JPS5815349U - 回路基板 - Google Patents

回路基板

Info

Publication number
JPS5815349U
JPS5815349U JP1981109359U JP10935981U JPS5815349U JP S5815349 U JPS5815349 U JP S5815349U JP 1981109359 U JP1981109359 U JP 1981109359U JP 10935981 U JP10935981 U JP 10935981U JP S5815349 U JPS5815349 U JP S5815349U
Authority
JP
Japan
Prior art keywords
circuit board
circuit
semiconductor element
insulating substrate
metal cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981109359U
Other languages
English (en)
Inventor
昭一 村本
利文 中村
大沢　三郎
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP1981109359U priority Critical patent/JPS5815349U/ja
Publication of JPS5815349U publication Critical patent/JPS5815349U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図Ａ及びＢは従来の回路基板の形成工程を示す断面
図である。第２図は本考案の一実施例を示す組立て斜視
図であり、第３区は上記実施例の断面図である。第４図
、第５図及び第６図は本考案に用いられる回路構成部品
を示す平面図である。 第７図は本考案の他の実施例を示す断面図である。 １３・・・・・・絶縁基板、１４・・・・・・チップ部
品、１５・・・・・・半導体素子、２０・・・・・・ワ
イヤ、２１・・・・・・回路　　′部、２２・・・・・
・金属キャップ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板上に半導体素子とチップ部品からなる回路構成
    部品を載置固定するとともに、該回路構成部品の配線を
    ワイヤーボンディングで行ない、且つ回路部を金属キャ
    ップで覆ってなる回路基板。
JP1981109359U 1981-07-24 1981-07-24 回路基板 Pending JPS5815349U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981109359U JPS5815349U (ja) 1981-07-24 1981-07-24 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981109359U JPS5815349U (ja) 1981-07-24 1981-07-24 回路基板

Publications (1)

Publication Number Publication Date
JPS5815349U true JPS5815349U (ja) 1983-01-31

Family

ID=29903741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981109359U Pending JPS5815349U (ja) 1981-07-24 1981-07-24 回路基板

Country Status (1)

Country Link
JP (1) JPS5815349U (ja)

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