JPS61205153A - Optical printing head - Google Patents
Optical printing headInfo
- Publication number
- JPS61205153A JPS61205153A JP60044907A JP4490785A JPS61205153A JP S61205153 A JPS61205153 A JP S61205153A JP 60044907 A JP60044907 A JP 60044907A JP 4490785 A JP4490785 A JP 4490785A JP S61205153 A JPS61205153 A JP S61205153A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- array
- fpc
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、光プリントヘッドにおける複数の発光素子ご
発光素子駆動ドライバ部の接続構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a connection structure between a plurality of light emitting elements and a light emitting element driving driver section in an optical print head.
従来の光プリントヘッドを第２図及び第３図に基づいて
説明する。A conventional optical print head will be explained based on FIGS. 2 and 3.
第２図は光プリントヘッドユニットの発光部の一構成例
を示す平面図、第３図はＬＥＤプリントヘッドユニット
の一列を示す平面図である。第２図において、１１＋１
２・・・１ｎは発光ダイオードを用いた発光素子（以下
、ＬｇＤと記す。）、２１．２２・・・２ｎはアルミ電
極、３はＬ ｇ Ｄ ｂ〜１ｎ及びアルミ電極２１〜２
ｎとからなるＬｇＤアレイチップ単体を搭載したＬＥＤ
アレイチンプ板（以下、ＬＥＤモジュールと記す。）で
ある。FIG. 2 is a plan view showing a configuration example of a light emitting section of an optical print head unit, and FIG. 3 is a plan view showing a row of LED print head units. In Figure 2, 11+1
2...1n is a light emitting element using a light emitting diode (hereinafter referred to as LgD), 21.22...2n is an aluminum electrode, 3 is L g D b~1n and aluminum electrodes 21~2
LED equipped with a single LgD array chip consisting of
This is an array chimp board (hereinafter referred to as an LED module).
第３図において、４１１４２・・・４ｎは前記ＬＦＸＤ
モジュール３と接続するフレキシブルプリント配線板（
以下、ＦＰＣと記す。 ） 、５１ｙ５ｚ＝−５ｎ は
ＬＦＤ駆動ドライバ（以下、ドライバと記す。）、６１
ｐ６２・・・６ｎは前記ドライバ５１〜５ｎ単体をそれ
ぞれ搭載したドライバチップ板（以下、ドライバモジュ
ールと記す。）、７．８は前記ドライバモジュール６１
〜６ｎとそれぞれ接続するフレキシブルプリント配線板
（以下、ＦＰＣと記す。）、９は前記ｐｐｃ７ 、Ｂと
接続するデータコントロール基板、１０は前記データコ
ントロール基板９に搭載したインタフェースである。こ
のような構成の従来例は、ＬＥＤモジュール３に１ｍｍ
クシ１ｏ前後のＬＥＤ１１〜１ｎを有する。そノタメ、
Ｌ］１３Ｄｊ１〜１ｎのピッチが狭くな＃）ＬＥＤ１１
〜１ｎからのアルミ電極２１〜２ｎを第２図に示す如く
千鳥状に配置して、ワイヤポンディング接続のためのス
ペースを確保している。ここで、ワイヤポンディングに
ょシ岡々のアルミ電極２１〜２ｎからＬ Ｂ Ｄ １ｉ
〜１ｎの通電線を取出し、その一方をＬＥＤモジュール
３の個々の導電パターンに前記同様ワイヤポンディング
する。この導電パターンは、ＬＥＤモジュール３のセラ
ミック等の基板に予めアルミ電極２１〜２ｎのピッチと
同ピツチ程度に形成されである。In FIG. 3, 41142...4n is the LFXD
Flexible printed wiring board (
Hereinafter, it will be referred to as FPC. ), 51y5z=-5n is an LFD drive driver (hereinafter referred to as driver), 61
p62...6n are driver chip boards (hereinafter referred to as driver modules) on which the individual drivers 51 to 5n are mounted, and 7.8 is the driver module 61.
- 6n, a flexible printed circuit board (hereinafter referred to as FPC), 9 a data control board connected to the ppcs 7 and B, and 10 an interface mounted on the data control board 9. In a conventional example of such a configuration, the LED module 3 has a thickness of 1 mm.
It has LEDs 11 to 1n around the comb 1o. Sonotame,
L] 13Dj1~1n pitch is narrow #) LED11
The aluminum electrodes 21 to 2n from 1n to 1n are arranged in a staggered manner as shown in FIG. 2 to ensure a space for wire bonding connection. Here, from the wire bonding aluminum electrodes 21 to 2n, L B D 1i
~1n of current-carrying wires are taken out, and one of them is wire bonded to each conductive pattern of the LED module 3 in the same manner as described above. This conductive pattern is formed in advance on a substrate made of ceramic or the like of the LED module 3 at about the same pitch as the aluminum electrodes 21 to 2n.
