JPH0574859A - Apparatus and method for outer-lead bonding - Google Patents

Abstract

PURPOSE:To provide a means wherein a lead for a device can be bonded to an electrode for a board with high accuracy. CONSTITUTION:The following are formed on the same X-Y table 31: a first measuring means 32 which measures the dislocation of a lead 8 for a device 5; and a bonding stage 57 which bonds the lead 8 to an electrode 62 for a board 61. In addition, the following are formed at the upper part of the X-Y table 31: a pickup head 51 which picks up the device 5; and a second measuring means 58 which measures the dislocation of the electrode 62 for the board 61 on the bonding stage 57.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an outer lead bonding apparatus and an outer lead bonding method,
The present invention relates to a device for accurately bonding a device obtained by punching a film carrier to a substrate.

[0002]

2. Description of the Related Art A semiconductor is manufactured by inner lead bonding a semiconductor on a long tape-shaped film carrier made of a synthetic resin, and then a device lead obtained by punching the film carrier is bonded to an electrode on a substrate to manufacture an electronic component. Doing is known as the TAB method.

Since the leads formed by the TAB method have a narrow pitch and the leads must be accurately joined to the electrodes on the substrate for bonding, extremely high bonding accuracy is required for the outer lead bonding.

However, a means for automatically and accurately performing outer lead bonding has not yet been established as of today, and therefore, conventionally, outer lead bonding has been performed manually.

Therefore, an object of the present invention is to provide means for automatically and accurately performing outer lead bonding.

[0006]

To this end, according to the present invention, the first measuring means for measuring the positional deviation of the leads of the device and the bonding stage for bonding the leads to the electrodes of the substrate are installed on the same XY table. is doing.
Further, above the XY table, a pickup head for picking up a device and a second measuring means for measuring the positional deviation of the electrodes on the substrate on the bonding stage are provided.

[0007]

In the above structure, when the nozzle of the pickup head moves up and down to pick up the device, X
When the Y table is driven, the first measuring unit moves to the lower side of the device and measures the positional deviation of the lead of the device. Further, in a state where the substrate is placed on the bonding stage, the bonding stage moves below the second measuring means to measure the positional deviation of the electrodes on the substrate.

Next, the XY table is driven so as to correct the positional deviation between the lead and the electrode thus measured, the substrate on the bonding stage is moved to directly below the pickup head, and then the nozzle is moved up and down. The leads are bonded to the electrodes of the substrate.

In the above operation, the pickup head and the second measuring means remain above the XY table and are stopped, and only the first measuring means and the bonding stage are integrally driven in the XY directions by driving the XY table. To measure the positional deviation of the electrodes of the leads and the substrate and correct the measured positional deviation. That is, since the pickup head and the second measuring means remain stopped, an error due to the movement does not occur, and therefore the lead can be bonded to the electrode of the substrate with extremely high accuracy.

[0010]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is an overall perspective view of the outer lead bonding apparatus, FIG. 2 is a plan view thereof, and FIG. 3 is a side view. 2 and 3, 1 is a magazine unit, and Z
A plurality of magazines 2 are placed on the table 14. When the motor 15 is driven, the Z table 14 moves up and down, and the magazine 2 also moves up and down.

FIG. 6 shows a carrying jig 4 which is stacked and stored in the magazine 2. The chip-shaped device 5 is held by the jig 4. As shown in FIG. 10, this device 5 is formed by inner-lead bonding a semiconductor 7 to a long film-shaped film carrier 6 and then cutting it with a cutter 9 at regular intervals. The film carrier 6 is formed of a synthetic resin film such as a polyimide resin, and is easily bent and deformed when hitting a container. Therefore, as described above, the chip-shaped device 5 is cut at a constant pitch, and the device 5 is held by the jig 4 to be transported on the manufacturing line.

In FIGS. 2 and 3, a pusher 10 is provided behind the magazine unit 1. Reference numeral 11 denotes a cylinder, the arm 12 of which projects so that the jig 4 housed in the magazine 2 is punched out by the punching device 2
Push to 1.

