JPS61187260A - 集積回路の実装構造 - Google Patents

集積回路の実装構造

Info

Publication number
JPS61187260A
JPS61187260A JP60027220A JP2722085A JPS61187260A JP S61187260 A JPS61187260 A JP S61187260A JP 60027220 A JP60027220 A JP 60027220A JP 2722085 A JP2722085 A JP 2722085A JP S61187260 A JPS61187260 A JP S61187260A
Authority
JP
Japan
Prior art keywords
cooling plate
integrated circuit
holding frame
kerfs
substrate holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60027220A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0426552B2 (enExample
Inventor
Takashi Hagiwara
隆志 萩原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60027220A priority Critical patent/JPS61187260A/ja
Publication of JPS61187260A publication Critical patent/JPS61187260A/ja
Publication of JPH0426552B2 publication Critical patent/JPH0426552B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60027220A 1985-02-14 1985-02-14 集積回路の実装構造 Granted JPS61187260A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60027220A JPS61187260A (ja) 1985-02-14 1985-02-14 集積回路の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60027220A JPS61187260A (ja) 1985-02-14 1985-02-14 集積回路の実装構造

Publications (2)

Publication Number Publication Date
JPS61187260A true JPS61187260A (ja) 1986-08-20
JPH0426552B2 JPH0426552B2 (enExample) 1992-05-07

Family

ID=12215014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60027220A Granted JPS61187260A (ja) 1985-02-14 1985-02-14 集積回路の実装構造

Country Status (1)

Country Link
JP (1) JPS61187260A (enExample)

Also Published As

Publication number Publication date
JPH0426552B2 (enExample) 1992-05-07

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