そして、第３図に示す如く複数個の前記ＬＥＤモジュー
ル３を直線状に配列し、ＬＥＤモジュール３を駆動すべ
（Ｆ Ｐ Ｃ４１〜４ｎを介してドライバモジュール６
ｒ４ ｎにそれぞれ機械的に接続する。Then, as shown in FIG. 3, a plurality of the LED modules 3 are arranged in a straight line, and the LED modules 3 are driven (driver module 6 is connected via FPCs 41 to 4n).
mechanically connected to r4 n, respectively.
ま７２、ＬＥＤ１１〜１ｎを選択するドライバ５１〜５
ｎへのデータ及び印加電圧系列は、ＦＰＣ７゜８にそれ
ぞれ機械的に接続することにより供給可能となる。さら
に、これらのＦＰＣ７、ｇが、外部ユニットから入力信
号を受信するためのインタフェース１０等を含むデータ
コントロール基板９と接続することで、光プリントヘッ
ドユニットの発光部が構成される。Ma72, drivers 51 to 5 for selecting LEDs 11 to 1n
The data and applied voltage series to n can be supplied by mechanically connecting each to the FPC 7.8. Furthermore, the light emitting section of the optical print head unit is configured by connecting these FPCs 7 and g to a data control board 9 that includes an interface 10 and the like for receiving input signals from an external unit.
ところで、本構成例で重要なことは、ＬｇＤモジュール
３とＦ Ｐ Ｃ４１〜４ｎｓ並びにＦＰＣ４１〜４ｎと
ドライバモジュール６１〜６ｎの接続である。この接続
方法としては、熱やレーザにょる圧接等の方法があるが
、ここでは最も簡単な機械的に行える方法で接続してい
る。その−列を第４図に示す。By the way, what is important in this configuration example is the connection between the LgD module 3 and the FPCs 41 to 4ns and the connections between the FPCs 41 to 4n and the driver modules 61 to 6n. Although there are methods for this connection, such as pressure welding using heat or laser, here the connection is made using the simplest mechanical method. The - column is shown in FIG.
第４図において、１１は圧接用押え金具、１２は前記圧
接用押え金具１１を押付けてＬＥＤモジュール３１のね
じ孔３ａに螺合するねじ、１３はポンディングワイヤで
ある。尚、前記ＦＰＣ４１は等ヒツチで等幅のパターン
４ａを有し、またこのパターン４ａと等ピッチで等幅の
全膜厚パターン３ｂをＬＥＤモジール３が有する。In FIG. 4, reference numeral 11 denotes a pressure fitting, 12 a screw which presses the pressure fitting 11 and is screwed into the screw hole 3a of the LED module 31, and 13 a bonding wire. The FPC 41 has a pattern 4a of equal pitch and width, and the LED module 3 has a full thickness pattern 3b of equal pitch and width than the pattern 4a.
次に、ＬＥＤモジュール３の全膜厚パターン３ｂとＦＰ
Ｃ４１のパターン４ａとの圧接接続方法を説明する。先
ず、第４図の矢印に示す如く前記金厚膜パターン３ｂと
パターン４ａとをｌ：１で合致するように仮設置する。Next, the total film thickness pattern 3b of the LED module 3 and the FP
A method of pressure contacting with pattern 4a of C41 will be explained. First, as shown by the arrow in FIG. 4, the thick gold film pattern 3b and the pattern 4a are temporarily installed so that they match at a ratio of 1:1.
