気等の
気体を噴射して両眼着用コレットＡ、Ａ＝の吸着面を清
掃する。When the binocular collets A and A- stop at the intermediate position, a switching valve (not shown) is actuated by a signal from the lead frame detector 4, and a gas such as air is injected from the gas injection nozzle 3.3'. Clean the suction surfaces of binocular collets A and A=.

清掃後は、両眼着用コレットＡ、Ａ”を作業開始位置へ
夫々移動させ、ペレット付着作業を開始する。After cleaning, the binocular collets A and A'' are each moved to the work start position, and the pellet adhesion work is started.

尚、前記実施例においては、吸着用コレットＡ１Ａ−を
回動させるように説明したが、ペレット案内台Ｇに対し
て直角方向へ往復運動させるように構成してもよいもの
である。In the above embodiment, the suction collet A1A- was described as being rotated, but it may be configured to be reciprocated in a direction perpendicular to the pellet guide G.

本発明は前記のような構成、作用を有するから、リード
フレームＨが存在しない休止時期に清掃を行なうことが
でき、ペレット付着作業には何等の支障も来たすことな
く、能率が低下するようなことがない。Since the present invention has the above-described structure and operation, cleaning can be carried out during the downtime when the lead frame H is not present, and there is no problem with the pellet adhesion work and there is no reduction in efficiency. There is no.

又、清掃作業は気体の噴射で行なうので、簡単且つ確実
に行なうことができる。Further, since the cleaning work is performed by jetting gas, it can be performed easily and reliably.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は吸着用コレットの一例を示す断面図、第２図は
本発明に係わる半導体ペレットボンディング装置におけ
る吸着用コレットの清掃装置の一実施例を示す斜視図で
ある。 Ａ、Ａ”・・・ペレット吸着用コレット、Ｇ・・・リー
ドフレーム案内台、Ｈ・・・リードフレーム、３．３′
・・・気体噴射ノズル、４・・・リードフレーム検出器
。FIG. 1 is a sectional view showing an example of a suction collet, and FIG. 2 is a perspective view showing an embodiment of a cleaning device for a suction collet in a semiconductor pellet bonding apparatus according to the present invention. A, A''...collet for pellet adsorption, G...lead frame guide stand, H...lead frame, 3.3'
...Gas injection nozzle, 4...Lead frame detector.

Claims (1)

【特許請求の範囲】[Claims] リードフレーム案内台Ｇ上のリードフレームＨの不存在
を検出するリードフレーム検出器４と、それぞれ往復動
により、一方ではペレット吸着位置ＥよりペレットＢを
吸着保持し位置決め装置Ｆに移乗し、他方では位置決め
装置Ｆにて位置決めの終了したペレットＢを吸着保持し
前記リードフレームＨ上に移乗し付着するとともに、前
記リードフレーム検出器４の検出により停止する両ペレ
ット吸着用コレットＡ、Ａ′とから成るペレットボンデ
ィング装置において、前記停止位置を作業中間位置とし
、この作業中間位置に配置され前記リードフレーム検出
器４の検出で気体を噴射させる両気体噴射ノズル３、３
′を有することを特徴とする半導体ペレットボンディン
グ装置における吸着用コレットの清掃装置。The lead frame detector 4 detects the absence of the lead frame H on the lead frame guide G, and the lead frame detector 4 reciprocates to suck and hold the pellet B from the pellet suction position E on the one hand and transfer it to the positioning device F, and on the other hand. Consisting of both pellet adsorption collets A and A', which adsorb and hold the pellet B that has been positioned by the positioning device F, transfer it onto the lead frame H, and attach it thereto, and which stop when detected by the lead frame detector 4. In the pellet bonding apparatus, the stop position is an intermediate work position, and both gas injection nozzles 3, 3 are arranged at this intermediate work position and inject gas upon detection by the lead frame detector 4.
A cleaning device for a suction collet in a semiconductor pellet bonding device, characterized in that it has the following features:
JP61083790A 1986-04-10 1986-04-10 Cleaning device for sucking collet in semiconductor-pellet bonding apparatus Granted JPS61252643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61083790A JPS61252643A (en) 1986-04-10 1986-04-10 Cleaning device for sucking collet in semiconductor-pellet bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61083790A JPS61252643A (en) 1986-04-10 1986-04-10 Cleaning device for sucking collet in semiconductor-pellet bonding apparatus

Publications (2)

Publication Number Publication Date
JPS61252643A true JPS61252643A (en) 1986-11-10
JPS6210022B2 JPS6210022B2 (en) 1987-03-04

Family

ID=13812440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61083790A Granted JPS61252643A (en) 1986-04-10 1986-04-10 Cleaning device for sucking collet in semiconductor-pellet bonding apparatus

Country Status (1)

Country Link
JP (1) JPS61252643A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234999A (en) * 1988-07-25 1990-02-05 Matsushita Electric Ind Co Ltd Device for attaching component and cleaning thereof
JPH02143598A (en) * 1988-11-25 1990-06-01 Matsushita Electric Ind Co Ltd Device for installing electronic component
JP2007098241A (en) * 2005-10-03 2007-04-19 Matsushita Electric Ind Co Ltd Method and device for cleaning of chuck nozzle and electronic component mounting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234999A (en) * 1988-07-25 1990-02-05 Matsushita Electric Ind Co Ltd Device for attaching component and cleaning thereof
JPH02143598A (en) * 1988-11-25 1990-06-01 Matsushita Electric Ind Co Ltd Device for installing electronic component
JP2007098241A (en) * 2005-10-03 2007-04-19 Matsushita Electric Ind Co Ltd Method and device for cleaning of chuck nozzle and electronic component mounting device

Also Published As

Publication number Publication date
JPS6210022B2 (en) 1987-03-04

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