JPS6123861B2 - - Google Patents
Info
- Publication number
- JPS6123861B2 JPS6123861B2 JP21952783A JP21952783A JPS6123861B2 JP S6123861 B2 JPS6123861 B2 JP S6123861B2 JP 21952783 A JP21952783 A JP 21952783A JP 21952783 A JP21952783 A JP 21952783A JP S6123861 B2 JPS6123861 B2 JP S6123861B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- based alloy
- annealing
- producing
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 16
- 239000000956 alloy Substances 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 238000000137 annealing Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 3
- -1 Mitsushi Metal Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 238000005482 strain hardening Methods 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910002593 Fe-Ti Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21952783A JPS60114556A (ja) | 1983-11-24 | 1983-11-24 | 銅基合金の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21952783A JPS60114556A (ja) | 1983-11-24 | 1983-11-24 | 銅基合金の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60114556A JPS60114556A (ja) | 1985-06-21 |
| JPS6123861B2 true JPS6123861B2 (enrdf_load_stackoverflow) | 1986-06-07 |
Family
ID=16736873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21952783A Granted JPS60114556A (ja) | 1983-11-24 | 1983-11-24 | 銅基合金の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60114556A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159556U (enrdf_load_stackoverflow) * | 1987-04-08 | 1988-10-19 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60218440A (ja) * | 1984-04-13 | 1985-11-01 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
| JPS61284946A (ja) * | 1985-06-11 | 1986-12-15 | Mitsubishi Shindo Kk | 半導体装置用Ｃｕ合金リ−ド素材 |
| JPS62133034A (ja) * | 1985-12-06 | 1987-06-16 | Yazaki Corp | タ−ミナル用合金 |
| JPH0617522B2 (ja) * | 1987-04-03 | 1994-03-09 | 株式会社神戸製鋼所 | 熱間加工性に優れた電気・電子部品用銅合金 |
| US6632300B2 (en) * | 2000-06-26 | 2003-10-14 | Olin Corporation | Copper alloy having improved stress relaxation resistance |
-
1983
- 1983-11-24 JP JP21952783A patent/JPS60114556A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159556U (enrdf_load_stackoverflow) * | 1987-04-08 | 1988-10-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60114556A (ja) | 1985-06-21 |