In FIG. 3, the punching device 21 includes a lower die 22.
And an upper mold 23. Reference numeral 24 is a cylinder for moving the upper mold 23 up and down. The jig 4 in the magazine 2 is pushed out by the pusher 10 onto the lower mold 22, and then the upper mold 23.
By moving up and down, the leads 8 of the film carrier 6 are punched along the broken line a (see FIG. 6). The punched device 5 is picked up by the transfer head 41 (detailed later), but the empty jig 4 is sucked by the suction means 13 provided at the tip of the arm 12, and the arm 12 is By retracting, it is collected in the magazine 2. By recovering the jig 4 in this manner, the jig 4 can be reused.

In FIG. 3, reference numeral 100 is a cleaning unit for cleaning the punching device 21. Reference numeral 101 is a table on which a slide unit 102 is placed. A motor 103 is arranged in the slide unit 102. A rotating shaft 104 is driven by a motor 103 to rotate, and a cleaning element 105 such as a brush is attached to the tip of the rotating shaft. Also this shaft 1
A suction hole 106 is opened at the tip of 04.

By punching out the film carrier 6,
The scraps of the film carrier 6 adhere to the upper surface of the lower mold 22 and the lower surface of the upper mold 23. Then, the slide unit 102 is driven to move the brush 105 forward between the lower mold 22 and the upper mold 23, and the motor 103 is driven to rotate the brush 105, thereby cleaning the lower mold 22 and the upper mold 23. At this time, air is sucked through the suction holes 106 to collect dust. A suction tube 111 communicates with the suction hole 106, and is connected to a suction device (not shown).

In FIGS. 1 and 2, 31 is an XY table, MX is an X motor, and MY is a Y motor. This XY
The table 31 is provided with the devices described below. Reference numeral 32 denotes a laser device as a first measuring means, which irradiates the lead 8 with a laser beam and receives the reflected light to detect a positional deviation or floating of the lead 8. Reference numeral 32a is a laser light emitting portion, and 32b is a light receiving portion. Of course, instead of the laser device 32, the positional deviation of the lead 8 may be measured by a camera.

A sub-stage 33 is provided on the side of the laser device 32. A first transfer head 41 is provided above the XY table 31. The transfer head 41 is mounted on the Y table 42, and by moving in the Y direction, the device 5 on the lower die 22 is adsorbed by the nozzle 43 to be picked up and mounted on the sub-stage 33. A pickup head 51 is provided above the XY table 31. The pickup head 51 is fixed to the frame 54 and does not move in the XY directions. When the XY table 31 is driven and the sub-stage 33 moves directly below the pickup head 51, the nozzle 52 moves up and down to adsorb and pick up the device 5 on the sub-stage 33. Reference numeral 53 is a thermocompression bonding element provided on the pickup head 51. The pickup head 51 has a built-in motor for rotating the nozzle 52 about its axis.

Reference numeral 55 is a cleaning unit, and 56 is a cleaning brush. Drive the XY table 31,
This cleaning unit 55 and cleaning brush 5
6 is moved right below the pickup head 51, and the thermocompressor 53 of the pickup head 51 is lowered there,
The thermocompressor 53 is cleaned.

In FIGS. 1 and 2, reference numeral 57 is a bonding stage provided on the XY table 31. A jig 63 for holding the substrate 61 is placed on the bonding stage 57. As will be described later, the leads 8 of the device 5 are bonded to the electrodes 62 of the substrate 61. Bonding the device leads to the electrodes on the substrate in this manner is called outer lead bonding. Below the bonding stage 57, a heater 59 for heating the substrate 61 is provided. Reference numeral 58 denotes a camera that is fixedly provided above the XY table 31 and serves as a second measuring unit. The camera 58 measures the displacement of the electrode 62 of the substrate 61.

In the present invention, the laser device 32 and the bonding stage 57 are provided on the same XY table 31, and the pickup head 51 and the camera 58 are the XY table 31.
The reason for this is as follows.

