JPS61179221A - ガラス・エポキシ銅張積層板 - Google Patents
ガラス・エポキシ銅張積層板Info
- Publication number
- JPS61179221A JPS61179221A JP1877385A JP1877385A JPS61179221A JP S61179221 A JPS61179221 A JP S61179221A JP 1877385 A JP1877385 A JP 1877385A JP 1877385 A JP1877385 A JP 1877385A JP S61179221 A JPS61179221 A JP S61179221A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- bisphenol
- resin composition
- copper
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 8
- 239000011521 glass Substances 0.000 title claims description 11
- 229910052802 copper Inorganic materials 0.000 title claims description 3
- 239000010949 copper Substances 0.000 title claims description 3
- 239000004593 Epoxy Substances 0.000 title abstract description 18
- 239000003822 epoxy resin Substances 0.000 claims abstract description 50
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 50
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 229920003986 novolac Polymers 0.000 claims abstract description 16
- 239000003054 catalyst Substances 0.000 claims abstract description 6
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 5
- 238000005253 cladding Methods 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract description 6
- 239000002966 varnish Substances 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 5
- 239000004744 fabric Substances 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 239000003365 glass fiber Substances 0.000 abstract 1
- 238000005470 impregnation Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1877385A JPS61179221A (ja) | 1985-02-04 | 1985-02-04 | ガラス・エポキシ銅張積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1877385A JPS61179221A (ja) | 1985-02-04 | 1985-02-04 | ガラス・エポキシ銅張積層板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61179221A true JPS61179221A (ja) | 1986-08-11 |
| JPS6360053B2 JPS6360053B2 (enrdf_load_stackoverflow) | 1988-11-22 |
Family
ID=11980950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1877385A Granted JPS61179221A (ja) | 1985-02-04 | 1985-02-04 | ガラス・エポキシ銅張積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61179221A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6346234A (ja) * | 1986-08-14 | 1988-02-27 | Sumitomo Bakelite Co Ltd | エポキシ樹脂積層板の製造方法 |
| JPS63125516A (ja) * | 1986-11-15 | 1988-05-28 | Matsushita Electric Works Ltd | エポキシ樹脂の製造方法 |
| JPS6469620A (en) * | 1987-08-19 | 1989-03-15 | Ciba Geigy Ag | Advanced epoxy resin and thermosetting composition containing the same |
| JPH06239963A (ja) * | 1993-02-18 | 1994-08-30 | Mitsui Petrochem Ind Ltd | 積層板用エポキシ樹脂組成物 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5879011A (ja) * | 1981-10-19 | 1983-05-12 | チバ−ガイギ−・アクチエンゲゼルシヤフト | 前駆した固体状エポキシ樹脂 |
| JPS61148226A (ja) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | 塗料用及び積層板用固体状エポキシ樹脂 |
-
1985
- 1985-02-04 JP JP1877385A patent/JPS61179221A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5879011A (ja) * | 1981-10-19 | 1983-05-12 | チバ−ガイギ−・アクチエンゲゼルシヤフト | 前駆した固体状エポキシ樹脂 |
| JPS61148226A (ja) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | 塗料用及び積層板用固体状エポキシ樹脂 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6346234A (ja) * | 1986-08-14 | 1988-02-27 | Sumitomo Bakelite Co Ltd | エポキシ樹脂積層板の製造方法 |
| JPS63125516A (ja) * | 1986-11-15 | 1988-05-28 | Matsushita Electric Works Ltd | エポキシ樹脂の製造方法 |
| JPS6469620A (en) * | 1987-08-19 | 1989-03-15 | Ciba Geigy Ag | Advanced epoxy resin and thermosetting composition containing the same |
| JPH06239963A (ja) * | 1993-02-18 | 1994-08-30 | Mitsui Petrochem Ind Ltd | 積層板用エポキシ樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6360053B2 (enrdf_load_stackoverflow) | 1988-11-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2008032383A1 (en) | Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board | |
| JP4830748B2 (ja) | 難燃性エポキシ樹脂組成物、樹脂フィルム、プリプレグ及び多層プリント配線板 | |
| JP2010254819A (ja) | エポキシ樹脂組成物、プリプレグ、積層板、および多層板 | |
| JP2512762B2 (ja) | 多層プリント配線用基板 | |
| JPS61179221A (ja) | ガラス・エポキシ銅張積層板 | |
| JPH0959346A (ja) | 積層板用エポキシ樹脂組成物 | |
| KR20170005506A (ko) | 동박 적층판용 접착제 | |
| JP2000169605A (ja) | 積層板用プリプレグシ―トおよびその製造法 | |
| JP2002088175A (ja) | プリプレグ及び積層板 | |
| JP4496591B2 (ja) | エポキシ樹脂組成物、これを用いたプリプレグ及び積層板 | |
| JPH0329247B2 (enrdf_load_stackoverflow) | ||
| JP2006028201A (ja) | 難燃性エポキシ組成物並びにプリプレグ、積層板及びプリント配線板 | |
| JPH08148836A (ja) | 多層フレックスリジット配線板 | |
| JP2000336242A (ja) | エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔、積層板 | |
| JP2002241521A (ja) | エポキシ樹脂プリプレグ、エポキシ樹脂銅張板、エポキシ樹脂回路基板及びエポキシ樹脂多層回路基板 | |
| JP2000273411A (ja) | 絶縁接着剤シート、銅はく付き絶縁接着剤シート及び多層プリント配線板 | |
| JP3828117B2 (ja) | フレキシブルプリント配線板用熱硬化性接着シート | |
| JP2005243830A (ja) | プリント配線板 | |
| JPH10313174A (ja) | 多層フレックスリジッド配線板の製造方法 | |
| JPH0423654B2 (enrdf_load_stackoverflow) | ||
| JPH05286074A (ja) | 銅張積層板 | |
| JP2000265039A (ja) | エポキシ樹脂組成物、フィルム状接着剤及び接着剤付き銅はく | |
| JPS62140838A (ja) | 多層プリント板 | |
| JPS59170115A (ja) | 難燃性液状エポキシ樹脂組成物およびそれを用いる電気用積層板の製造法 | |
| JPS6195934A (ja) | 銅張積層板 |