JPH06140468A - Inner lead bonder - Google Patents

Abstract

PURPOSE:To enable an inner lead bonder to position a carrier tape and chip parts with high accuracy and, at the same time, to reduce cost of the bonder. CONSTITUTION:A recognition camera 13 which is commonly used for recognizing the posit-ions of a carrier tape 1 and chip parts 7 at a bonding position is provided above the bonding position so that the camera 13 can be moved in three-dimensional directions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inner lead bonder for joining an inner lead formed on a carrier tape and an electrode portion of a chip component such as an IC chip.

[0002]

2. Description of the Related Art In an inner lead bonder, in order to perform accurate bonding (bonding), after recognizing the positions of a carrier tape and an IC chip, bonding is performed by a bonding tool. In such position recognition, the conventional inner lead bonder uses a dedicated independent recognition camera for each, and the carrier tape is position-recognized at the bonding position, while the IC chip is transferred to the die stage and then moved to the bonding position. The position was being recognized before moving.

When the inner lead bonder is bonded, the die stage is contaminated by stains such as the adhesive used for the carrier tape and the adhesive of the wafer stretched sheet attached to the back surface of the IC chip. Will end up. Further, when a large amount of bonding is carried out, these stains are accumulated and cause the following adverse effects. That is,
(1) If there is dirt under the IC chip, the parallelism between the IC chip surface and the bonding tool is disturbed, a uniform load is not applied to all electrodes on the IC chip, and bonding failure occurs. (2) The back surface of the IC chip and the front surface of the die stage adhere to each other, the IC chip is pulled downward at the end of bonding, and defects such as peeling of the bonding portion occur.
(3) Since the IC chip is fixed on the die stage by vacuum suction, a gap is formed between the back surface of the IC chip and the front surface of the die stage and the vacuum leaks, so that the IC chip is not fixed. On the other hand, in the conventional inner lead bonder, the die stage cleaning work is manually performed after every fixed number of times of bonding.

[0004]

In the conventional inner lead bonder, the carrier tape and the IC chip are recognized by independent recognition cameras, so that only one recognition camera is affected by heat during bonding. Alternatively, the positions of the two recognition cameras are misaligned due to the influence of disturbance such as vibration, and these are likely to cause positional deviation, which makes accurate positioning difficult. In addition, it is disadvantageous in terms of cost to install the same type of camera system in two systems.
Further, since the cleaning work is manually carried out for every fixed number of times of bonding with respect to the dirt of the die stage, there is a problem that the manual work is required for every fixed number of times of bonding, resulting in poor efficiency.

Therefore, according to the present invention, the carrier tape and the chip component can be positioned with high accuracy and the cost can be reduced, and the die stage can be efficiently cleaned to improve the bonding yield. The object is to provide an inner lead bonder that can be used.

[0006]

In order to solve the above-mentioned problems, firstly, the present invention sends an inner lead formed on a carrier tape to a bonding position, and a die stage on which a chip component is mounted. In the inner lead bonder that moves the inner lead to a position below the inner lead and bonds the inner lead to the electrode part of the chip component with a bonding tool, a common recognition camera that performs position recognition of the carrier tape and the chip component at the bonding position is provided. The gist is that it is installed above the bonding position so as to be movable in three dimensions.

Secondly, while sending the inner leads formed on the carrier tape to the bonding position, the die stage on which the chip parts are placed is moved below the inner leads, and the inner leads are moved to the chip parts by a bonding tool. In the inner lead bonder to be joined to the electrode part, a die stage cleaning tool for cleaning the die stage is provided above the die stage.

Thirdly, in the above-mentioned second structure, after the die stage cleaning tool is pressed against the die stage, at least one of the die stage cleaning tool and the die stage is pressed against the die stage cleaning tool. The gist is that it is configured to move in at least one of the X, Y, and θ directions orthogonal to the direction.

[0009]

In the above structure, first, the position recognition is performed by the common recognition camera from the chip components on the die stage and the inner leads formed on the carrier tape, for example, the one that moves to the bonding position earlier. At this time, since there is a difference in height between the carrier tape and the chip component, the recognition camera is moved in the vertical direction, and the respective positions are brought into focus for position recognition. The carrier tape may interfere with the position recognition of the chip component, but the position of the chip component can be recognized through the device hole on the carrier tape. After recognizing the positions of the carrier tape and the chip parts,
For example, it is corrected by correcting the position of the die stage. After that, the inner lead is bonded to the electrode portion of the chip component with a bonding tool. The position of the carrier tape and the chip parts are recognized by a common recognition camera, so that the position recognition is performed by each independent recognition camera.
Positional displacement between the cameras due to disturbance such as heat and vibration is prevented, and the carrier tape and the chip component can be positioned with high accuracy. Further, since one camera system can be eliminated, the cost can be reduced.