That is, in a general bonding method, the position of the lead 8 of the device 5 is measured by the measuring means while the pickup head 51 is moved in the XY directions, and the camera 58 is moved in the XY directions.
The displacement of the electrode 62 on the substrate 61 is measured. However, when the pickup head 51 and the camera 58 are independently moved in the XY directions as described above, a relative movement error occurs between them and the bonding accuracy is lowered. On the other hand, in the present invention, since the pickup head 51 and the camera 58 are fixed, no movement error occurs. Moreover, the laser device 32 and the bonding stage 57
Are installed on the same XY table 31, and both 32 and 5 are installed.
7 moves integrally in the XY directions, so both 32 and 57
The positional relationship is constant, and neither the laser device 32 nor the bonding stage 57 is displaced at all. For the above reasons, this means enables extremely accurate bonding. The substage 33,
Cleaning unit 55, cleaning brush 56
Does not affect the accuracy of bonding, and therefore they do not have to be installed on the XY table 31.

In FIGS. 2 and 4, 71 is a loader, and 7 is a loader.
2 is an unloader and 73 is a conveyor. This loader 7
A carrier 81 is stacked on the first substrate 1. FIG. 7 shows this carrier 81. The carrier 81 is in the shape of a long plate, is provided with the mounting portions 82 of the jigs 63 with a pitch, and five jigs 63 are mounted. Reference numeral 83 is a protrusion for positioning the jig 63.

In FIGS. 4 and 5, the carrier 81 is stacked on the conveyor 84. 89 is a motor.
Further, the conveyor 84 is supported by the rod 86 of the two-stage cylinder 85, and moves up and down when the rod 86 projects. 87
Is a guide rod. A heater 88 is provided below the conveyor 84 to heat the substrate 61 on the jig 63 held by the carrier 81.

In FIG. 5, on both sides of the loader 71,
A clamper 91 is provided. This clamper 91
Is configured by connecting a claw 94 to a rod 93 of the cylinder 92. Reference numeral 95 is a guide rail, and 96 is a slider.

When the rod 93 of the cylinder 92 projects,
The second carrier 81B from the bottom is clamped by the claw 94. In this state, when the rod 86 of the cylinder 85 is retracted and the motor 89 is driven, the carrier 81 at the bottom stage is
A is conveyed toward the conveyor 73. The unloader 72 also has the same structure as the loader 71.

The conveyor 73 includes the rod 7 of the cylinder 75.
It is supported by 6 so that it can move up and down. Reference numeral 77 is a motor, and 78 is a guide rod. A heater 7 is provided below the conveyor 73.
9 is provided to heat the substrate 61. By the heater 88 and the heater 79, the substrate 6 on the carrier 81
By heating 1 in advance, the leads 8 of the device 5 can be easily bonded to the electrodes of the substrate 61.

In FIG. 1, a second transfer head 65 is provided above the XY table 31. The transfer head 65 is provided on the Y table 67. This transfer head 65 uses the jig 63 on the carrier 81 for the nozzle 6
Adsorbed to 6 and picked up, bonding stage 5
Installed in 7.

The present apparatus has the above-mentioned configuration, and the operation will be described with reference to FIGS. 8 and 9.

In FIG. 8A, the device 5 on the lower die 22 punched from the film carrier 6 by the punching device 21 is picked up by the transfer head 41 and mounted on the sub-stage 33. Next, XY table 31
Is driven to move the device 5 directly below the pickup head 51, and the nozzle 52 moves up and down, so that the device 5 is picked up by the nozzle 52 (FIG. 8B). Next, the XY table 31 is driven, and the laser device 32 moves directly below the pickup head 51 (FIG. 8C). Then lead 8 of device 5
The position shift of the lead 8 is measured by irradiating the laser beam on the above and receiving the reflected light. Lead 8 is device 5
Therefore, the laser device 32 is moved in the XY directions to irradiate the laser light in the direction crossing the leads 8 and the positional deviation of each lead 8 is measured.

On the other hand, as shown in FIG.
1 is sent from the loader 71 onto the conveyor 73. Next, the jig 63 is picked up by the transfer head 65 and mounted on the bonding stage 57. Next, the XY table 31 is driven, the jig 63 is moved directly below the camera 58 (FIG. 9B), and the displacement of the electrode 62 of the substrate 61 is measured.