この仮設置は、互いのパターンピンチが狭いために顕微
鏡で監視しながし手作業で行う。その後、ＬＥＤモジュ
ール３にＦＰＣ４１を圧接用押え金具１１で押付けてね
じ１２で固定する。同様に、Ｆ’ＰＣ４２〜４ｎとＬＩ
３Ｄモジュール３をも接続する。さらに、ＦＰＣ４１〜
４ｎとドライバモジュル６１ｎ ｎとの接続も、同様に
圧接用押え金具１１で行う。そして、このような接続方
法においては、接続後に接続検査を行う必要がある。な
ぜなら、仮設置後の圧接用押え金具１１でねじ止めする
際に、ＰＰ０４１〜４ｎがピッチずれつま多位置ずれを
起したシ、また圧接用押え金具１１が中央部で湾曲した
シして、圧接不良が生じるからである。これらの修整は
、いずれも機械的に変形したシ、また手作業に依存した
シしている。This temporary installation is done manually while being monitored with a microscope because the pattern pinch between each other is narrow. Thereafter, the FPC 41 is pressed against the LED module 3 using the press fitting 11 and fixed with the screws 12. Similarly, F'PC42~4n and LI
3D module 3 is also connected. Furthermore, FPC41~
4n and the driver module 61n are similarly connected using the press fitting 11. In such a connection method, it is necessary to perform a connection test after connection. This is because, when screwing with the pressure fitting 11 after temporary installation, the pitch of PP041 to 4n may be misaligned, and the pressure fitting 11 may be curved at the center. This is because defects will occur. All of these modifications involve mechanical deformation or manual work.
したがって、このような従来例は、ＬＥＤモジュール及
びドライバモジュールに対してＦＰＣを圧接用押え金具
で機械的に圧接接続し、その後接続検査をするため、Ｌ
ＥＤの搭載密度が高くなってＦＰＣのパターン密度が高
くなった場合、不良率が高くなり信頼性が低下し、また
組立て時間の効率が悪くなシ製造コストが高くなる問題
がある。Therefore, in such a conventional example, the FPC is mechanically pressure-connected to the LED module and the driver module using a press-fitting fitting, and then the connection is inspected.
When the mounting density of EDs increases and the pattern density of FPC increases, there are problems in that the defective rate increases, reliability decreases, and the efficiency of assembly time decreases and manufacturing costs increase.
さらに、モジュール単位（この場合は、ＬＥＤモジュー
ル単体の両側にドライバモジュールが接続された状態を
言う。）の保管や整列時の固定が困難である問題がある
。Furthermore, there is a problem in that it is difficult to store the module unit (in this case, a state in which driver modules are connected to both sides of a single LED module) and to fix it during alignment.
本発明は、前記問題を解決するためになされたものであ
シ、その目的は、一枚の基板上にＬＥＤアレイ及びドラ
イバモジュールを構成することによ〕、接続作業の簡易
化と組立自動化をはかることにある。The present invention was made to solve the above problem, and its purpose is to simplify connection work and automate assembly by configuring an LED array and a driver module on a single board. It's about measuring.
前記目的を達成するため、本発明は、発光素子モジュー
ルを一体化接続する一枚の基板と、この基板に一体化接
続するＦＰＣテープと、このＦＰＣテープに二体化接続
して前記基板上に搭載するドライバとを具備することを
特徴とする特〔作用〕
前記特徴を有する本発明は、一枚の基板に発光素子アレ
イを搭載接続し、またＦＰＣテープにドライバをインナ
リードボンディング等により接続し、前記ＦＰＣテープ
の出力側と基板とをレーザまたは熱圧着等によ多接続す
る。これらの接続により一枚の基板上に発光素子アレイ
とドライバとを一体化する。In order to achieve the above object, the present invention provides a single board to which a light emitting element module is integrally connected, an FPC tape which is integrally connected to this board, and an FPC tape which is integrally connected to this FPC tape and is mounted on the board. Features [Function] The present invention having the above features includes mounting and connecting a light emitting element array on one substrate, and connecting a driver to an FPC tape by inner lead bonding or the like. , the output side of the FPC tape and the substrate are connected by laser or thermocompression bonding or the like. These connections integrate the light emitting element array and the driver on one substrate.
以下、本発明の一実施例を第１図に基づいて説明する。 An embodiment of the present invention will be described below with reference to FIG.
尚、従来しｕと同一部分には同一の番号を付す。Incidentally, parts that are the same as u have been given the same numbers.
第１図は本発明に係る光プリントヘッドの一実施例の発
光部を示す斜視図である。第１図において、１４はセラ
ミックまたはガラスエポキシ材をベースとする基板、１
５は該基板１４に厚膜印刷された金厚膜パターン、１６
はドライバ５１または５２ にデータ及び印加電圧を供
給するなめのＦＰＣテープ（または、キャリアテープと
も言う。）、１７．１８はそれぞれドライバ５１ｙ５２
のデータ入力端子、１９はＬｇＤｉ１〜１ｎからなるＬ
ＥＤアレイ、２０はボンディングワイヤである。FIG. 1 is a perspective view showing a light emitting section of an embodiment of an optical print head according to the present invention. In FIG. 1, reference numeral 14 denotes a substrate based on ceramic or glass epoxy material;
5 is a thick gold film pattern printed on the substrate 14; 16;
17 and 18 are smooth FPC tapes (or also called carrier tapes) that supply data and applied voltage to the driver 51 or 52, and 17 and 18 are the drivers 51 and 52, respectively.
data input terminal, 19 is an L consisting of LgDi1 to 1n.
