JPS61232171A - 電子部品連 - Google Patents
電子部品連Info
- Publication number
- JPS61232171A JPS61232171A JP60062287A JP6228785A JPS61232171A JP S61232171 A JPS61232171 A JP S61232171A JP 60062287 A JP60062287 A JP 60062287A JP 6228785 A JP6228785 A JP 6228785A JP S61232171 A JPS61232171 A JP S61232171A
- Authority
- JP
- Japan
- Prior art keywords
- storage
- tape
- electronic component
- cover tape
- storage tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 17
- 229920005992 thermoplastic resin Polymers 0.000 claims description 10
- 238000003466 welding Methods 0.000 description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 238000007789 sealing Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Containers And Plastic Fillers For Packaging (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60062287A JPS61232171A (ja) | 1985-03-27 | 1985-03-27 | 電子部品連 |
| US06/828,021 US4736841A (en) | 1985-02-20 | 1986-02-10 | Electronic component series |
| DE19863605491 DE3605491A1 (de) | 1985-02-20 | 1986-02-20 | Reihenanordnung elektronischer bauelemente |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60062287A JPS61232171A (ja) | 1985-03-27 | 1985-03-27 | 電子部品連 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61232171A true JPS61232171A (ja) | 1986-10-16 |
| JPH0249983B2 JPH0249983B2 (enrdf_load_stackoverflow) | 1990-10-31 |
Family
ID=13195751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60062287A Granted JPS61232171A (ja) | 1985-02-20 | 1985-03-27 | 電子部品連 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61232171A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0259170U (enrdf_load_stackoverflow) * | 1988-10-26 | 1990-04-27 | ||
| JPH0314427A (ja) * | 1989-06-06 | 1991-01-23 | Dainippon Printing Co Ltd | 電子部品搬送体の底材製造方法 |
| JPH0664659A (ja) * | 1992-08-17 | 1994-03-08 | Nec Corp | 半導体装置用エンボステープ |
| JP2019172334A (ja) * | 2018-03-29 | 2019-10-10 | 太陽誘電株式会社 | 電子部品包装体及び電子部品包装体の剥離方法 |
-
1985
- 1985-03-27 JP JP60062287A patent/JPS61232171A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0259170U (enrdf_load_stackoverflow) * | 1988-10-26 | 1990-04-27 | ||
| JPH0314427A (ja) * | 1989-06-06 | 1991-01-23 | Dainippon Printing Co Ltd | 電子部品搬送体の底材製造方法 |
| JPH0664659A (ja) * | 1992-08-17 | 1994-03-08 | Nec Corp | 半導体装置用エンボステープ |
| JP2019172334A (ja) * | 2018-03-29 | 2019-10-10 | 太陽誘電株式会社 | 電子部品包装体及び電子部品包装体の剥離方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0249983B2 (enrdf_load_stackoverflow) | 1990-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4736841A (en) | Electronic component series | |
| US4702370A (en) | Electronic components series | |
| US4406367A (en) | Package for electrical and/or electronic components | |
| JPS61232171A (ja) | 電子部品連 | |
| JPH0249982B2 (enrdf_load_stackoverflow) | ||
| JP2008254785A (ja) | テーピング部品 | |
| JPH0239968Y2 (enrdf_load_stackoverflow) | ||
| US5964352A (en) | Carrier band of electronic parts | |
| JPS60113998A (ja) | 電子部品集合体 | |
| JPH037318Y2 (enrdf_load_stackoverflow) | ||
| JP2548253Y2 (ja) | テーピング用治具 | |
| JPH11134464A (ja) | Ｉｃモジュールの製造方法、およびこの製造方法により製造されたｉｃモジュールを備えたｉｃカード | |
| JPH0692388A (ja) | 電子部品集合体 | |
| JPH074223Y2 (ja) | 電子部品テープ状包装体 | |
| JP2815671B2 (ja) | 電子部品用キャリアテープの接続用テープ | |
| JPH06192630A (ja) | カード型半導体装置のパネルへの両面接着テープ接着 用セパレータ | |
| JPH11278581A (ja) | テーピング部材 | |
| JPS61190413A (ja) | 電子部品連の製造方法 | |
| JPH0330258Y2 (enrdf_load_stackoverflow) | ||
| JPH0725386B2 (ja) | キヤリア−テ−プ | |
| JPH0771977B2 (ja) | キヤリアテ−プ | |
| JPS6222359Y2 (enrdf_load_stackoverflow) | ||
| JPH072462Y2 (ja) | チップ状電子部品用キャリアテープ | |
| JPS6150398A (ja) | 電子部品搬送体 | |
| JPH04267709A (ja) | テーピング電子部品連の接続方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |