JPS61234556A - ボンデイング用ワイヤ - Google Patents

ボンデイング用ワイヤ

Info

Publication number
JPS61234556A
JPS61234556A JP60077991A JP7799185A JPS61234556A JP S61234556 A JPS61234556 A JP S61234556A JP 60077991 A JP60077991 A JP 60077991A JP 7799185 A JP7799185 A JP 7799185A JP S61234556 A JPS61234556 A JP S61234556A
Authority
JP
Japan
Prior art keywords
wire
zinc
copper
ball
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60077991A
Other languages
English (en)
Inventor
Kazumichi Machida
一道 町田
Saneyasu Hirota
弘田　実保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60077991A priority Critical patent/JPS61234556A/ja
Publication of JPS61234556A publication Critical patent/JPS61234556A/ja
Pending legal-status Critical Current

Links

Classifications

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体装置のボンディング用ワイヤに関す
るものである。
〔従来の技術〕
半導体装置においては、一般に半導体チップ上の電極と
リードとをワイヤによってボンディングするようにして
おり、このボンディング用ワイヤとしては、従来、金ワ
イヤが使用されているが、この場合、コストが高いとい
う欠点を有するため、金に代わる材料が種々検討されて
いる。
〔発明が解決しようとする問題点〕
ここで材料原価低減という観点から、ボンディング用ワ
イヤを金から銅に代える場合について考える。ここで第
５図は銅ワイヤの表面状態を示し、図において、１は銅
ワイヤ、２は酸素、３は銅の酸化物、４は酸化物層であ
る。
ボンディング用ワイヤとして銅ワイヤ１を用いる場合、
コストの点では有利であるが、銅ワイヤ１は金ワイヤに
比し、雰囲気酸素２との酸化物３を形成しやすく、長期
の間にわずかづつ酸化が進行して表面に酸化物層４が生
成され、この酸化物層４が剥離してワイヤ径が小さくな
り、強度が低下するとともに、電気抵抗が上昇し、半導
体装置の機能が低下するおそれがあり、特にワイヤ径が
２０μｍ〜３０μｍの場合には数μｍ程度の酸化が進行
しても上述の問題が懸念されるものである。
Ｃ問題点を解決するための手段〕 本願の第１の発明に係るボンディング用ワイヤは、１０
ｐｐｍ〜５００ｐｐｍの範囲で亜鉛が含有された銅基材
料を用いてワイヤを形成するようにしたものである。
また本願の第２の発明に係るボンディング用′ワイヤは
、表面、に１００Å〜１０００人の厚さで亜鉛が蒸着さ
れた銅基材料のワイヤを用いるようにしたものである。
〔作用〕
本願の第１の発明においては、ワイヤ中に含有された亜
鉛が雰囲気酸素によって優先的に酸化（選択酸化）され
、これによりワイヤの基材料である銅自体の酸化が抑制
されるものである。
また本願の第２の発明においては、ワイヤ表面に蒸着さ
れた亜鉛が雰囲気酸素によって選択酸化され、これによ
りワイヤの基材料である銅自体の酸化が抑制されるもの
である。
〔実施例〕
以下、本発明の実施例を図について説明する。
第１図ないし第３図は本願の第１の発明の一実施例によ
るボンディング用ワイヤを示す。図において、第５図と
同一符号は同図と同一のものを示し、５は直径１５μｍ
〜５０μｍの銅基材料のワイヤ、６はワイヤ５中に１０
ｐｐｍ〜５００ｐｐｍの範囲で含有された亜鉛、６ａは
蒸発した亜鉛、７は亜鉛６の酸化物、８は放電電極、９
はアーク、１０は溶融履歴を経て形成されたボール、１
１は半導体チップ、１２は半導体チップ１１上のアルミ
電極、１３はリードである。
次に作用効果について説明する。
本実施例のワイヤでは、従来と同様の方法でボンディン
グを行なう、即ち、ワイヤ５と放電電極８との間に高電
圧を印加して両者間にアーク９を発生させ、ワイヤ５の
先端部に入熱を与えてこれを溶融球状化しく第２図参照
）、形成したボール１０を半導体チップ１１上のアルミ
電極１２にボールボンディングした後、ワイヤ５の他端
側をリード１３のボンディングエリアにステッチボンデ
ィングする（第３図参照）。
そしてこうして形成された半導体装置を長期間使用した
場合、ワイヤ５においては、第１図（ｂｌに示すように
、ワイヤ５中の亜鉛６が雰囲気酸素２と優先的に結合し
て選択酸化され、ワイヤ５の基材料である銅の酸化は抑
制されてワイヤ径はほとんど減少せず、これによりワイ
ヤ５の強度が確保されるとともに、電気抵抗の上昇が防
止される。
ここで亜鉛６の含有量が１０ｐｐｍ以上であれば、選択
酸化による実用的効果が得られるものである。
ところで、上述のように銅基材料中に亜鉛６を含有させ
ると、ワイヤ５先端部のボール１０硬度が高くなってワ
イヤ５とアルミ電極１２とのボンディング性が著しく阻
害されることが考えられるが、亜鉛６の含有量が５００
ｐｐｍ以下であれば、ボール１０の形成（ワイヤ溶融）
の際に、亜鉛６ａが蒸発除去され、ボンディングに供す
るボール１０は純銅化され、ボンディング性を損なわな
い程度に軟かさを回復し、これによりボールボンディン
グ性が保証されるものである。
また第４図は本願の第２の発明の一実施例によるボンデ
ィング用ワイヤを示す。本実施例では銅基材料のワイヤ
５の表面に、１００Å〜１０００人の亜鉛７の蒸着膜１
４を形成するようにしている。ここで蒸着膜１４の膜厚
を１００Å〜１０００人としたのは、１００Å以下では
選択酸化による実用的効果が得られないからであり、一
方、１０００Å以上ではボールの硬度上昇によってポー
ルボンディング性が損なわれるからである。
〔発明の効果〕
以上のように、本発明によれば、亜鉛を含有するか、又
は表面に亜鉛蒸着膜を形成した銅基材料を用いてワイヤ
を形成するようにしたので、ワイヤの信頼性及びボンデ
ィング性を保証でき、その結果金ワイヤに代えて銅ワイ
ヤの使用が可能となり、大幅な低コスト化を達成できる
。
【図面の簡単な説明】
第１図（ａ）　（ｂ）は各々本願の第１の発明の一実施
例によるボンディング用ワイヤの長期使用前及び長期使
用後の状況を示す模式図、第２図＜’ａ）＞ｒは各々上
記ワイヤにおけるボール形成前及びボール形成後の状態
を示す模式図、第３図は上記ワイヤを用いたボンディン
グ状態を示す模式図、第４図ｆａ）　（ｂ）は各々本願
の第２の発明の一実施例によるボンディング用ワイヤの
長期使用前及び長期使用後の状況を示す模式図、第５図
（ａ）　（ｂ）はともに発明が解決しようとする問題点
を説明するための模式図である。 ５・・・銅基材料のワイヤ、６・・・亜鉛、１４・・・
亜鉛蒸着膜。 なお図中同一符号は同−又は相当部分を示す。

