JPS61226996A - プリント配線板の製造方法 - Google Patents
プリント配線板の製造方法Info
- Publication number
- JPS61226996A JPS61226996A JP6876985A JP6876985A JPS61226996A JP S61226996 A JPS61226996 A JP S61226996A JP 6876985 A JP6876985 A JP 6876985A JP 6876985 A JP6876985 A JP 6876985A JP S61226996 A JPS61226996 A JP S61226996A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- carbon
- circuit
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 25
- 229910052799 carbon Inorganic materials 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000740 bleeding effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6876985A JPS61226996A (ja) | 1985-04-01 | 1985-04-01 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6876985A JPS61226996A (ja) | 1985-04-01 | 1985-04-01 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61226996A true JPS61226996A (ja) | 1986-10-08 |
| JPH0255956B2 JPH0255956B2 (enrdf_load_stackoverflow) | 1990-11-28 |
Family
ID=13383267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6876985A Granted JPS61226996A (ja) | 1985-04-01 | 1985-04-01 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61226996A (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56104168U (enrdf_load_stackoverflow) * | 1980-08-19 | 1981-08-14 | ||
| JPS6045094A (ja) * | 1983-08-22 | 1985-03-11 | 株式会社東芝 | フラットパッケ−ジ型ｉｃの実装方法 |
-
1985
- 1985-04-01 JP JP6876985A patent/JPS61226996A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56104168U (enrdf_load_stackoverflow) * | 1980-08-19 | 1981-08-14 | ||
| JPS6045094A (ja) * | 1983-08-22 | 1985-03-11 | 株式会社東芝 | フラットパッケ−ジ型ｉｃの実装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0255956B2 (enrdf_load_stackoverflow) | 1990-11-28 |
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