Then, the XY table 31 is driven, and the substrate 61 is moved directly below the pickup head 51 (see FIG. 9).
(C)), where the nozzle 52 of the pickup head 51
The leads 8 of the device 5 are bonded to the electrodes 62 of the substrate 61 by lowering the thermocompressor 53. In this case, by correcting the movement stroke of the XY table 31 in the XY directions, and by rotating the nozzle 52 about its axis, the device 5 measured as described above.
The positional deviation between the lead 8 and the electrode 62 of the substrate 61 is corrected. Next, the transfer head 65 picks up the jig 63 and mounts it on the carrier 81. In this way, if all the five jigs 63 are collected on the carrier 81, the conveyor 73 is driven and the carrier 81 is collected by the unloader 72.

The present invention is not limited to the above embodiment. For example, in the above embodiment, as shown in FIG.
The long film-shaped film carrier 6 is cut at a constant pitch to form the chip-shaped device 5, and the leads of the device 5 are punched by the punching device 21. Film carrier 6
In this state, the lead 8 may be punched by a punching device to form a chip-shaped device 5, and the device 5 may be transferred and mounted on the sub-stage 33 by the transfer head 41. Alternatively, if the lower die 22 of the punching device 21 can be moved in the X direction and the Y direction by the moving means, the lower die 22 can be moved to the pickup head 51 with the XY table 31 retracted to the side.
It is also possible to move the punched device 5 to a position directly below the nozzle and pick it up by adsorbing the punched device 5 to the nozzle 52 of the pickup head 51. As described above, various design changes can be considered for the present invention.

[0034]

As described above, according to the present invention, the first measuring means for measuring the positional deviation of the leads of the device and the bonding stage for bonding the leads to the electrodes of the substrate are installed on the same XY table, Further, since a pickup head for picking up a device and a second measuring means for measuring the positional deviation of the electrodes on the substrate on the bonding stage are provided above the XY table,
A series of operations including punching of a film carrier, measurement of device leads and electrodes of a substrate, and bonding of leads and electrodes can be performed automatically and accurately.

[Brief description of drawings]

FIG. 1 is a perspective view of an outer lead bonding apparatus according to the present invention.

FIG. 2 is a plan view of an outer lead bonding apparatus according to the present invention.

FIG. 3 is a side view of an outer lead bonding apparatus according to the present invention.

FIG. 4 is a front view of an outer lead bonding apparatus according to the present invention.

FIG. 5 is a front view of a loader according to the present invention.

FIG. 6 is a perspective view of a jig and a device according to the present invention.

FIG. 7 is a perspective view of a carrier and a jig according to the present invention.

FIG. 8 is an explanatory diagram of a work order according to the present invention.

FIG. 9 is an explanatory diagram of a work order according to the present invention.

FIG. 10 is a side view of the film carrier according to the present invention during cutting.

[Explanation of symbols]

 5 device 6 film carrier 7 semiconductor 8 lead 21 punching device 31 XY table 32 first measuring means 51 pickup head 52 nozzle 57 bonding stage 58 second measuring means 61 substrate 62 electrode

Claims (2)

[Claims] 1. A punching device for punching a lead of a film carrier having a semiconductor inner lead bonded, a pickup head for moving a nozzle up and down to pick up a punched device, and a device picked up by the pickup head. First measuring means for measuring the positional deviation of the leads, a bonding stage for vertically moving the nozzle of the pickup head to bond the leads of the device to the electrodes of the substrate, and electrodes of the substrate mounted on the bonding stage A second measuring means for measuring the positional deviation of the pickup head, at least the first measuring means and the bonding stage are installed on the same XY table, and the pickup head and the second measuring means are provided above the XY table. Outerly characterized by having measuring means Bonding apparatus. 2. A step of (1) punching a lead of a film carrier to which a semiconductor is inner lead bonded by a punching device, (2) a step of moving the punched device directly below a pickup head, and (3). A step of moving the nozzle of this pickup head up and down to adsorb and pick up this device; and (4) moving the first measuring means to the position directly below the device adsorbed by the nozzle of this pickup head to The step of measuring the positional deviation of the leads of (1), (5) the step of mounting the substrate on the bonding stage by the transfer head, and (6) the bonding stage is moved below the second measuring means to move the bonding stage above the bonding stage. Measuring the positional deviation of the electrodes of the substrate of (7), It is moved directly under the Puheddo, the lead of the device which is adsorbed to the pick-up head, the outer lead bonding method characterized by consisting the steps of bonding the electrode substrate on the bonding stage.