Secondly, the die stage is automatically cleaned by the die stage cleaning tool, for example, every fixed number of times during the continuous automatic operation of the inner lead bonding. As a result, efficient die stage cleaning becomes possible, and the number of defective bonding caused by stains on the die stage is significantly reduced.

Thirdly, in the die stage cleaning, specifically, after the die stage cleaning tool is pressed against the die stage, at least one of the die stage cleaning tool and the die stage is pressed in the pressing direction. It is performed by moving in at least one of the X, Y, and θ directions that are orthogonal to each other. This ensures that the die stage is cleaned.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 are views showing a first embodiment of the present invention. In this embodiment, the position of the carrier tape and the IC chip are recognized by a common recognition camera. First, explaining the structure of the inner lead bonder,
In FIG. 1, 1 is a carrier tape, in which device holes 2 are opened at regular intervals in the lengthwise direction, and inner leads 3 are formed in the device holes 2.
The carrier tape 1 is guided by a tape guide 5 and is driven by a sprocket wheel for feeding a tape so that the inner lead 3 portion is sequentially fed to a bonding position formed by an opening in the central portion of the tape guide 5. Reference numeral 7 denotes an IC chip as a chip component, and as is well known, a plurality of electrode parts are formed on the surface part thereof. At the pickup position of IC chip 7, I
Tray stage 8 with tray 9 for C chipset
Is installed. 10 is a pickup head.
Reference numeral 11 is a die stage on which the IC chip 7 conveyed from the pickup position can be placed. The die stage 11 is movable in the X, Y, Z, and θ directions, and its position can be corrected. A bonding tool 12 moves in the X and Y directions, is set on the bonding position, and then moves downward. Further, above the bonding position, C for recognizing the positions of the carrier tape 1 and the IC chip 7 is provided.
A common recognition camera 13 including a CD camera is installed. Reference numeral 14 denotes the camera barrel, and the recognition camera 13 and the camera barrel 14 are supported by a bracket 15 and are attached to X,
It is movable in the Y direction, and is movable in the vertical direction in order to correct the focus shift due to the height difference between the carrier tape 1 and the IC chip 7. FIG. 2 shows a vertical movement mechanism of the recognition camera 13. The bracket 15 is fixed to a slider 16 guided by a rail 17 provided in the camera mounting portion 20 in the vertical direction, and the slider 16 is driven in the vertical direction by a cam 18 rotated by a pulse motor 19. . Carrier tape 1 and I
The position of the camera barrel 14 (stop position of the pulse motor 19) at the time of recognizing the position of each C chip is taught in advance.

Next, the operation of the inner lead bonder configured as described above will be described. The IC chips 7 set on the tray 9 on the tray stage 8 are conveyed one by one onto the die stage 11 by the pickup head 10 and fixed onto the die stage 11 by vacuum suction.
The die stage 11 on which the IC chip 7 is placed moves to the bonding position below the carrier tape 1. on the other hand,
The carrier tape 1 is guided by the tape guide 5 and conveyed, and the inner leads 3 are sent to the bonding position.
The recognition camera 13 recognizes the position of the IC chip 7 or the inner lead 3 that has moved to the bonding position earlier. At this time, since there is a difference in height between the carrier tape 1 and the IC chip 7 as shown in FIG.
The recognition camera 13 is moved in the vertical direction, and the respective cameras are brought into focus for position recognition. Here, it can be considered that the carrier tape 1 becomes an obstacle when recognizing the position of the IC chip 7.
The position can be recognized through. Carrier tape 1 and I
After the position recognition of the C chip 7 is completed, the displacement amount between the two is corrected by the die stage 11. After that, the die stage 11 rises, and the inner lead 3 is bonded to the electrode portion of the IC chip 7 by the bonding tool 12.

As described above, according to the present embodiment, it is possible to prevent the displacement of the tape recognizing camera and the chip recognizing camera due to a disturbance such as heat and vibration, which is a problem of the prior art, and the carrier tape 1 can be prevented. The IC chip 7 and the IC chip 7 can be positioned with high accuracy. In addition, one camera system can be eliminated, which leads to cost reduction.

In this embodiment, the recognition camera is moved up and down to correct the focus, but the work distance of the camera barrel may be variable. Further, although the cam and the pulse motor are used as the actuator for moving the recognition camera up and down, an air cylinder, a ball screw, a link or the like may be used.

Next, FIG. 3 shows a second embodiment of the present invention. In this embodiment, a die stage cleaning tool for cleaning the die stage is provided.
In FIG. 3, 6 is a bonding position formed by an opening in the central portion of the tape guide 5, 21 is a sprocket wheel for feeding the carrier tape, which is driven by a pulse motor. The inner lead bonder of this embodiment has a structure in which two bonding tools can be mounted. Of these, the die stage cleaning tool 22 is mounted on the bonding tool mounting portion 24 on the left side of the drawing, and the right side is mounted on the right side. Bonding tool attachment part 2
The bonding tool 12 is attached to the device 3. Both tool attachment parts 23 and 24 have the same structure, and both can move in the X, Y, and Z directions. A flat alumina ceramic grindstone is used at the tip of the die stage cleaning tool 22. An air blow nozzle 25 is provided toward the IC chip mounting position of the die stage 11 in order to remove dust generated on the die stage 11 after completion of the die stage cleaning.
The air blow nozzle 25 blows air on the upper surface of the die stage 11 before the next IC chip 7 is placed. When collecting dust scattered by air blow, it is preferable to provide a suction nozzle for collection.

