JPS61179769U - - Google Patents

Info

Publication number
JPS61179769U
JPS61179769U JP6386985U JP6386985U JPS61179769U JP S61179769 U JPS61179769 U JP S61179769U JP 6386985 U JP6386985 U JP 6386985U JP 6386985 U JP6386985 U JP 6386985U JP S61179769 U JPS61179769 U JP S61179769U
Authority
JP
Japan
Prior art keywords
solder
circuit board
printed circuit
wiring body
resist coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6386985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6386985U priority Critical patent/JPS61179769U/ja
Publication of JPS61179769U publication Critical patent/JPS61179769U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す平面図、第2
図は第1図のA―A線断面図、第3図は第1図の
チツプ部品配線体におけるプリント基板の平面図
、第4図は第3図のB―B線断面図である。第5
図は従来のチツプ部品配線体の平面図、第6図は
第5図C―C線断面図、第7図は第5図における
プリント基板の平面図、第8図は第7図のD―D
線断面図である。 2,3……チツプ部品、2a,2b,3a,3
b……電極、9……プリント基板、12……半田
レジスト被膜、14―1,14―2,14―3…
…半田。
Figure 1 is a plan view showing one embodiment of the present invention;
1, FIG. 3 is a plan view of a printed circuit board in the chip component wiring body of FIG. 1, and FIG. 4 is a sectional view taken along line BB in FIG. 3. Fifth
The figure is a plan view of a conventional chip component wiring body, FIG. 6 is a sectional view taken along the line C--C in FIG. 5, FIG. 7 is a plan view of the printed circuit board in FIG. 5, and FIG. D
FIG. 2, 3... Chip parts, 2a, 2b, 3a, 3
b... Electrode, 9... Printed circuit board, 12... Solder resist coating, 14-1, 14-2, 14-3...
…solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板の半田レジスト被膜上で接近した
複数のチツプ部品の電極間を直接に半田接続した
ことを特徴とするチツプ部品配線体。
A chip component wiring body characterized in that electrodes of a plurality of chip components that are close to each other are directly connected by solder on a solder resist coating of a printed circuit board.
JP6386985U 1985-04-26 1985-04-26 Pending JPS61179769U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6386985U JPS61179769U (en) 1985-04-26 1985-04-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6386985U JPS61179769U (en) 1985-04-26 1985-04-26

Publications (1)

Publication Number Publication Date
JPS61179769U true JPS61179769U (en) 1986-11-10

Family

ID=30594423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6386985U Pending JPS61179769U (en) 1985-04-26 1985-04-26

Country Status (1)

Country Link
JP (1) JPS61179769U (en)

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