JPS6122628B2 - - Google Patents

Info

Publication number

JPS6122628B2

JPS6122628B2 JP6405282A JP6405282A JPS6122628B2 JP S6122628 B2 JPS6122628 B2 JP S6122628B2 JP 6405282 A JP6405282 A JP 6405282A JP 6405282 A JP6405282 A JP 6405282A JP S6122628 B2 JPS6122628 B2 JP S6122628B2

Authority

JP

Japan

Prior art keywords

epoxy resin

prepreg

resin

silane

layer

Prior art date

1982-04-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000003822 epoxy resin Substances 0.000 claims description 47
• 229920000647 polyepoxide Polymers 0.000 claims description 47
• 229910052751 metal Inorganic materials 0.000 claims description 44
• 239000002184 metal Substances 0.000 claims description 44
• 239000011888 foil Substances 0.000 claims description 23
• 229920013716 polyethylene resin Polymers 0.000 claims description 19
• 239000003054 catalyst Substances 0.000 claims description 15
• -1 polyethylene Polymers 0.000 claims description 15
• 238000009833 condensation Methods 0.000 claims description 14
• 230000005494 condensation Effects 0.000 claims description 14
• SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims description 14
• 238000004519 manufacturing process Methods 0.000 claims description 13
• 239000004698 Polyethylene Substances 0.000 claims description 12
• 229920000573 polyethylene Polymers 0.000 claims description 12
• 238000010438 heat treatment Methods 0.000 claims description 9
• 238000000465 moulding Methods 0.000 claims description 5
• 239000012777 electrically insulating material Substances 0.000 claims description 4
• 239000000615 nonconductor Substances 0.000 claims description 4
• 238000010030 laminating Methods 0.000 claims description 3
• 239000010410 layer Substances 0.000 description 45
• 239000000463 material Substances 0.000 description 34
• 229920005989 resin Polymers 0.000 description 24
• 239000011347 resin Substances 0.000 description 24
• 229920005992 thermoplastic resin Polymers 0.000 description 18
• 239000004744 fabric Substances 0.000 description 14
• 239000011521 glass Substances 0.000 description 14
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
• 239000000203 mixture Substances 0.000 description 11
• 230000000052 comparative effect Effects 0.000 description 9
• 238000000034 method Methods 0.000 description 9
• 238000010521 absorption reaction Methods 0.000 description 8
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
• ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
• BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
• UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 6
• 229910052802 copper Inorganic materials 0.000 description 6
• 239000010949 copper Substances 0.000 description 6
• 239000011889 copper foil Substances 0.000 description 6
• 230000006866 deterioration Effects 0.000 description 6
• 239000012975 dibutyltin dilaurate Substances 0.000 description 6
• 238000009472 formulation Methods 0.000 description 6
• 229910000077 silane Inorganic materials 0.000 description 6
• 239000000758 substrate Substances 0.000 description 6
• 239000004695 Polyether sulfone Substances 0.000 description 5
• 230000001070 adhesive effect Effects 0.000 description 5
• 238000005520 cutting process Methods 0.000 description 5
• 238000005553 drilling Methods 0.000 description 5
• 229920006351 engineering plastic Polymers 0.000 description 5
• 229920002492 poly(sulfone) Polymers 0.000 description 5
• 229920006393 polyether sulfone Polymers 0.000 description 5
• 238000007788 roughening Methods 0.000 description 5
• 239000000126 substance Substances 0.000 description 5
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
• 239000000853 adhesive Substances 0.000 description 4
• 239000003112 inhibitor Substances 0.000 description 4
• 239000004593 Epoxy Substances 0.000 description 3
• VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
• 239000005977 Ethylene Substances 0.000 description 3
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
• 239000003963 antioxidant agent Substances 0.000 description 3
• 238000006243 chemical reaction Methods 0.000 description 3
• 239000002131 composite material Substances 0.000 description 3
• 229920001577 copolymer Polymers 0.000 description 3
• 238000004132 cross linking Methods 0.000 description 3
• 230000002209 hydrophobic effect Effects 0.000 description 3
• 239000011810 insulating material Substances 0.000 description 3
• 229920001187 thermosetting polymer Polymers 0.000 description 3
• 238000011282 treatment Methods 0.000 description 3
• 239000002966 varnish Substances 0.000 description 3
• XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
• XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
• QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
• MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
• JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
• QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
• IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 2
• RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
• 239000002253 acid Substances 0.000 description 2
• 150000007513 acids Chemical class 0.000 description 2
• QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
• 230000005540 biological transmission Effects 0.000 description 2
• 229910052799 carbon Inorganic materials 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 238000005253 cladding Methods 0.000 description 2
• 238000004891 communication Methods 0.000 description 2
• 229920003020 cross-linked polyethylene Polymers 0.000 description 2
• 239000004703 cross-linked polyethylene Substances 0.000 description 2
• JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
• QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
• XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
• FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
• NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
• 150000002430 hydrocarbons Chemical group 0.000 description 2
• 229910052739 hydrogen Inorganic materials 0.000 description 2
• 239000001257 hydrogen Substances 0.000 description 2
• 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
• 238000009413 insulation Methods 0.000 description 2
• 239000011229 interlayer Substances 0.000 description 2
• 229910052742 iron Inorganic materials 0.000 description 2
• GVYLCNUFSHDAAW-UHFFFAOYSA-N mirex Chemical compound ClC12C(Cl)(Cl)C3(Cl)C4(Cl)C1(Cl)C1(Cl)C2(Cl)C3(Cl)C4(Cl)C1(Cl)Cl GVYLCNUFSHDAAW-UHFFFAOYSA-N 0.000 description 2
• 125000000962 organic group Chemical group 0.000 description 2
• 229910052760 oxygen Inorganic materials 0.000 description 2
• 239000001301 oxygen Substances 0.000 description 2
• BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
• 229920000728 polyester Polymers 0.000 description 2
• 229920005638 polyethylene monopolymer Polymers 0.000 description 2
• 229920005990 polystyrene resin Polymers 0.000 description 2
• 238000003825 pressing Methods 0.000 description 2
• 238000012545 processing Methods 0.000 description 2
• 238000004080 punching Methods 0.000 description 2
• BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
• OBETXYAYXDNJHR-UHFFFAOYSA-M 2-ethylhexanoate Chemical compound CCCCC(CC)C([O-])=O OBETXYAYXDNJHR-UHFFFAOYSA-M 0.000 description 1
• KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
• 229910001369 Brass Inorganic materials 0.000 description 1
• 229910000906 Bronze Inorganic materials 0.000 description 1
• 229910000570 Cupronickel Inorganic materials 0.000 description 1
• 239000004716 Ethylene/acrylic acid copolymer Substances 0.000 description 1
• 239000004677 Nylon Substances 0.000 description 1
• 239000004696 Poly ether ether ketone Substances 0.000 description 1
• 239000005062 Polybutadiene Substances 0.000 description 1
• 239000004721 Polyphenylene oxide Substances 0.000 description 1
• 239000004734 Polyphenylene sulfide Substances 0.000 description 1
• 229920013632 Ryton Polymers 0.000 description 1
• 239000004736 Ryton® Substances 0.000 description 1
• XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
• ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
• RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 1
• CQQXCSFSYHAZOO-UHFFFAOYSA-L [acetyloxy(dioctyl)stannyl] acetate Chemical compound CCCCCCCC[Sn](OC(C)=O)(OC(C)=O)CCCCCCCC CQQXCSFSYHAZOO-UHFFFAOYSA-L 0.000 description 1
• 239000000654 additive Substances 0.000 description 1
• 230000000996 additive effect Effects 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 229910000410 antimony oxide Inorganic materials 0.000 description 1
• 230000003078 antioxidant effect Effects 0.000 description 1
• 239000010951 brass Substances 0.000 description 1
• 239000010974 bronze Substances 0.000 description 1
• YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
• 150000001735 carboxylic acids Chemical class 0.000 description 1
• 239000002738 chelating agent Substances 0.000 description 1
• 238000003889 chemical engineering Methods 0.000 description 1
• 239000003795 chemical substances by application Substances 0.000 description 1
• KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 239000003086 colorant Substances 0.000 description 1
