JPS61182034U - - Google Patents
Info
- Publication number
- JPS61182034U JPS61182034U JP6651285U JP6651285U JPS61182034U JP S61182034 U JPS61182034 U JP S61182034U JP 6651285 U JP6651285 U JP 6651285U JP 6651285 U JP6651285 U JP 6651285U JP S61182034 U JPS61182034 U JP S61182034U
- Authority
- JP
- Japan
- Prior art keywords
- sealing metal
- outer periphery
- lid
- protrusion
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図から第３図は従来品を示し、第１図は完
成品の側面図、第２図ａ，ｂは蓋の側面図と平面
図、第３図ａ，ｂはケースの平面図と側面図を示
す。第４図と第５図は本考案の一実施例であり、
第４図ａ，ｂは蓋の側面図と平面図、第５図は完
成品の側面図を示す。
１……蓋、２……封止メタル、３……ケース、
４……リード端子、５……封止メタル、６……は
んだフレーム、７……蓋、８……封止メタル、９
……突起。
Figures 1 to 3 show the conventional product, Figure 1 is a side view of the finished product, Figures 2a and b are side views and top views of the lid, and Figures 3a and b are top views of the case. A side view is shown. Figures 4 and 5 are an embodiment of the present invention,
4a and 4b show a side view and a plan view of the lid, and FIG. 5 shows a side view of the finished product. 1... Lid, 2... Sealing metal, 3... Case,
4... Lead terminal, 5... Sealing metal, 6... Solder frame, 7... Lid, 8... Sealing metal, 9
……protrusion.
Claims (1)
ナ部に突起をもうけた蓋と、内部に半導体チツプ
等を収容して外周にリード端子をもうけ上面外周
に封止メタルをもうけてなるケースとを、はんだ
を用いて一体化して形成されたことを特徴とする
突起付きＩＣパツケージ。 A lid with a sealing metal around the ceramic board and a protrusion on the corner, and a case with a semiconductor chip inside, lead terminals on the outer periphery, and a sealing metal on the outer periphery of the top surface are soldered together. An IC package cage with protrusions, characterized in that it is integrally formed using.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6651285U JPS61182034U (en) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6651285U JPS61182034U (en) | 1985-05-07 | 1985-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61182034U true JPS61182034U (en) | 1986-11-13 |
Family
ID=30599487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6651285U Pending JPS61182034U (en) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61182034U (en) |
-
1985
- 1985-05-07 JP JP6651285U patent/JPS61182034U/ja active Pending