JPS61243853A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number
JPS61243853A
JPS61243853A JP8421785A JP8421785A JPS61243853A JP S61243853 A JPS61243853 A JP S61243853A JP 8421785 A JP8421785 A JP 8421785A JP 8421785 A JP8421785 A JP 8421785A JP S61243853 A JPS61243853 A JP S61243853A
Authority
JP
Japan
Prior art keywords
epoxy resin
particle size
weight
parts
quartz powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8421785A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6337127B2 (enrdf_load_stackoverflow
Inventor
Osamu Kuriyama
栗山　収
Toshio Shiobara
利夫 塩原
Kazutoshi Tomiyoshi
富吉　和俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP8421785A priority Critical patent/JPS61243853A/ja
Publication of JPS61243853A publication Critical patent/JPS61243853A/ja
Publication of JPS6337127B2 publication Critical patent/JPS6337127B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP8421785A 1985-04-19 1985-04-19 エポキシ樹脂組成物 Granted JPS61243853A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8421785A JPS61243853A (ja) 1985-04-19 1985-04-19 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8421785A JPS61243853A (ja) 1985-04-19 1985-04-19 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61243853A true JPS61243853A (ja) 1986-10-30
JPS6337127B2 JPS6337127B2 (enrdf_load_stackoverflow) 1988-07-22

Family

ID=13824311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8421785A Granted JPS61243853A (ja) 1985-04-19 1985-04-19 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61243853A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160256A (ja) * 1986-12-23 1988-07-04 Nitto Electric Ind Co Ltd 半導体装置の製法
JPS6426625A (en) * 1987-04-24 1989-01-27 Matsushita Electric Works Ltd Epoxy polymer composition and liquid epoxy polymer composition
JPH03239752A (ja) * 1990-02-16 1991-10-25 Nitto Denko Corp 注型用エポキシ樹脂組成物

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS55165655A (en) * 1979-06-12 1980-12-24 Toshiba Corp Semiconductor device sealed up with resin
JPS55165916A (en) * 1979-06-11 1980-12-24 Shikoku Chem Corp Epoxy resin composition
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS56110248A (en) * 1980-02-06 1981-09-01 Nitto Electric Ind Co Ltd Manufacture of filler for semiconductor sealing resin
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58173118A (ja) * 1982-04-05 1983-10-12 Sumitomo Bakelite Co Ltd 半導体ダイボンディング用エポキシ樹脂組成物
JPS6017936A (ja) * 1983-07-12 1985-01-29 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS55165916A (en) * 1979-06-11 1980-12-24 Shikoku Chem Corp Epoxy resin composition
JPS55165655A (en) * 1979-06-12 1980-12-24 Toshiba Corp Semiconductor device sealed up with resin
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS56110248A (en) * 1980-02-06 1981-09-01 Nitto Electric Ind Co Ltd Manufacture of filler for semiconductor sealing resin
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58173118A (ja) * 1982-04-05 1983-10-12 Sumitomo Bakelite Co Ltd 半導体ダイボンディング用エポキシ樹脂組成物
JPS6017936A (ja) * 1983-07-12 1985-01-29 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160256A (ja) * 1986-12-23 1988-07-04 Nitto Electric Ind Co Ltd 半導体装置の製法
JPS6426625A (en) * 1987-04-24 1989-01-27 Matsushita Electric Works Ltd Epoxy polymer composition and liquid epoxy polymer composition
JPH03239752A (ja) * 1990-02-16 1991-10-25 Nitto Denko Corp 注型用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS6337127B2 (enrdf_load_stackoverflow) 1988-07-22

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term