JPS6123061B2 - - Google Patents
Info
- Publication number
- JPS6123061B2 JPS6123061B2 JP52019042A JP1904277A JPS6123061B2 JP S6123061 B2 JPS6123061 B2 JP S6123061B2 JP 52019042 A JP52019042 A JP 52019042A JP 1904277 A JP1904277 A JP 1904277A JP S6123061 B2 JPS6123061 B2 JP S6123061B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- carrier
- flux
- wiring board
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1904277A JPS53103576A (en) | 1977-02-23 | 1977-02-23 | Device for automatically soldering printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1904277A JPS53103576A (en) | 1977-02-23 | 1977-02-23 | Device for automatically soldering printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53103576A JPS53103576A (en) | 1978-09-08 |
| JPS6123061B2 true JPS6123061B2 (cs) | 1986-06-04 |
Family
ID=11988357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1904277A Granted JPS53103576A (en) | 1977-02-23 | 1977-02-23 | Device for automatically soldering printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53103576A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58131741A (ja) * | 1982-01-29 | 1983-08-05 | Shinkawa Ltd | ペレットボンディング用フラックス付け装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443552Y2 (cs) * | 1977-08-08 | 1979-12-15 |
-
1977
- 1977-02-23 JP JP1904277A patent/JPS53103576A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53103576A (en) | 1978-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2770875A (en) | Soldering machine | |
| CN209517675U (zh) | 一种pcb板自动浸锡机 | |
| US4607782A (en) | Method and apparatus for soldering electrical components to circuit boards | |
| CN110153620B (zh) | 小型断路器热磁系统磁轭组合支架的自动焊接设备 | |
| CN119457304A (zh) | 用于电子元器件的浸锡生产系统及方法 | |
| US4776508A (en) | Electronic component lead tinning device | |
| JPS6123061B2 (cs) | ||
| CN211276852U (zh) | 一种电路板焊接装置 | |
| JPH06169167A (ja) | 光ビームによる上向きはんだ付け方法 | |
| US2764953A (en) | Machine for trimming, fluxing, and soldering the lead wires of fluorescent lamps | |
| CN217457504U (zh) | 一种用于led模组的搬运导轨机构 | |
| CN115194438A (zh) | 皮线灯封装设备 | |
| CN211529789U (zh) | 电感线圈自动绕线-焊接-测试一体设备 | |
| US4724995A (en) | Pin joining method and apparatus | |
| JP2895197B2 (ja) | 連続ハンダコーテイング方法及び装置 | |
| JPS63304588A (ja) | 導電端子装着方法および装置 | |
| JPS5854518B2 (ja) | 混成集積回路の製作法 | |
| JP2627366B2 (ja) | コイル端末処理装置 | |
| CN219093913U (zh) | 一种具有自动点涂焊膏的点涂机 | |
| JPH0864941A (ja) | リード付き電子部品の実装方法および装置 | |
| JPS6232718Y2 (cs) | ||
| JPS6182969A (ja) | キヤリアレスはんだ付け装置におけるプリント基板保持装置 | |
| JPS635249Y2 (cs) | ||
| JPH0234710B2 (ja) | Jidohandazukesochi | |
| JPS6024266A (ja) | 自動半田付け方法及び装置 |