Next, the operation of die stage cleaning by the die stage cleaning tool 22 will be described. In this embodiment, since the die stage cleaning is performed at the bonding position 6, the carrier tape 1 has a fixed interval (for example, 100 to 200 of the device hole 2).
Holes 4 for die stage cleaning are provided at intervals of about individual pieces. During continuous operation, for example, an optical fiber sensor detects the cleaning hole 4, and when the hole 4 is sent to the bonding position 6, the die stage cleaning is performed. When performing the die stage cleaning, the IC chip 7 is not placed on the die stage 11, and only the die stage 11 is moved to the bonding position 6 and raised. On the other hand, the die stage cleaning tool 22 is also moved to the bonding position 6 and lowered. Then, the surface of the die stage 11 and the surface of the die stage cleaning tool 22 are brought into contact with each other, an appropriate load is applied, and at least one of them is moved in at least one of the X, Y, and θ directions to perform the die stage cleaning. To do. Teaching in advance how to move the axis in which direction.

According to this embodiment, it is not necessary to manually perform the cleaning work of the die stage every fixed number of times of bonding. Further, since the die stage cleaning is automatically performed after every fixed number of times of bonding, it is possible to reduce defects caused by stains on the die stage.

Although the die stage cleaning tool is attached to the bonding tool attachment portion in this embodiment, a unit dedicated to die stage cleaning may be provided separately. Further, if the die stage cleaning is performed at a place other than the carrier line of the carrier tape, it is not necessary to provide the carrier tape with cleaning holes at regular intervals. Furthermore, the material of the die stage (for example, stainless steel,
The shape and material of the die stage cleaning tool may be changed to, for example, a tungsten brush or the like depending on ceramics, glass, etc.).

[0021]

As described above, according to the present invention,
First, since a common recognition camera for recognizing the positions of the carrier tape and the chip component at the bonding position is installed above the bonding position so as to be movable in the three-dimensional direction, the carrier tape and the chip component are independent recognition cameras. As in the case of position recognition,
Positional displacement between cameras due to disturbances such as heat and vibration can be prevented, the carrier tape and the chip component can be positioned with high accuracy, and the bonding yield can be improved. In addition, one camera system can be eliminated and cost can be reduced.

Second, since the die stage cleaning tool for cleaning the die stage is provided above the die stage, the die stage is automatically cleaned, for example, every fixed number of times during continuous automatic operation of inner lead bonding. As a result, it is possible to realize efficient die stage cleaning, and it is possible to reliably reduce defective bonding due to contamination of the die stage and improve the bonding yield.

Third, in the die stage cleaning, specifically, after the die stage cleaning tool is pressed against the die stage, at least one of the die stage cleaning tool and the die stage is pressed in the pressing direction. Since it is moved in at least one of the X, Y, and θ directions that intersect at right angles, the reliability of die stage cleaning is guaranteed.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a first embodiment of an inner lead bonder according to the present invention.

FIG. 2 is an enlarged view showing a vertical movement mechanism portion of the recognition camera in FIG.

FIG. 3 is a perspective view showing a second embodiment of the present invention.

[Explanation of symbols]

 1 Carrier Tape 3 Inner Lead 6 Bonding Position 7 IC Chip (Chip Component) 11 Die Stage 12 Bonding Tool 13 Recognition Camera 22 Die Stage Cleaning Tool

Claims (3)

[Claims] 1. An inner lead formed on a carrier tape is sent to a bonding position, a die stage on which a chip component is placed is moved below the inner lead, and a bonding tool is used to move the inner lead to an electrode of the chip component. In the inner lead bonder to be joined to the portion, a common recognition camera for recognizing the position of the carrier tape and the chip component at the bonding position is installed above the bonding position so as to be movable in a three-dimensional direction. Inner lead bonder. 2. An inner lead formed on a carrier tape is sent to a bonding position, a die stage on which a chip component is placed is moved below the inner lead, and a bonding tool is used to move the inner lead to an electrode of the chip component. In the inner lead bonder joined to the portion, a die stage cleaning tool for cleaning the die stage is provided above the die stage. 3. After the die stage cleaning tool is pressed against the die stage, at least one of the die stage cleaning tool and the die stage is perpendicular to the pressing direction X,
The inner lead bonder according to claim 2, wherein the inner lead bonder is configured to move in at least one of the Y and θ directions.