JPS611843U - フイルムキヤリアｉｃの切断装置 - Google Patents

フイルムキヤリアｉｃの切断装置

Info

Publication number
JPS611843U
JPS611843U JP8424884U JP8424884U JPS611843U JP S611843 U JPS611843 U JP S611843U JP 8424884 U JP8424884 U JP 8424884U JP 8424884 U JP8424884 U JP 8424884U JP S611843 U JPS611843 U JP S611843U
Authority
JP
Japan
Prior art keywords
film carrier
cutting device
chips
lower mold
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8424884U
Other languages
English (en)
Japanese (ja)
Other versions
JPH023628Y2 (enrdf_load_stackoverflow
Inventor
徹 田部井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azbil Corp
Original Assignee
Azbil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azbil Corp filed Critical Azbil Corp
Priority to JP8424884U priority Critical patent/JPS611843U/ja
Publication of JPS611843U publication Critical patent/JPS611843U/ja
Application granted granted Critical
Publication of JPH023628Y2 publication Critical patent/JPH023628Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body

Landscapes

  • Wire Bonding (AREA)
JP8424884U 1984-06-08 1984-06-08 フイルムキヤリアｉｃの切断装置 Granted JPS611843U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8424884U JPS611843U (ja) 1984-06-08 1984-06-08 フイルムキヤリアｉｃの切断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8424884U JPS611843U (ja) 1984-06-08 1984-06-08 フイルムキヤリアｉｃの切断装置

Publications (2)

Publication Number Publication Date
JPS611843U true JPS611843U (ja) 1986-01-08
JPH023628Y2 JPH023628Y2 (enrdf_load_stackoverflow) 1990-01-29

Family

ID=30633593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8424884U Granted JPS611843U (ja) 1984-06-08 1984-06-08 フイルムキヤリアｉｃの切断装置

Country Status (1)

Country Link
JP (1) JPS611843U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08317817A (ja) * 1995-05-05 1996-12-03 L'oreal Sa メーキャップ製品の包装および塗布用装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08317817A (ja) * 1995-05-05 1996-12-03 L'oreal Sa メーキャップ製品の包装および塗布用装置
KR100419300B1 (ko) * 1995-05-05 2004-05-27 로레알 화장품포장및도포용기구

Also Published As

Publication number Publication date
JPH023628Y2 (enrdf_load_stackoverflow) 1990-01-29

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