JPS61220398A - 多層印刷配線板 - Google Patents

多層印刷配線板

Info

Publication number
JPS61220398A
JPS61220398A JP6056685A JP6056685A JPS61220398A JP S61220398 A JPS61220398 A JP S61220398A JP 6056685 A JP6056685 A JP 6056685A JP 6056685 A JP6056685 A JP 6056685A JP S61220398 A JPS61220398 A JP S61220398A
Authority
JP
Japan
Prior art keywords
layer
grid lines
pattern
intersections
vertical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6056685A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0535596B2 (enrdf_load_stackoverflow
Inventor
板倉　栄
森川　修丞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6056685A priority Critical patent/JPS61220398A/ja
Priority to CA000501578A priority patent/CA1237820A/en
Priority to US06/828,717 priority patent/US4636919A/en
Publication of JPS61220398A publication Critical patent/JPS61220398A/ja
Publication of JPH0535596B2 publication Critical patent/JPH0535596B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP6056685A 1985-03-20 1985-03-27 多層印刷配線板 Granted JPS61220398A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP6056685A JPS61220398A (ja) 1985-03-27 1985-03-27 多層印刷配線板
CA000501578A CA1237820A (en) 1985-03-20 1986-02-11 Multilayer printed circuit board
US06/828,717 US4636919A (en) 1985-03-20 1986-02-12 Multilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6056685A JPS61220398A (ja) 1985-03-27 1985-03-27 多層印刷配線板

Publications (2)

Publication Number Publication Date
JPS61220398A true JPS61220398A (ja) 1986-09-30
JPH0535596B2 JPH0535596B2 (enrdf_load_stackoverflow) 1993-05-26

Family

ID=13145938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6056685A Granted JPS61220398A (ja) 1985-03-20 1985-03-27 多層印刷配線板

Country Status (1)

Country Link
JP (1) JPS61220398A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6846993B2 (en) 2001-10-12 2005-01-25 Nec Corporation Multilayer printed wiring board and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6846993B2 (en) 2001-10-12 2005-01-25 Nec Corporation Multilayer printed wiring board and its manufacturing method
US7290333B2 (en) 2001-10-12 2007-11-06 Nec Corporation Manufacturing method of a multilayer printed wiring board

Also Published As

Publication number Publication date
JPH0535596B2 (enrdf_load_stackoverflow) 1993-05-26

Similar Documents

Publication Publication Date Title
ATE22627T1 (de) Vorrichtung zur kontaktlosen uebertragung von informationen zwischen relativ zueinander rotierenden bauteilen.
DE59901089D1 (de) Verfahren zur herstellung von verdrahtungen mit elektrisch leitenden querverbindungen zwischen ober- und unterseite eines substrats sowie verdrahtung mit derartigen querverbindungen
JPS61220398A (ja) 多層印刷配線板
JP2001144091A (ja) 半導体集積回路
DE3788485D1 (de) Verfahren zur Herstellung einer Planarleiterbahn durch isotropes Abscheiden von leitendem Werkstoff.
ATE334479T1 (de) VERFAHREN ZUR HERSTELLUNG INTEGRIERTER SCHALTUNGEN MIT VERBESSERTEN LEITERBAHNEN IN SOGENANNTER ßSÄGEBÜGELß-FORM
SE8702704L (sv) Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid genomfoerande av saettet
JPH0167740U (enrdf_load_stackoverflow)
JPH0451504Y2 (enrdf_load_stackoverflow)
JPS6390189A (ja) プリント配線板の配線パタ−ン
JPS61114596A (ja) 多層プリント配線板
JPH0510379Y2 (enrdf_load_stackoverflow)
JPH04276698A (ja) 共通バス分離型バックワイヤリングボード
GB1414018A (en) Field effect transistor integrated circuit manufacture
JPH02110365U (enrdf_load_stackoverflow)
JPH06334157A (ja) 集積回路とその製造方法
JPS59161892A (ja) パタ−ン配線基板
JPS62195193A (ja) プリント回路基板設計用ｃａｄシステム
JPH01216590A (ja) プリント板
JPS63207197A (ja) 電子部品取付け構造
JPH03120065U (enrdf_load_stackoverflow)
JPS61253837A (ja) 高密度ｌｓｉ基板
JPS6480097A (en) Manufacture of printed wiring board
JPS6343344A (ja) マスタスライス方式ｌｓｉのブロツク
JPS63304375A (ja) 自動配線方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees