JPS61195094U - - Google Patents
Info
- Publication number
- JPS61195094U JPS61195094U JP7882385U JP7882385U JPS61195094U JP S61195094 U JPS61195094 U JP S61195094U JP 7882385 U JP7882385 U JP 7882385U JP 7882385 U JP7882385 U JP 7882385U JP S61195094 U JPS61195094 U JP S61195094U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- heat sink
- insertion protrusion
- insertion hole
- fixing pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図乃至第４図は本考案の一実施例を示し、
第１図はパワートランジスタ及び放熱板をプリン
ト配線基板から分離して表わす斜視図、第２図は
全体の上面図、第３図はプリント配線基板の下面
図、第４図は第２図中矢印方向から見た図であ
り、そして、第５図は本考案の異なる実施例を示
すプリント配線基板の下面図である。
図中、１はプリント配線基板（配線基板）、３
はランド部、７はパワートランジスタ（半導体素
子）、８は放熱板、１０は挿入突部、１２は挿入
孔部、１４は固着パターン、１５は半田である。
1 to 4 show an embodiment of the present invention,
Fig. 1 is a perspective view showing the power transistor and heat sink separated from the printed wiring board, Fig. 2 is a top view of the whole, Fig. 3 is a bottom view of the printed wiring board, and Fig. 4 is an arrow in Fig. 2. FIG. 5 is a bottom view of a printed wiring board showing a different embodiment of the present invention. In the figure, 1 is a printed wiring board (wiring board), 3
1 is a land portion, 7 is a power transistor (semiconductor element), 8 is a heat sink, 10 is an insertion projection, 12 is an insertion hole, 14 is a fixing pattern, and 15 is solder.
Claims (1)
の放熱板を立設状態にして配設するようにしたも
のであつて、前記放熱板の前記配線基板側に挿入
突部を突設し、配線基板に、その挿入突部を挿入
する挿入孔部を形成すると共に該挿入孔部の周囲
部に固着パターンを設け、この固着パターンと前
記挿入突部とを半田付けしたことを特徴とする配
線基板装置。 A semiconductor element having a heat sink is arranged on a wiring board with the heat sink in an upright state, and an insertion protrusion is provided protrudingly on the side of the wiring board of the heat sink, and the wiring A wiring board characterized in that an insertion hole into which the insertion protrusion is inserted is formed in the board, a fixing pattern is provided around the insertion hole, and the fixing pattern and the insertion protrusion are soldered. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7882385U JPS61195094U (en) | 1985-05-27 | 1985-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7882385U JPS61195094U (en) | 1985-05-27 | 1985-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195094U true JPS61195094U (en) | 1986-12-04 |
Family
ID=30623158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7882385U Pending JPS61195094U (en) | 1985-05-27 | 1985-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195094U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016058597A (en) * | 2014-09-11 | 2016-04-21 | アール・ビー・コントロールズ株式会社 | Circuit board |
-
1985
- 1985-05-27 JP JP7882385U patent/JPS61195094U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016058597A (en) * | 2014-09-11 | 2016-04-21 | アール・ビー・コントロールズ株式会社 | Circuit board |
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