In the ED array, 20 is a bonding wire.
ここで、前記金厚膜パターン１５はＬＥＤ’ｂ〜１ｎの
ピッチを有するＬｇＤアレイ１９とほぼ同ピンチのパタ
ーン幅を形成している。また、ドライバｓｌ、ｓ２ は
、前記ＬＥＤアレイ１９のＬＥＤ１１〜１ｎをｌ：ｌで
駆動し、Ｌ Ｅ Ｄ １１〜１ｎの発光若しくは失光状
態を通電電流として供給する。Here, the gold thick film pattern 15 has a pattern width that is approximately the same width as the LgD array 19 having a pitch of LED'b to 1n. Further, the drivers sl and s2 drive the LEDs 11 to 1n of the LED array 19 in a 1:1 ratio, and supply the LEDs 11 to 1n as energizing current depending on whether the LEDs 11 to 1n emit light or lose light.
次に、前記構成の作用を説用する。先ず、ＬｇＤアレイ
１９を基板１４にダイスボンディングによシ搭載接着す
る。接着されたＬＢＤアレイ１９と基板１４の金厚膜パ
ターン１５はボンディングワイヤ２０によ多接続する。Next, the operation of the above configuration will be explained. First, the LgD array 19 is mounted and adhered to the substrate 14 by die bonding. The bonded LBD array 19 and the gold thick film pattern 15 on the substrate 14 are connected to each other by bonding wires 20 .
一方、ＦＰＣテーグ１６にドライバ５１＊Ｓ２をそれぞ
れインナリードボンディング等によ多接続し、前記ＦＰ
Ｃテープ１６の出力側と前記基板１４の金厚膜パターン
１５とをレーザまたは熱圧着等によ多接続する。このと
き、ＬＰＸｎ１１〜１ｎ とドライバ５１＊ ５２の出
力線は各々ｌ：ｌに対応し、金厚膜パターン１５を介し
て接続する。以上、説明したように極めて容易にＬＥＤ
アレイ２０１個に対して２個のドライバ５１＋ ５２を
有する単体モジュールをなすことができ、駆動時はＦＰ
Ｃテーグ１６のデータ入力端子１７．１８をそれぞれ前
記したＦＰＣ７、８に接続することで光プリントヘッド
の光源部とすることができる。On the other hand, the drivers 51*S2 are connected to the FPC tag 16 by inner lead bonding, etc., and the
The output side of the C tape 16 and the thick gold film pattern 15 of the substrate 14 are connected by laser or thermocompression bonding. At this time, the output lines of LPXn11 to 1n and drivers 51*52 correspond to l:l, respectively, and are connected via the thick gold film pattern 15. As explained above, it is extremely easy to
A single module can be formed with two drivers 51+52 for 201 arrays, and when driving, the FP
By connecting the data input terminals 17 and 18 of the C tag 16 to the FPCs 7 and 8, respectively, it can be used as a light source section of an optical print head.
尚、本実施例では発光素子としてＬＥＤを用いたが、Ｌ
ＥＤに限らずＬＥＤと同等のものであれば、他の発光手
段を用いることができる。Note that in this example, an LED was used as a light emitting element, but L
Not limited to ED, other light emitting means can be used as long as it is equivalent to LED.
前記した如く、本発明に係る光プリントヘッドによれば
、発光素子アレイを搭載接続する一枚の基板と、該基板
に接続して一体化するＦＰＣテープと、該ＦＰＣテープ
に接続して前記基板に搭載一体化するドライバとを具備
したことによって、Ｆ’ＰＣテープ上にドライバを実装
して発光素子アレイと一体化した単体モジュールとする
ことができるため、従来列のような機械的な変形部がな
くなり、簡単な組立作業となるので組立自動化をはかる
ことができると共に製造コストの低減をはかることかで
きる効果がある。As described above, according to the optical print head of the present invention, there is a single board on which a light emitting element array is mounted and connected, an FPC tape that is connected to and integrated with the board, and a board that is connected to the FPC tape. By having a driver that is integrated with the F'PC tape, it is possible to create a single module that is integrated with the light emitting element array by mounting the driver on the F'PC tape. This eliminates the need for assembling and makes the assembly work simple, which has the effect of automating assembly and reducing manufacturing costs.
