JPS61205153A - 光プリントヘツド - Google Patents

光プリントヘツド

Info

Publication number
JPS61205153A
JPS61205153A JP60044907A JP4490785A JPS61205153A JP S61205153 A JPS61205153 A JP S61205153A JP 60044907 A JP60044907 A JP 60044907A JP 4490785 A JP4490785 A JP 4490785A JP S61205153 A JPS61205153 A JP S61205153A
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
array
fpc
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60044907A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0321354B2 (enrdf_load_stackoverflow
Inventor
Otoo Chiba
千葉　己生
Hiroshi Furuya
博司 古谷
Yukio Nakamura
幸夫 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP60044907A priority Critical patent/JPS61205153A/ja
Publication of JPS61205153A publication Critical patent/JPS61205153A/ja
Publication of JPH0321354B2 publication Critical patent/JPH0321354B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Dot-Matrix Printers And Others (AREA)
JP60044907A 1985-03-08 1985-03-08 光プリントヘツド Granted JPS61205153A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60044907A JPS61205153A (ja) 1985-03-08 1985-03-08 光プリントヘツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60044907A JPS61205153A (ja) 1985-03-08 1985-03-08 光プリントヘツド

Publications (2)

Publication Number Publication Date
JPS61205153A true JPS61205153A (ja) 1986-09-11
JPH0321354B2 JPH0321354B2 (enrdf_load_stackoverflow) 1991-03-22

Family

ID=12704535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60044907A Granted JPS61205153A (ja) 1985-03-08 1985-03-08 光プリントヘツド

Country Status (1)

Country Link
JP (1) JPS61205153A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127845U (enrdf_load_stackoverflow) * 1988-02-23 1989-08-31
WO1990001751A1 (en) * 1988-08-05 1990-02-22 Eastman Kodak Company Led array printhead and method of making same
JPH03219976A (ja) * 1990-01-25 1991-09-27 Tokyo Electric Co Ltd 端面発光型ｅｌプリンタ
JP2001087226A (ja) * 1999-08-04 2001-04-03 Oculus Optikgeraete Gmbh スリットプロジェクタ
JP2010023482A (ja) * 2008-06-20 2010-02-04 Seiko Epson Corp 発光装置および電子機器

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127845U (enrdf_load_stackoverflow) * 1988-02-23 1989-08-31
WO1990001751A1 (en) * 1988-08-05 1990-02-22 Eastman Kodak Company Led array printhead and method of making same
JPH03219976A (ja) * 1990-01-25 1991-09-27 Tokyo Electric Co Ltd 端面発光型ｅｌプリンタ
JP2001087226A (ja) * 1999-08-04 2001-04-03 Oculus Optikgeraete Gmbh スリットプロジェクタ
JP2010023482A (ja) * 2008-06-20 2010-02-04 Seiko Epson Corp 発光装置および電子機器

Also Published As

Publication number Publication date
JPH0321354B2 (enrdf_load_stackoverflow) 1991-03-22

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