• 150000001875 compounds Chemical class 0.000 description 1
• KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
• JQZRVMZHTADUSY-UHFFFAOYSA-L di(octanoyloxy)tin Chemical compound [Sn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O JQZRVMZHTADUSY-UHFFFAOYSA-L 0.000 description 1
• PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 1
• 235000014113 dietary fatty acids Nutrition 0.000 description 1
• 238000010292 electrical insulation Methods 0.000 description 1
• 238000010894 electron beam technology Methods 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 150000002148 esters Chemical class 0.000 description 1
• 238000011156 evaluation Methods 0.000 description 1
• 229930195729 fatty acid Natural products 0.000 description 1
• 239000000194 fatty acid Substances 0.000 description 1
• 150000004665 fatty acids Chemical class 0.000 description 1
• 239000000835 fiber Substances 0.000 description 1
• 239000000945 filler Substances 0.000 description 1
• 239000003063 flame retardant Substances 0.000 description 1
• AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
• 230000004927 fusion Effects 0.000 description 1
• 239000003365 glass fiber Substances 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• 239000008187 granular material Substances 0.000 description 1
• 229920001903 high density polyethylene Polymers 0.000 description 1
• 239000004700 high-density polyethylene Substances 0.000 description 1
• 229910052500 inorganic mineral Inorganic materials 0.000 description 1
• 238000010884 ion-beam technique Methods 0.000 description 1
• GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
• 239000007788 liquid Substances 0.000 description 1
• 229920001684 low density polyethylene Polymers 0.000 description 1
• 239000004702 low-density polyethylene Substances 0.000 description 1
• 238000002844 melting Methods 0.000 description 1
• 230000008018 melting Effects 0.000 description 1
• 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
• 239000010445 mica Substances 0.000 description 1
• 229910052618 mica group Inorganic materials 0.000 description 1
• 239000011707 mineral Substances 0.000 description 1
• 239000000178 monomer Substances 0.000 description 1
• GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 239000004745 nonwoven fabric Substances 0.000 description 1
• 229920001778 nylon Polymers 0.000 description 1
• 150000007530 organic bases Chemical class 0.000 description 1
• 150000002902 organometallic compounds Chemical class 0.000 description 1
• 239000007800 oxidant agent Substances 0.000 description 1
• 230000003647 oxidation Effects 0.000 description 1
• 238000007254 oxidation reaction Methods 0.000 description 1
• VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
• 239000008188 pellet Substances 0.000 description 1
• 229920001568 phenolic resin Polymers 0.000 description 1
• 239000005011 phenolic resin Substances 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 229910052697 platinum Inorganic materials 0.000 description 1
• 229920002857 polybutadiene Polymers 0.000 description 1
• 229920001225 polyester resin Polymers 0.000 description 1
• 239000004645 polyester resin Substances 0.000 description 1
• 229920002530 polyetherether ketone Polymers 0.000 description 1
• 229920001721 polyimide Polymers 0.000 description 1
• 239000009719 polyimide resin Substances 0.000 description 1
• 229920006380 polyphenylene oxide Polymers 0.000 description 1
• 229920000069 polyphenylene sulfide Polymers 0.000 description 1
• 239000000047 product Substances 0.000 description 1
• UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
• 238000011160 research Methods 0.000 description 1
• 150000003839 salts Chemical class 0.000 description 1
• 238000005488 sandblasting Methods 0.000 description 1
• 229910052710 silicon Inorganic materials 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 239000004332 silver Substances 0.000 description 1
• 239000007787 solid Substances 0.000 description 1
• 229910001220 stainless steel Inorganic materials 0.000 description 1
• 239000010935 stainless steel Substances 0.000 description 1
• 239000013589 supplement Substances 0.000 description 1
• 239000002344 surface layer Substances 0.000 description 1
• 238000010998 test method Methods 0.000 description 1
• 150000003606 tin compounds Chemical class 0.000 description 1
• 239000010936 titanium Substances 0.000 description 1
• 229910052719 titanium Inorganic materials 0.000 description 1
• CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1