JPH0167740U - - Google Patents
Info
- Publication number
- JPH0167740U JPH0167740U JP16385787U JP16385787U JPH0167740U JP H0167740 U JPH0167740 U JP H0167740U JP 16385787 U JP16385787 U JP 16385787U JP 16385787 U JP16385787 U JP 16385787U JP H0167740 U JPH0167740 U JP H0167740U
- Authority
- JP
- Japan
- Prior art keywords
- land
- mounting
- integrated circuit
- wiring
- mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000008188 pellet Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16385787U JPH0167740U (enrdf_load_stackoverflow) | 1987-10-26 | 1987-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16385787U JPH0167740U (enrdf_load_stackoverflow) | 1987-10-26 | 1987-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167740U true JPH0167740U (enrdf_load_stackoverflow) | 1989-05-01 |
Family
ID=31448960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16385787U Pending JPH0167740U (enrdf_load_stackoverflow) | 1987-10-26 | 1987-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167740U (enrdf_load_stackoverflow) |
-
1987
- 1987-10-26 JP JP16385787U patent/JPH0167740U/ja active Pending