JPS6120050U - 集積回路用セラミツクパツケ−ジ - Google Patents

集積回路用セラミツクパツケ−ジ

Info

Publication number
JPS6120050U
JPS6120050U JP1984104082U JP10408284U JPS6120050U JP S6120050 U JPS6120050 U JP S6120050U JP 1984104082 U JP1984104082 U JP 1984104082U JP 10408284 U JP10408284 U JP 10408284U JP S6120050 U JPS6120050 U JP S6120050U
Authority
JP
Japan
Prior art keywords
ceramic package
integrated circuits
integrated circuit
fixing part
element fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984104082U
Other languages
English (en)
Inventor
広美 小林
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1984104082U priority Critical patent/JPS6120050U/ja
Publication of JPS6120050U publication Critical patent/JPS6120050U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85385—Shape, e.g. interlocking features

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａおよび第２図ａはそれぞれ本考案の一実施例な
らびに他の実施例に係るパッケージ基体と取付け集積回
路素子を示す部分断面図、第１図ｂおよび第−２図ｂは
それぞれ第１図ａおよび第２図ｂにおけるＡ−Ａ矢視断
面を示す図。 第３図ａは従来の集積回路用セラミックパッケージのパ
ッケージ基体と取付け集積回路素子の部分断面図、同図
ｂは同図ａのＡ−Ａ矢視断面を示す図である。 １，１１，２１・・・・・・パッケージ基体、２・・・
・・・凹部底面（素子固着部）、３，４．１３・・・・
・・ボンデイング端子、５・・・・・・集積、回路素子
ＩＣ， ５・・・・・・ＩＣの電極、８，９，１０・・
・・・・金属細線（ボンディングワイヤ）。

Claims (1)

    【実用新案登録請求の範囲】
  1. 集積回路素子が固着される素子固着部を底面とする凹部
    を有し、前記素子固着部を囲む周壁部は外に拡がる少く
    とも一段め階段状をなし、かつ、この階段の段部上辺に
    続く平面は内側下りの斜面とされ、この斜面にボンデイ
    ング端子が設けられているパッケージ基体を備えたこと
    を特徴とする集積回路用セラミックパッケージ。
JP1984104082U 1984-07-10 1984-07-10 集積回路用セラミツクパツケ−ジ Pending JPS6120050U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984104082U JPS6120050U (ja) 1984-07-10 1984-07-10 集積回路用セラミツクパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984104082U JPS6120050U (ja) 1984-07-10 1984-07-10 集積回路用セラミツクパツケ−ジ

Publications (1)

Publication Number Publication Date
JPS6120050U true JPS6120050U (ja) 1986-02-05

Family

ID=30663446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984104082U Pending JPS6120050U (ja) 1984-07-10 1984-07-10 集積回路用セラミツクパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6120050U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351329A (ja) * 1989-07-19 1991-03-05 Kanai Jiyuuyou Kogyo Kk 紡機用回転リング

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351329A (ja) * 1989-07-19 1991-03-05 Kanai Jiyuuyou Kogyo Kk 紡機用回転リング

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