JPS61187260A - 集積回路の実装構造 - Google Patents

集積回路の実装構造

Info

Publication number
JPS61187260A
JPS61187260A JP60027220A JP2722085A JPS61187260A JP S61187260 A JPS61187260 A JP S61187260A JP 60027220 A JP60027220 A JP 60027220A JP 2722085 A JP2722085 A JP 2722085A JP S61187260 A JPS61187260 A JP S61187260A
Authority
JP
Japan
Prior art keywords
cooling plate
integrated circuit
holding frame
kerfs
substrate holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60027220A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0426552B2 (enExample
Inventor
Takashi Hagiwara
隆志 萩原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60027220A priority Critical patent/JPS61187260A/ja
Publication of JPS61187260A publication Critical patent/JPS61187260A/ja
Publication of JPH0426552B2 publication Critical patent/JPH0426552B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/611

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP60027220A 1985-02-14 1985-02-14 集積回路の実装構造 Granted JPS61187260A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60027220A JPS61187260A (ja) 1985-02-14 1985-02-14 集積回路の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60027220A JPS61187260A (ja) 1985-02-14 1985-02-14 集積回路の実装構造

Publications (2)

Publication Number Publication Date
JPS61187260A true JPS61187260A (ja) 1986-08-20
JPH0426552B2 JPH0426552B2 (enExample) 1992-05-07

Family

ID=12215014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60027220A Granted JPS61187260A (ja) 1985-02-14 1985-02-14 集積回路の実装構造

Country Status (1)

Country Link
JP (1) JPS61187260A (enExample)

Also Published As

Publication number Publication date
JPH0426552B2 (enExample) 1992-05-07

Similar Documents

Publication Publication Date Title
JP3422675B2 (ja) 電子集積回路パッケージ
JP2950472B2 (ja) 電子集積回路パッケージのメタライゼーション構造を形成する方法
JPH02305498A (ja) コールドプレート組立体
JPH0247895A (ja) 放熱板
JPS61187260A (ja) 集積回路の実装構造
JPS61292944A (ja) 集積回路パツケ−ジの液体冷却構造
JPH11266090A (ja) 半導体装置
JP3523094B2 (ja) 半導体装置
JPH1098289A (ja) 電子部品の放熱構造
JPH08228045A (ja) 半導体レーザのマウント構造
JPH0563053U (ja) 混成集積回路基板
JP3577338B2 (ja) 電子機器の放熱板
JPS6151947A (ja) 半導体装置
JPS63140556A (ja) 半導体装置
JPH06181395A (ja) 放熱形プリント配線板
JPH03250794A (ja) 半導体装置
KR910003792A (ko) 전력 반도체 패키지
JP2002164483A (ja) 冷却装置
JPH0265199A (ja) フェライトビーズコア付き放熱スペーサー
JP2000228595A (ja) ヒートシンク
JPH11204967A (ja) 半導体装置
JPH01318259A (ja) 混成集積回路装置
JPH07297330A (ja) 放熱体固定具
JPH01248549A (ja) 半導体装置の製造方法
JPS62243399A (ja) プリント基板支持装置