また、光プリントヘッドの発光部は発光素子アレイを複
数個配列して発光部となすものであるから、本発明のよ
うにモジュール単体として配列する場合、モジュール単
体での発光素子のパワー測定ができる。そのため、発光
素子アレ１のパワーの均一化つま）印字濃度の均一化や
不良発光素子モジュールの交換をモジュール単位で行う
ことができ、工数の削減や歩留りアンプ等の効果を発揮
する。Furthermore, since the light emitting part of the optical print head is formed by arranging a plurality of light emitting element arrays, when the light emitting elements are arranged as single modules as in the present invention, it is possible to measure the power of the light emitting elements in the single module. . Therefore, it is possible to make the power of the light emitting element array 1 uniform, to make the printing density uniform, and to replace a defective light emitting element module on a module by module basis, thereby achieving effects such as reduction in man-hours and increase in yield.
第１図は本発明に係る光プリントヘッドの一実施例の発
光部を示す斜視図、第２図は従来例の発光部の一構成例
を示す平面図、第３図は従来例のＬＥＤプリントヘッド
ユニットの一例を示す平面図、第４図は従来例の接続方
法を説明する斜視図である。
１１〜１ｎ ・・・ＬＥＤ ５１〜５ｎ・・・ドライバ
−４・・・基板 １６・・・ＦＰＣテープ １９・・
・ＬＥＤアレイ
手続補正書（自発）
昭和６０年７月１日FIG. 1 is a perspective view showing a light emitting part of an embodiment of an optical print head according to the present invention, FIG. 2 is a plan view showing a configuration example of a conventional light emitting part, and FIG. 3 is a conventional LED print head. FIG. 4 is a plan view showing an example of a head unit, and a perspective view illustrating a conventional connection method. 11-1n...LED 51-5n...Driver -4...Board 16...FPC tape 19...
・LED array procedure amendment (voluntary) July 1, 1985
Claims (1)
接続する光プリントヘッドにおいて、発光素子アレイを
搭載接続する一枚の基板と、該基板に接続して一体化す
るフレキシブルプリント配線板テープと、 該フレキシブルプリント配線板テープに接続して前記基
板に搭載一体化する発光素子駆動ドライバとを具備した
ことを特徴とする光プリントヘッド。[Claims] 1. In an optical print head that indirectly connects a light emitting element array and an LED drive driver, a single substrate on which the light emitting element array is mounted and connected, and a flexible material that is connected to and integrated with the substrate. An optical print head comprising: a printed wiring board tape; and a light emitting element drive driver connected to the flexible printed wiring board tape and mounted and integrated on the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60044907A JPS61205153A (en) | 1985-03-08 | 1985-03-08 | Optical printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60044907A JPS61205153A (en) | 1985-03-08 | 1985-03-08 | Optical printing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61205153A true JPS61205153A (en) | 1986-09-11 |
| JPH0321354B2 JPH0321354B2 (en) | 1991-03-22 |
Family
ID=12704535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60044907A Granted JPS61205153A (en) | 1985-03-08 | 1985-03-08 | Optical printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61205153A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01127845U (en) * | 1988-02-23 | 1989-08-31 | ||
| WO1990001751A1 (en) * | 1988-08-05 | 1990-02-22 | Eastman Kodak Company | Led array printhead and method of making same |
| JPH03219976A (en) * | 1990-01-25 | 1991-09-27 | Tokyo Electric Co Ltd | Edge emission type el printer |
| JP2001087226A (en) * | 1999-08-04 | 2001-04-03 | Oculus Optikgeraete Gmbh | Slit projector |
| JP2010023482A (en) * | 2008-06-20 | 2010-02-04 | Seiko Epson Corp | Light emitting device and electronic apparatus |
-
1985
- 1985-03-08 JP JP60044907A patent/JPS61205153A/en active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01127845U (en) * | 1988-02-23 | 1989-08-31 | ||
| WO1990001751A1 (en) * | 1988-08-05 | 1990-02-22 | Eastman Kodak Company | Led array printhead and method of making same |
| JPH03219976A (en) * | 1990-01-25 | 1991-09-27 | Tokyo Electric Co Ltd | Edge emission type el printer |
| JP2001087226A (en) * | 1999-08-04 | 2001-04-03 | Oculus Optikgeraete Gmbh | Slit projector |
| JP4518351B2 (en) * | 1999-08-04 | 2010-08-04 | オクルス オプティクゲレーテ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Slit projector |
| JP2010023482A (en) * | 2008-06-20 | 2010-02-04 | Seiko Epson Corp | Light emitting device and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0321354B2 (en) | 1991-03-22 |
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