Claims (4)

    【特許請求の範囲】
  1. （１）半導体装置のボンディング用ワイヤであって、１
    ０ｐｐｍ〜５００ｐｐｍの範囲で亜鉛が含有された銅基
    材料を用いて形成したことを特徴とするボンディング用
    ワイヤ。
  2. （２）１５μｍ〜５０μｍの範囲の直径を有することを
    特徴とする特許請求の範囲第１項記載のボンディング用
    ワイヤ。
  3. （３）半導体装置のボンディング用ワイヤであって、そ
    の表面に１００Å〜１０００Åの厚さで亜鉛が蒸着され
    た銅基材料のワイヤを用いたことを特徴とするボンディ
    ング用ワイヤ。
  4. （４）１５μｍ〜５０μｍの範囲の直径を有することを
    特徴とする特許請求の範囲第１項記載のボンディング用
    ワイヤ。
JP60077991A 1985-04-11 1985-04-11 ボンデイング用ワイヤ Pending JPS61234556A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60077991A JPS61234556A (ja) 1985-04-11 1985-04-11 ボンデイング用ワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077991A JPS61234556A (ja) 1985-04-11 1985-04-11 ボンデイング用ワイヤ

Publications (1)

Publication Number Publication Date
JPS61234556A true JPS61234556A (ja) 1986-10-18

Family

ID=13649289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60077991A Pending JPS61234556A (ja) 1985-04-11 1985-04-11 ボンデイング用ワイヤ

Country Status (1)

Country Link
JP (1) JPS61234556A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116405A (ja) * 2012-12-07 2014-06-26 Hitachi Metals Ltd 銅ボンディングワイヤ及びその製造方法
JP2015159341A (ja) * 2015-06-11 2015-09-03 日立金属株式会社 銅ボンディングワイヤ
JP2019149559A (ja) * 2016-06-20 2019-09-05 日鉄マイクロメタル株式会社 半導体装置用銅合金ボンディングワイヤ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116405A (ja) * 2012-12-07 2014-06-26 Hitachi Metals Ltd 銅ボンディングワイヤ及びその製造方法
JP2015159341A (ja) * 2015-06-11 2015-09-03 日立金属株式会社 銅ボンディングワイヤ
JP2019149559A (ja) * 2016-06-20 2019-09-05 日鉄マイクロメタル株式会社 半導体装置用銅合金ボンディングワイヤ

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