JPS6122428B2 - - Google Patents
Info
- Publication number
- JPS6122428B2 JPS6122428B2 JP10113778A JP10113778A JPS6122428B2 JP S6122428 B2 JPS6122428 B2 JP S6122428B2 JP 10113778 A JP10113778 A JP 10113778A JP 10113778 A JP10113778 A JP 10113778A JP S6122428 B2 JPS6122428 B2 JP S6122428B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- solder
- base material
- layer
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 45
- 229910000679 solder Inorganic materials 0.000 claims description 39
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 36
- 229910052709 silver Inorganic materials 0.000 claims description 36
- 239000004332 silver Substances 0.000 claims description 36
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 46
- 238000007747 plating Methods 0.000 description 26
- 229910052718 tin Inorganic materials 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- -1 that is Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10113778A JPS5528259A (en) | 1978-08-19 | 1978-08-19 | Method of forming electrically connecting plane |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10113778A JPS5528259A (en) | 1978-08-19 | 1978-08-19 | Method of forming electrically connecting plane |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5528259A JPS5528259A (en) | 1980-02-28 |
JPS6122428B2 true JPS6122428B2 (fr) | 1986-05-31 |
Family
ID=14292684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10113778A Granted JPS5528259A (en) | 1978-08-19 | 1978-08-19 | Method of forming electrically connecting plane |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5528259A (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4935735B2 (ja) * | 2008-03-26 | 2012-05-23 | トヨタ自動車株式会社 | バスバー及びその製造方法 |
JP5146841B2 (ja) * | 2009-06-11 | 2013-02-20 | 横浜プレシジョン株式会社 | メッキ装置 |
JP6108221B2 (ja) * | 2012-04-17 | 2017-04-05 | 株式会社Gsユアサ | 蓄電素子 |
-
1978
- 1978-08-19 JP JP10113778A patent/JPS5528259A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5528259A (en) | 1980-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3208835A (en) | Thermoelectric members | |
JPS59145553A (ja) | 複合構造体及びその形成方法 | |
CA3065848A1 (fr) | Joint de borne en cuivre et conducteur en aluminium et son procede de soudage par ultrasons | |
US20120000964A1 (en) | Battery tab joints and methods of making | |
JPH11350188A (ja) | 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品 | |
JP4086949B2 (ja) | 金属被覆部材 | |
WO2007125939A1 (fr) | Materiau de revetement pour raccordement de cablage et element de raccordement de cablage traite a partir du materiau de revetement | |
US4902867A (en) | Method of joining an insulated wire to a conductive terminal | |
JP2009129983A (ja) | 接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法 | |
JPS6122428B2 (fr) | ||
US5121871A (en) | Solder extrusion pressure bonding process and bonded products produced thereby | |
JPH0867978A (ja) | スパッタリング用ターゲットのはんだ付け方法 | |
JPS6326890Y2 (fr) | ||
JPS63123594A (ja) | 低温接合用合金 | |
US3393447A (en) | Fluxless brazing of aluminum | |
JP2002307165A (ja) | ろう付け方法 | |
JP2011014257A (ja) | アルミニウム合金導体 | |
JP2820544B2 (ja) | 銅又は銅合金の抵抗溶接方法及び抵抗溶接用銅又銅合金製電気・電子部品材料 | |
JPS6281268A (ja) | 半田付け方法 | |
KR880000683B1 (ko) | 구리-알루미늄 접합판의 제조방법 | |
JPH02137306A (ja) | 圧接用接合端子 | |
JP4646369B2 (ja) | 耐食性に優れた銅ブスバーおよびその製造方法 | |
JPH0361313B2 (fr) | ||
JP6558533B2 (ja) | 接続部材 | |
JPH0489180A (ja) | 銅乃至銅合金と鉄乃至鉄合金との抵抗溶接方法 |